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1、ANSI INCITS 368-2003 for Information Technology Parallel Interconnect Performance (PIP) ANSI INCITS 368-2003 Copyright American National Standards Institute Provided by IHS under license with ANSI Licensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 02/18/2008 01:16:21 MSTNo reproducti
2、on or networking permitted without license from IHS -,-,- ANSI INCITS 368-2003 American National Standard for Information Technology Parallel Interconnect Performance (PIP) Secretariat Information Technology Industry Council (ITI) Approved June 5, 2003 American National Standards Institute, Inc. Abs
3、tract This standard defines the electrical measurement techniques and acceptable performance limits for vari- ous test parameters on the collection of wires, connectors, and circuits that form the electrical path be- tween SCSI devices. This document specifies the details of the measurement methodol
4、ogy to minimize the error in results from different electrical testing laboratories. Details are given at each stage of testing including calibration, fixturing and sample preparation. Copyright American National Standards Institute Provided by IHS under license with ANSI Licensee=IHS Employees/1111
5、111001, User=Japan, IHS Not for Resale, 02/18/2008 01:16:21 MSTNo reproduction or networking permitted without license from IHS -,-,- Approval of an American National Standard requires review by ANSI that the requirements for due process, consensus, and other criteria for approval have been met by t
6、he standards developer. Consensus is established when, in the judgement of the ANSI Board of Standards Review, substantial agreement has been reached by directly and materially affected interests. Substantial agreement means much more than a simple majority, but not necessarily unanimity. Consensus
7、requires that all views and objections be considered, and that a concerted effort be made towards their resolution. The use of American National Standards is completely voluntary; their existence does not in any respect preclude anyone, whether he has approved the standards or not, from manufacturin
8、g, marketing, purchasing, or using products, processes, or procedures not conforming to the standards. The American National Standards Institute does not develop standards and will in no circumstances give an interpretation of any American National Standard. Moreover, no person shall have the right
9、or authority to issue an interpretation of an American National Standard in the name of the American National Standards Institute. Requests for interpretations should be addressed to the secretariat or sponsor whose name appears on the title page of this standard. CAUTION NOTICE: This American Natio
10、nal Standard may be revised or withdrawn at any time. The procedures of the American National Standards Institute require that action be taken periodically to reaffirm, revise, or withdraw this standard. Purchasers of American National Standards may receive current information on all standards by ca
11、lling or writing the American National Standards Institute. American National Standard Published by American National Standards Institute, Inc. 25 West 43rd Street, New York, NY 10036 Copyright 2003 by Information Technology Industry Council (ITI) All rights reserved. No part of this publication may
12、 be reproduced in any form, in an electronic retrieval system or otherwise, without prior written permission of ITI, 1250 Eye Street NW, Washington, DC 20005. Printed in the United States of America CAUTION: The developers of this standard have requested that holders of patents that may be required
13、for the implementation of the standard disclose such patents to the publisher. However, neither the developers nor the publisher have undertaken a patent search in order to identify which, if any, patents may apply to this standard. As of the date of publication of this standard and following calls
14、for the identification of patents that may be required for the implementation of the standard, no such claims have been made. No further patent search is conducted by the de- veloper or publisher in respect to any standard it processes. No representation is made or implied that licenses are not requ
15、ired to avoid infringement in the use of this standard. Copyright American National Standards Institute Provided by IHS under license with ANSI Licensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 02/18/2008 01:16:21 MSTNo reproduction or networking permitted without license from IHS -
16、,-,- i Contents Page Foreword viii Introductionxii 1 Scope .1 2 References .2 2.1 Overview .2 2.2 Approved references .2 2.3 References under development 2 2.4 Informative references 2 3 Definitions .3 3.1 Terms 3 3.2 Acronyms 9 3.3 Symbols and abbreviations .9 3.4 Keywords 10 3.5 Conventions 11 3.6
