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1、科学研究方法与实践,北京大学信息科学技术学院 School of Electronics Engineering and Computer Science Peking University August 11, 2019,第八讲：专业期刊、会议 介绍及论文投稿, 微电子学专业,Two topics to address: How to do high quality research How to get high publication counts,Motivation,On the other hand Good research work may not result in publ
2、ication in top journals/conferences Tactics play a significant role to get a work published,Outline,一、北京大学微电子学专业研究生 培养发表论文标准 二、微电子学专业相关期刊、会议 举例介绍 三、关于论文投稿,数量标准,质量标准 (1a),北京大学信息学院认可的微电子学与固体电子学期刊目录 A类期刊（1） Nano Letters (9.960) Lab on a Chip (5.821) Applied Physics Letters (3.977) Nanotechnology (3.037
3、) IEEE Electron Device Letters (2.716) Journal of Microelectromechanical Systems, IEEE (2.659) Biomedical Microdevices (2.551) Journal of the Electrochemical Society (2.387) Journal of Micromechanics and Microengineering (2.321) IEEE Transactions on Electron Devices (2.052) IEEE Transactions on Micr
4、owave Theory and Techniques (2.027) Electrochemical and Solid-State Letters (2.009) IEEE Journal of Solid-State Circuits (2.002) IEEE Transactions on Nanotechnology (1.909) Sensors and Actuators A/B (1.434/2.331),质量标准 (1b),北京大学信息学院认可的微电子学与固体电子学期刊目录 A类期刊（2） Thin Solid Films (1.666) Semiconductor Scie
5、nce and Technology (1.586) IEEE Microwave and Wireless Components Letters (1.424) IEEE Transactions on Circuits and Systems I - Fundamental Theory and Applications (1.139) Electronics Letters (1.063),质量标准 (2),微电子学与固体电子学方面其它高水平期刊 Journal of Applied Physics (2.316) Smart Materials and Structures (1.51
6、) Chinese Physics (1.497) Microelectronic Engineering (1.398) Chinese Physics Letters (1.135) Solid-State Electronics (1.159) IEEE Journal of Sensors (1.117) IEEE Transactions on Circuits and Systems ii Analog and Digital Signal Processing (0.922) Microsystem Technologies (0.673) ACTA MECHANICA SINC
7、A (机械学报) (0.605) Microwave and Optical Technology Letters (0.568) IEICE Transactions on Electronics (0.508) Science In China Series E/F (0.328/0.454) Chinese Journal of Electronics (0.185) 半导体学报 电子学报（中、英文版） 计算机学报（中、英文版）,质量标准 (3a),其它相关高水平期刊（1） Biosensors and Bioelectronics (4.132) IEEE Photonics Tech
8、nology Letters (2.353) Journal of Physics D (2.077) IEEE Transactions on Biomedical Engineering (2.302) Solid State Communication (1.556) Journal of Electronic Materials (1.504) Journal of Vacuum Science & Technology A/B (1.394/1.597) Acta Physica Sinica (物理学报) (1.242) Japanese Journal of Applied Ph
9、ysics (1.222) IEEE Circuits & Devices (1.22) Microscale Thermophysical Engineering (0.962) IEEE Transactions on Magnetics (0.938) IEEE Transactions on Computer-Aided Design Of Integrated Circuits and System (0.838) Microelectronics Reliability (0.815) IEEE Transactions on Dielectrics and Electrical
10、Insulation (0.771) Journal of Infrared and Millimeter Waves (红外与毫米波学报) (0.755),质量标准 (3b),其它相关高水平期刊（2） IEEE Transactions on Consumer Electronics (0.727) International Journal of Circuit Theory and Applications (0.686) Microelectronics Journal (0.651) Sensors and Materials (0.585) International Journa
11、l of Electronics (0.459) Journal of Materials Science & Technology (材料科学技术) (0.384) Solid State Technology (0.293) Analog Integrated Circuits and Signal Processing (0.277) Electrical Engineering (0.068),质量标准 (4),其它相关中文期刊 光学学报 北大学报 固体电子学研究与进展 材料研究学报 通信学报 激光与红外 仪器仪表学报 测试技术学报 机械工程学报 功能材料与器件学报 压电与声光 中国机
12、械工程 传感技术学报,质量标准 (5),北京大学信息学院认可的微电子学与固体电子学会议目录 A类会议（1） International Electron Devices Meeting (IEDM) International Solid-State Circuits Conference (ISSCC) IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS Conference) International Conference on Solid State Sensors, Actuator
13、s and Microsystems (Transducers) Symposium on VLSI Technology (VLSI) mTAS Custom Integrated Circuits Conference (CICC) The European Solid-State Device Research Conference / The European Solid-State circuits Research Conference (ESSDERC/ESSCIRC) International Conference on Simulation of Semiconductor
14、 Process and Devices (SISPAD) Design Automation Conference (DAC) International Test Conference International Conference on Computer-Aided Design,量化标准 (6),微电子学与固体电子学方面其它高水平会议 International Reliability Physics Symposium SISPAD SSDM ICSICT IEEE Sensors Confernce Europe Sensors,Outline,一、北京大学微电子学专业研究生 培
15、养发表论文标准 二、微电子学专业相关期刊、会议 举例介绍 代表性学术期刊 代表性学术会议 三、关于论文投稿,EDL vs. T-ED (1),A big portion of EDL submission is rejected and transferred to T-ED as brief report due to Not enough novelty Not enough interest Not in right size & format Not in good timing Howeveranother route to publish,IEEE Electron Device
16、Letters was one of the most-cited journals, ranking number ten/fifteen (in 2003/2004) in electrical and electronics engineering, according to the annual Journal Citation Report (2003/2004 edition) published by the Institute for Scientific Information.,IEEE Transactions on Electron Devices was the nu
