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1、OLED TechnologyDavid HsiehContents OLED Development Status Key Milestone Resolution vs. Size AM and PM Development Display Materials Status : Polymer vs. Small Molecule Efficiency Progress Lifetime Progress Tech. Status of OLED Color patterning Pending Issues in OLED Out-coupling Efficiency Lifetime
2、 Differential Aging LTPS Non-Uniformity for AMOLEDConclusionOLED Develooment Status Key Milestone of OLED Development1995199920002002Pioneer, PM-95一甲-sse - siPioneer, PM, 4 AreaColor-99Motorola CellularPhone -00Sony 13 SVGAAMOLED -01CDT-Seiko Epson 25 AMPLED-005.7PM-OELDldemistu-97Sanyo-Kodak24 AMOL
3、ED-99Samsung 15 XGAAMOLED -01Kodak Digital Camera-03Chi-Mei & IBM 20 WXGA a-SiAMOLED -03OLED Develooment Status PM Commercialized DisplaysPM Mobile Phone (Small Molecule)6工4G；、2 093.Motorolla (Pioneer)Samsung (SNMD)LG (Pioneer)OLED Development Statusin Next Product Samsung NEC Mobile Display (SNMD)
4、PM OLED Productsin Current Product 1.1H 94x 64 Dots, 256 Color Anycall (SEC) Sub Display Mass Production from 2002. JulyAoDlications of OLED* S/M : Small Molecjle Next Step Cell phones (main display) PDAs Small video (DVC,DSC)MobileFull ColorPM OLEDMobile S/M*AM OLEDLarge S/M*)，Polymer / AM OLEDFlex
5、ible PolymerAM OLEDMobile MonoPM OLED Now & Near-term Cell phones (sub display) Auto displays audio, meters, appliances Final & Long Term Mobile Applications (Flexible) MonitorsTVsPassive Matrix Displays: Process Flow(380x470 1 glassITOCr panels start )Glass Clean &BakeAZ5214 Bus Metal PR Coat & Bak
6、e*Bus Metal PR Thickness (1.7 pm)Bus Resist Expose (Mask #DBus Resist Develop4Bus CD & InspectBus Etch and Inspect4Bus PR Strip. Inspect & CDDehydration BakeA.LITO PR Coat and Bake 4ITO PR Thickness (1.7 pin )ITO Resist Expose (Mask # 2) 4ITO Resist Develop 4ITO CD and Inspect,prITO Etch and Inspect
7、 4ITO PR Strip, Inspect & CD 4Dehydration Bake 4AZ5206-E Base PR Coat and Bake 4Base PR Thickness (0.6 Ri】)JBase Resist Expose (Mask #3)Base Resist DevelopBase CD and Inspect4Base Cure-Hot PlateAZ5214 Pillar PR Coat & BakePillar PRPillar PRThickness Expose(1.7- 3.7 pin )(Mask # 4) Pillar PR Post k C
8、ontinueExposure Bake z_-Passive Matrix Displays: Process Flow (continued)Pillar PR FloodExposurePillar PRDevelopPillar CD andInspectElectron Transport Layer(2 mins)4Electron Injection Layer (0.83 min)4Cathode (0.83 mins)4EncapsulationCover CleanDesiccantDispenseA登ASeal Epoxy Dispense4LaminationUV Cu
9、re4Post Cure BakeScribe & Break to final size.Probe Test: O/S,Log Jrb, Lum,CIEAssemblyFinal Test.Outgoing QCSample: Aging/Fade TestShipProcess Specifications: PhotoSubstrates: GlassITOMo-Ta Glass: 380 x 470, 0.7 IW.03 mm, no visible defects under 10 K lux ITO: 20-30 Ohms/square, 750 HJ75 A, 85% Tran
10、smission at 400 to 760 nm,Roughness 50 A, Max. Peak Height 200 A. Bus Metal: 95% (zone sublimed/purified) Metals: Purity 90%Encapsulation Epoxy Seal: + 0.5 Water absorption when boiled for two hrs, less than 5.0 g/m2 water permeability for 24 hrs, 40 |ig/g outgas trapping 120 C x 15 mins.Facility: C