17、 Specification of measurement equipment .11 4 Overview .13 4.1 General .13 4.2 Open vs. closed systems related to this standard .13 4.3 Structural considerations .13 4.3.1 SCSI interconnects 13 4.3.2 SCSI passive interconnect topology 14 4.3.3 Interconnect sub-assemblies, transition regions, and bul
18、k cable .14 4.3.4 Interconnect assemblies 14 4.3.5 Relationship between SE and DF in this document .15 4.4 Relationship between requirements on bulk cable and requirements on interconnect assemblies 15 4.5 Physical measurement points .15 4.6 Concatenated configurations 15 4.7 Interoperability points
19、 16 4.8 Constructions considered 16 4.9 Identification, constraints and loading requirements .17 4.9.1 Connector function identification 17 4.9.2 Constraints .17 4.9.3 Standard loads .18 4.9.3.1 Targets and initiators with no enabled terminator .18 4.9.3.2 Targets and initiators with enabled termina
20、tor 18 4.10 Nature of requirements .18 4.10.1 Measurements and tests 18 4.10.2 Performance levels and applications .18 4.10.3 Basic performance requirements for interconnect assemblies 19 4.10.3.1 Overview .19 4.10.3.2 Measurement conditions for non-precomp received signal quality requirements .20 4
21、.10.3.3 Measurement conditions for precomp received signal quality requirements 20 4.10.4 Deriving the launch signal requirements for this standard from the signal requirements in SPI-x .20 4.11 Local neighborhood concepts .21 4.12 Length specifications .21 4.13 S21 relationship among point to point
22、 and multidrop configurations .21 4.14 Accommodation of receiver compensation in interconnect requirements .22 Copyright American National Standards Institute Provided by IHS under license with ANSI Licensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 02/18/2008 01:16:21 MSTNo reproduc
23、tion or networking permitted without license from IHS -,-,- ii 4.15 Instrumentation and text fixture considerations .23 4.16 Signals covered by this standard 24 4.17 Error rate considerations .26 5 Summary bulk cable .27 6 Bulk cable samples, test fixtures and setups 29 6.1 Bulk cable samples and sa
24、mple preparation 29 6.1.1 Overview 29 6.1.2 Summary 29 6.1.3 Point to point bulk cable .30 6.1.3.1 Point to point bulk cable sample preparation (SP_Bulk_PP3) 30 6.1.3.2 Point to point bulk cable sample preparation (SP_Bulk_PP10) 30 6.1.3.3 Point to point bulk cable sample preparation (SP_Bulk_PP25)
25、30 6.1.4 Sample preparation for multi-drop bulk cable or printed circuit boards 30 6.1.4.1 Multi-drop bulk cable sample preparation (SP_Bulk_MD3) 30 6.1.4.2 Printed circuit boards sample preparation .31 6.2 Bulk cable and printed circuit board test fixture specifications 31 6.2.1 Overview 31 6.2.2 S
26、ummary 31 6.2.3 Test fixture (FIX_Bulk_1) .32 6.2.4 Test fixture (FIX_Bulk_2) .33 6.2.5 Test fixture (FIX_Bulk_3) .34 6.2.6 Test fixture (FIX_Bulk_4) .34 6.2.7 Printed circuit boards test fixture (FIX_PCB_1) .34 6.3 Bulk cable measurement equipment and setups 35 6.3.1 Summary 35 6.3.2 Set up (SET_Bu
27、lk_1) .36 6.3.3 Set up (SET_Bulk_2) .36 6.3.4 Set up (SET_Bulk_3) .37 6.3.5 Set up (SET_Bulk_4) .37 6.3.6 Set up (SET_Bulk_5) .38 6.4 STD calibration 38 7 Level 1 bulk cable tests 40 7.1 SE tests .40 7.2 Differential local impedance 40 7.2.1 Overview 40 7.2.2 Point-to-point bulk cable .40 7.2.2.1 Sa
28、mple preparation for point to point bulk cable .40 7.2.2.2 Test fixtures for point to point bulk cable .40 7.2.2.3 Measurement equipment and setup for point to point bulk cable 40 7.2.2.4 Calibration and verification procedure for point to point bulk cable .40 7.2.2.5 Test procedure and data output
29、format .41 7.2.2.6 Acceptable values for point to point bulk cable .42 7.2.3 Multi-drop bulk cable 42 7.2.3.1 Sample preparation for multi-drop bulk cable .42 7.2.3.2 Test fixtures for multi-drop bulk cable .43 7.2.3.3 Measurement equipment and setup for multi-drop bulk cable 43 7.2.3.4 Calibration
30、and verification procedure for multi-drop bulk cable .43 7.2.3.5 Test procedure and data output format for multi-drop bulk cable .43 7.2.3.6 Acceptable values for multi-drop bulk cable 44 7.2.4 Unpopulated printed circuit board (PCB) .44 7.3 Differential propagation time and propagation time skew .4
31、4 7.3.1 Overview 44 Copyright American National Standards Institute Provided by IHS under license with ANSI Licensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 02/18/2008 01:16:21 MSTNo reproduction or networking permitted without license from IHS -,-,- iii 7.3.2 Point-to-point bulk c