17、mber eighteen most-cited journal in electrical and electronics engineering in 2003, according to the annual Journal Citation Report (2003 edition) published by the Institute for Scientific Information.,EDL Winning Tactics Novelty/originality Timing Stay in focus References Always include all related
18、 papersThe author could be one of your reviewers! Failing factors Not new Already published somewhere else Too broad discussion Too long Too many figures Major reference not cited,EDL vs. T-ED (2),JSSC,Contributed papers may be of a tutorial or research nature, but the latter must be original and mu
19、st not duplicate descriptions or derivations available elsewhere. This JOURNAL publishes papers of broad interest in the area of solid-state circuits, which may be digital, analog, microwave, or optoelectronic in nature: integrated circuits and large scale integration are of principal interest. Incl
20、uded are the design, testing and application of circuits and subsystems, as well as closely related topics in device technology and circuit theory. The subject matter should therefore relate to the analysis, design, and performance of solid-state circuits that may contain combinations of transistors
21、, diodes, bulk-effect devices, and magnetic devices, etc.,EL, T-MTT, JQE, SSC, SSE, TSF,IEEE Journal of Quantum Electronics was the number four most-cited journal in electrical and electronics engineering in 2004, according to the annual Journal Citation Report (2004 edition) published by the Instit
22、ute for Scientific Information.,JMEMS, JMM, SNA, SNB,IEEE/ASME Journal of Microelectromechanical Systems was the number eight/nine (in 2003/2004) most-cited journal in electrical and electronics engineering, according to the annual Journal Citation Report (2003/2004 edition) published by the Institu
23、te for Scientific Information.,APL vs. JAP,Weekly prompt publication of up-to-date work bearing on applications of physics to all branches of science, engineering, and modern technology,Two issues per month,CPL, CP,Top Cited Journals for Five Technology Categories (# Science References from 1983-200
24、2 Patents to Journal Articles),Top Cited Journals for Five Technology Categories (# Science References from 1983-2002 Patents to Journal Articles),Top Cited Journals for Five Technology Categories (# Science References from 1983-2002 Patents to Journal Articles),Top Cited Journals for Five Technolog
25、y Categories (# Science References from 1983-2002 Patents to Journal Articles),Top Cited Journals for Five Technology Categories (# Science References from 1983-2002 Patents to Journal Articles),IEDM (1),IEEE International Electron Devices Meeting is the annual technical meeting of Electron Devices
26、Society. Over the last 54 years, the IEEE/IEDM has been the worlds primary forum for reporting breakthroughs in the broadest cross-section of technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors
27、and memories to novel displays and imagers from compound semiconductor materials to nanotechnology devices and architectures from micromachined devices to smart-power technologies, etc.,The top technical forum in electron devices Annual “get-together” event for the community Papers from industry, un
28、iversities, and national labs all around the world Wide spectrum of devices (electronics, photonics, MEMS, etc.) Very strict paper selection process,IEDM (2),8 Sub-areas CMOS Devices CMOS and Interconnect Reliability Detectors, Sensors and MEMS Integrated Circuits and Manufacturing Modeling and Simu
29、lation Process Technology Quantum Electronics and Compound Semiconductors Solid-State and Nanoelectronic Devices,Increased participation in the areas of nanotechnology, MEMS, molecular electronics, and optoelectronic devices is desired.,IEDM (3a),IEDM Winning Tactics Stay in the right timing Assembl
30、e your selling points Pay attention to details Submit to the “right” sub-area IEDM Winning Strategy Build up your groups reputation Stay in the leading-edge Focus on certain areas (one or two) Continued “commitment-to-excellence” Major Reasons for Rejection Not new Not interest enough to IEDM Not en
31、ough process data (hide!) Not good enough device I-V curve Lousy title Poor figures or format And, ,IEDM (3b),Three Most Important Factors Selling points Paper title Figures & images Selling Points: Eyeball Stopper A winning paper has several “eyeball stoppers” in different places Something new Good
32、/unique explanation Nice figures/TEM images Innovative approach Leading-Edge Data Best I-V data Thinnest EOT for high-k Highest mobility for strain-Si Aggressively scaled device New device & process concept Abstracts for review must clearly state The purpose of the work The manner and degree to whic
33、h it advances the art Specific new results that have been obtained and their significance,IEDM vs. EDL,IEDM Comprehensive report (major report) Once a year EDL Well focused (narrow topic) Quick report (timely progress) Can I submit a paper to both IEDM & EDL? Absolutely no EDL submission before IEDM