11、lass 100 Clean RoomITO: The minimum gap between ITO conductors shall be 12.5 pm, the minimum leakage resistance between neighboring ITO lines shall be 1 Mohm.Base: Thickness: 0.5 to 0.6 pm 12 (VGA) to 4 pm (mono) Spin Speed 3000 RPM Soft Bake 90 / 90 secs Hard Bake 250 / 200 secsPillar: Thickness 4
12、|im 8 (VGA) to 12 |im (mono) Spin Speed 3000 RPM Retrograde Angle -45/70 Minimum linewidth at 45 / 70 C - 12/8(im UV Cure 90 mJ/cm2, 200 to 400 nm / 90 secs 110Process Specifications: Thin FilmsVacuum Levels: Buffer Chamber1E-6 Torr Organic Chamber(s)5E-7 Torr Electrode6E-6 Ton,Deposition Rates/T em
13、peratures: Organics2 - 4 A/sec / 270 - 500 Dopants0.05 -0.1 A/sec / 270 -500 Electrode0.1 &20 A/sec/ 500 -1000Thickness Uniformity: Organics 100HUO% Electrode 100HUO%Device Structures: ITO HI HTL Host: Dopant ETL EIL Cathode, where HI: IDE406 or CuPC HTL : IDE320 or HT2 Green/Red Host: A1Q3, Blue Ho
14、sts: KBH or IDE 120 Dopants: KBD, or IDE 102 (B), C545T (G), DCJTB or Pl (R) ETL: A1Q3 EIL : LiF or Al:Li, 0.5 to 20 nm Cathode: Al, 70 to 150 nmPillar Process(b)ribVI VI VI T1substrate(d)OLED Materials Status(0.65, 0.35)(0.16, 0孙.NTSCRGB0.K. 0.0CIE 1931 Chromaticity Diagram56 300 cd/m223 300 cd/m21
15、2-13 600 cd/m256 200 cd/m214-15 300 cd/m25-6 300 cd/m22022 600 cd/m2 Efficiency Status of Small Molecule0.60, 0.38Red0.64, 0.36Green0.30,0.65Blue0.14,0.140.61,0.38Redc“ 八“0.65, 0.35Green0.27,0.63Condition : Extension of Current Tech.: Linear Source, Moving or Multi-Source Technology New Approach : O
16、VPD, DSPUniformity may not be a serious Issue Ink-jet Printing Technology:Simple Process, Small Usage of Material Performance Degradation after Printing (Ink Formulation Issues) Repeatability of Ink-Jet Printing (Blocking of Head, Volume Variation),Non-Uniformity of LEP Film (Non Homogeneous Edges i
17、n Pixels )Glass SubstrateSubstrate: Top View Laser Induced Thermal Imaging Technology (LITI) :High Resolution, Multi-Layer Stacking Capability, Possible Small Molecule & Polymer Hybrid OLED Performance Degradation after Printing (Blending Issues) Uniform Film Roll Coating Sensitive Process to Partic
18、le Contamination LITI Hybrid OLEDLITI Hybrid 22 AMOLED Comparison of Aperture Ratio for Various Color Patterning Tech.Possible High Aperture Ratio in AMOLED,But It Depends on Color Patterning Methods!ItemsEvaporation (Precision Shadow Mask)Ink-Jet PrintingLITIMaterialsSmall Molecule (SM)Polymer (LEP
19、)Po ymer (LEP) Hybrid (Polymer/SM)Patterning AccuracyU20碉WJ5碉U2.5 碉Resolution130Ppi150PpiPendina Issues in OLED Out-Coupling Efficiency Improvement Optical Out-Coupling Efficiency Improvement(Loss of Optical Output due to Optical Guiding Effect) =Eliminate Internal Reflection Approaches/ 1D/2D Grati
20、ng/ Shaped Glass or High Index Glass(n=1.85, Schott SFL57):50% up/ Aerogel/Sol-gel Tech.:60% up/ Ordered Micro-lens Array:50% upJ八Cathode1D/2DGratingShaped GlassAerogel/sol-gelMicro-lens Array Photonic Crystal Results/ External Q,E. Improvemento Best Results:Up to 70%(Green) Improvement at the Front
