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1、资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。电子英语证书考试(PEC)- 半导体工艺词汇AAbrupt junction突变结Accelerated testing加速实验Acceptor受主Acceptor atom受主原子Accumulation积累、堆积Accumulating contact积累接触Accumulation region积累区Accumulation layer积累层Active region有源区Active component有源元Active device有源器件Activation激活Activation energy激活能Active reg
2、ion有源 ( 放大 ) 区Admittance导纳Allowed band允带Alloy-junction device合金结器件Aluminum(Aluminium)铝Aluminumoxide 铝氧化物资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。Aluminum passivation铝钝化Ambipolar双极的Ambient temperature环境温度Amorphous无定形的 , 非晶体的Amplifier功放 扩音器放大器Analogue(Analog) comparator模拟比较器Angstrom埃Anneal 退火Anisotropic各向异性的Ano
3、de 阳极Arsenic (AS)砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown雪崩击穿Avalanche excitation雪崩激发BBackground carrier本底载流子Background doping本底掺杂Backward反向Backward bias反向偏置Ballasting resistor整流电阻资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。Ball bond球形键合Band 能带Band gap 能带间隙Barrier势垒Barrier layer势垒层Barrier width
4、势垒宽度Base基极Base contact基区接触Base stretching基区扩展效应Base transit time基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch双向开关Binary code二进制代码Binary compound semiconductor二元化合物半导体Bipolar双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band阻挡能带Bl
5、ocking contact阻挡接触资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。Body - centered体心立方Body-centred cubic structure体立心结构Boltzmann波尔兹曼Bond 键、 键合Bonding electron价电子Bonding pad键合点Bootstrap circuit自举电路Bootstrapped emitter follower自举射极跟随器Boron 硼Borosilicate glass硼硅玻璃Boundary condition边界条件Bound electron束缚电子Breadboard模拟板、实验板
6、Break down击穿Break over转折Brillouin布里渊Brillouin zone布里渊区Built-in内建的Build-in electric field内建电场Bulk体 /体内Bulk absorption体吸收Bulk generation体产生资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。Bulk recombination体复合Burn - in老化Burn out烧毁Buried channel埋沟Buried diffusion region隐埋扩散区CCan 外壳Capacitance电容Capture cross section俘获截面C
7、apture carrier俘获载流子Carrier载流子、载波Carry bit进位位Carry-in bit进位输入Carry-out bit进位输出Cascade 级联Case 管壳Cathode 阴极Center 中心Ceramic陶瓷 ( 的 )Channel 沟道Channel breakdown沟道击穿资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。Channel current沟道电流Channel doping沟道掺杂Channel shortening沟道缩短Channel width沟道宽度Characteristic impedance特征阻抗Charge
8、 电荷、充电Charge-compensation effects电荷补偿效应Charge conservation电荷守恒Charge neutrality condition电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动 /交换 /共享/转移 /存储Chemmical etching化学腐蚀法Chemically-Polish化学抛光Chemmically-MechanicallyPolish (CMP)化学机械抛光Chip 芯片Chip yield芯片成品率Clamped箝位Clamping diode箝位二极管Cleav
9、age plane 解理面Clock rate时钟频率Clock generator时钟发生器Clock flip-flop时钟触发器资料内容仅供您学习参考，如有不当或者侵权，请联系改正或者删除。Close-packed structure密堆积结构Close-loop gain闭环增益Collector集电极Collision碰撞Compensated OP-AMP补偿运放Common-base/collector/emitterconnection共基极 /集电极 / 发射极连接Common-gate/drain/source connection共栅 /漏/源连接Common-mode
10、gain共模增益Common-mode input共模输入Common-mode rejection ratio (CMRR)共模抑制比Compatibility兼容性Compensation补偿Compensated impurities补偿杂质Compensated semiconductor补偿半导体Complementary Darlington circuitComplementaryMetal-Oxide-Semiconductor互补达林顿电路Field-Effect-Transistor(CMOS) 互补金属氧化物半导体场效应晶体管Complementary error function余误差函数Computer-aideddesign(CAD)/test(CAT)/manufacture(CAM)计