34、 IEDMs policy Committee member objection OK to submit EDL after IEDM Not just simply a “sub-set” of IEDM figures! Some new data/figures included!,ISSCC (1),The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and Systems-
35、on-a-Chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design to maintain technical currency, and to network with leading experts.,ISSCC (2),Original papers are solicited in subject areas including, but not limited to, the following: ANALOG DATA CONVERT
36、ERS HIGH-PERFORAMNCE DIGITAL IMAGERS, MEMS, MEDICAL & DISPLAYS LOW-POWER DIGITAL MEMORY RF TECHNOLOGY DIRECTIONS WIRELESS WIRELINE,ISSCC (3),The ISSCC 2008 Conference theme is “System Integration for Life and Style” The ISSCC 2007 Conference theme is “The 4 Dimensions of IC Innovation” The 2006 Conf
37、erence theme is “Multimedia for a Mobile World” The 2005 Conference theme is “Entering the Nano-Electronic Integrated-Circuit Era”,IEEE MEMS Conference (1),Reflecting the rapid growth of the MEMS field and the commitment and success of its research community, the IEEE MEMS Conference series has evol
38、ved into a premier annual event in the MEMS area. In recent years it has attracted over 600 participants and has presented more than 215 select papers in non-overlapping oral and poster sessions. Despite its size, it has remained committed to a single-session format, thus favoring the strong interac
39、tion of attendees among each other and with exhibitors. IEEE-MEMS conference does not accept papers published at other international conferences or journals. If your paper is published before November 1, ? at any international conference or journal and if it does not contain substantially new inform
40、ation, your contribution will be withdrawn automatically. This will happen even if you have been notified about abstract acceptance before!,IEEE MEMS Conference (2),The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to: Design
41、, simulation and analysis tools with experimental verification Fabrication technologies and processes Silicon and non-silicon materials Electro-mechanical integration techniques Assembly and packaging approaches Metrology and operational evaluation techniques System architecture The major areas of a
42、ctivity in the application of MEMS solicited and expected at this conference include but are not limited to: Mechanical, thermal, and magnetic sensors and actuators, and systems Opto-mechanical microdevices and microsystems Fluidic microcomponents and microsystems Microdevices for data storage Micro
43、devices for biomedical engineering Micro chemical analysis systems Microdevices and systems for wireless communication Microdevices for power supply and energy harvesting Nano-electro-mechanical devices and systems Scientific microinstruments,IEEE MEMS Conference (3a),Paper Classification List (1):
44、Design, Analysis, and Theoretical Concepts with Experimental Verification Synthesis and analysis methods; design techniques for devices and systems; CAD tools; modelling approaches with experimental verification; theoretical concepts in sensing; actuation and system integration. Materials and Device
45、 Characterization New materials; known materials under new operating conditions; measurement of properties; calibration and compensation; failure analysis; degradation mechanisms and drift; reliability. Fabrication and Packaging Technologies Etching and deposition processes; 3-D fabrication, bonding
46、; process integration; surface modification; batch packaging; micro-assembly. Biomedical and Chemical Micro Sensors and Systems Micro-total-analysis systems; implantable devices; drug delivery; micro-PCR systems; chemical and biochemical sensors; microfluidic systems. Mechanical and Physical Micro S
47、ensors and Systems Inertial (accelerometers, gyroscopes, shock sensors); resonant; force, pressure, and shear; electromagnetic (non-optical); acoustic; thermal devices and systems.,IEEE MEMS Conference (3b),Paper Classification List (2): Actuators Mechanical actuators (electrostatic, thermal, acoust
48、ic, piezoelectric, magnetic, phase transition based); pumps, valves. Micro-Optical Devices and Systems Mirrors; gratings; switching arrays; beam and phase shaping devices; communication subsystems. Wireless Communication Micro Devices and Systems (non-optical) RF/millimeter wave/micro wave component
49、s; switches; filters; sensor network communication. Nanoelectromechanical Devices and Systems Carbon-nanotubes; molecular machinery; nanoelectronic devices with sensing applications; connection of nanoscale devices to the micro and macro world. Power MEMS & Energy Harvesting Microminiaturized fuel cells, power generators, microturbines, thrusters. Miscellaneous,IEEE MEMS06 Conference (4a),General,Acceptance Ratio: 30%,Papers by Regions,IEEE MEMS06 Conference (4b),Accepted Papers by Country/Territory,IEEE MEMS06 Conference (4c),IEEE MEMS06 Conference (4d),S