21、 LightBlue-Nano 4 Photonic Crystal Results (Test Coupon)NormalTest CouponG: 78 cd/m2 100mAG: 134 cd/m2 100mAPhotonic CrystalTest Coupon Lifetime Differential Aging Problem/ Image Burning份 Improvement of OLED Lifetime Development of Avoiding Driving Tech./ White Balance Shift: Yellowish Problemo Requ
22、ired the Same Lifetime of RGBImage LTPS non-Uniformity Issues/ ELA Non-uniformity电 Improvement of ELA Beam UniformityO Compensation Pixel Circuit4 NonELA Crystallization is under the DevelopmenLcScan Line(n)A05.Jfc Anode VLltl Lk kData Line1一%口phVScan Lin9(n-1) 4elVth VariAtinn7 Galhod0 vtData Linei
23、 Anode VcsiLMlLPzr2elszScan Line2 Cathode V Aperture Ratio Issues Aperture Ratio of AM OLEDTop Emission Provides Higher Aperture Ratio Low Aperture Ratio Decreases the OLED Lifetime So Much.2TR bottom emitting4TR bottom emitting 4TR top emitting3st Generation Deposition EquipmentZeldaEML/ ETLCathode
24、HTLPretreatmentNEW ZELDAInverterHTL/ HTLModuleEML/ ETLModuleCathodeModuleEncapsulation Basic design concept1. Sheet to sheet process (same as LCD?)2. I sol ate device from humidity and oxygen3. Absorb the humidity into the cell Key considerations1. I nner pressure release - mechanical & dispenser2.
25、Capability of desiccant - How long can it works?3. Mechanism - Physical absorption or Chemical reaction.4. Minimize the humidity and oxygen penetrates -seal material and cell gap control5. Dry and oxygen free environmentMechanical Design of Encapsulationy早XPressurePress PlateSubstrateAlignment CCDQu
26、artz PlateUVTesting Basic design concept.1. To differentiate good and defective ones before I C bonding2. To make sure brightness lifetime(to extend not to shorten)3. To make sure no defect found after sell to customers Key considerations1. Simulated driving single input when test to make sure corre
27、ct inspection.2. Burn-in process design to make the device brightness decay rate smoother - high temperature needed3. Reliability test under high temperature and high humidity to simulate the failure mode.TestingLight On TestProcessBurn-in Process80x48Mono TABSub displaySub-Display for Mobile80x484
28、Area colorTABSub displayMonochromeArea Color SeriesRxolullon:8OX4S96x391 2-AC COG .96x16Mono COG Sub displayI Sub displayPhone inI96x3x64 (A)42x3x644K full color COG Sub display96x3x6465k Full color TAB Sub display!256 Full colorITAB Sub displayRiTdispI 髀. MBS MM MM I96x3x64 (A)!262k Full color IICO
29、F： Sub display . IFull color series High color seriesConclusion OLED Manufacturing is Being Matured for Small Size Mobile Application. Long Life OLED Performance is very Essential to Meet Lifetime Requirements of Various Application. Image Burning & White Balance Shift L TPS non-Uniformity is Still
30、a Problem for AM OLED Design. Low Aperture Ratio Required Vth Compensation Driving Scheme Significant Improvement of OLED Technologies is Progressing.Phosphorescent OLED, OLED Material ImprovementOptical Out-coupling Improvement, Top Emission OLED Shadow Mask Color Patterning is Seen as a Key Bottle Neck. Required a New Color Patterning Tech, such as LITI