32、able .44 7.3.2.1 Sample preparation for point to point bulk cable .44 7.3.2.2 Test fixtures for point to point bulk cable .44 7.3.2.3 Measurement equipment and setup for point to point bulk cable 45 7.3.2.4 Calibration and verification procedure for point to point bulk cable .45 7.3.2.5 Test procedu
33、re and data output format for point to point bulk cable .45 7.3.2.6 Acceptable values for point to point bulk cable .46 7.3.3 Multi-drop bulk cable 46 7.3.3.1 Sample preparation for multi-drop bulk cable .46 7.3.3.2 Test fixtures for multi-drop bulk cable .46 7.3.3.3 Measurement equipment and setup
34、for multi-drop bulk cable 47 7.3.3.4 Calibration and verification procedure for multi-drop bulk cable .47 7.3.3.5 Test procedure and data output format for multi-drop bulk cable .47 7.3.3.6 Acceptable values for multi-drop bulk cable 47 7.3.4 Unpopulated PCB 47 7.4 Differential capacitance by calcul
35、ation 47 7.4.1 Overview 47 7.4.2 Differential capacitance by calculation for all constructions of bulk cable 47 7.4.3 Acceptable differential capacitance values for all constructions of bulk cable .48 7.5 Differential capacitance by frequency domain measurement .49 7.5.1 Point-to-point bulk cable .4
36、9 7.5.1.1 Sample preparation for point to point bulk cable .49 7.5.1.2 Test fixtures for point to point bulk cable .49 7.5.1.3 Measurement equipment and setup for point to point bulk cable 49 7.5.1.4 Calibration and verification procedure for point to point bulk cable .49 7.5.1.5 Test procedure and
37、data output format for point to point bulk cable .49 7.5.2 Multi-drop bulk cable 49 7.5.3 Unpopulated PCB 49 7.5.4 Acceptable differential capacitance values for all constructions of bulk cable .50 7.6 Differential insertion loss .50 7.6.1 Overview 50 7.6.2 Point-to-point bulk cable .50 7.6.2.1 Samp
38、le preparation for point to point bulk cable .50 7.6.2.2 Test fixtures for point to point bulk cable .50 7.6.2.3 Measurement equipment and setup for point to point bulk cable 50 7.6.2.4 Calibration, verification and measurement procedure for point to point bulk cable .50 7.6.2.5 Acceptable values fo
39、r point to point bulk cable .51 7.6.3 Multi-drop bulk cable 51 7.6.3.1 Overview .51 7.6.3.2 Sample preparation for multi-drop bulk cable .52 7.6.3.3 Test fixtures for multi-drop bulk cable .52 7.6.3.4 Measurement equipment and setup for multi-drop bulk cable 52 7.6.3.5 Calibration, verification and
40、measurement procedure for multi-drop bulk cable .52 7.6.3.6 Acceptable values for multi-drop bulk cable 52 7.6.4 Unpopulated PCB 52 7.7 Near end cross talk (NEXT) 52 7.7.1 Overview 52 7.7.2 Point-to-point bulk cable .54 7.7.2.1 Sample preparation for point to point bulk cable .54 7.7.2.2 Test fixtur
41、es for point to point bulk cable .54 7.7.2.3 Measurement equipment and setup for point to point bulk cable 54 7.7.2.4 Calibration and verification procedure for point to point bulk cable .54 7.7.2.5 Test procedure and data output format for point to point bulk cable .56 7.7.2.6 Acceptable values for
42、 point to point bulk cable .56 7.7.3 Multi-drop bulk cable 56 Copyright American National Standards Institute Provided by IHS under license with ANSI Licensee=IHS Employees/1111111001, User=Japan, IHS Not for Resale, 02/18/2008 01:16:21 MSTNo reproduction or networking permitted without license from
43、 IHS -,-,- iv 7.7.3.1 Sample preparation for multi-drop bulk cable .57 7.7.3.2 Test fixtures for multi-drop bulk cable .57 7.7.3.3 Measurement equipment and setup for multi-drop bulk cable 57 7.7.3.4 Calibration and verification procedure for multi-drop bulk cable .57 7.7.3.5 Test procedure and data
44、 output format for multi-drop bulk cable .58 7.7.3.6 Acceptable values for multi-drop bulk cable 59 7.7.4 Unpopulated PCB 59 8 Summary - interconnect assemblies 60 9 Interconnect assemblies samples, test fixtures, and setups 61 9.1 Interconnect assembly samples and sample preparation .61 9.2 Test fi
45、xtures for interconnect assemblies 61 9.2.1 Overview 61 9.2.2 Summary 61 9.2.3 Test fixture (FIX_ASY_1) .62 9.2.4 Test fixture (FIX_ASY_2) .63 9.2.5 Test fixture (FIX_ASY_3) .64 9.2.6 Test fixture (FIX_ASY_4) .64 9.3 Interconnect assembly measurement equipment and setups .65 9.3.1 Summary 65 9.3.2 S
46、et up (SET_ASY_1) .66 9.3.3 Set up (SET_ASY_2) .66 9.3.4 Set up (SET_ASY_3) .67 9.3.5 Set up (SET_ASY_4) .67 9.4 STD Calibration .68 10 Level 1 interconnect assembly tests .69 10.1 Differential impedance 69 10.1.1 Overview 69 10.1.2 Point-to-point interconnect assemblies 69 10.1.2.1 Test fixtures fo
47、r point to point interconnect assemblies 69 10.1.2.2 Measurement equipment and setup for point to point interconnect assemblies .69 10.1.2.3 Calibration and verification procedure for point to point interconnect assemblies 69 10.1.2.4 Test procedure and data output format for point to point intercon
48、nect assemblies 69 10.1.3 Multi-drop interconnect assemblies 69 10.1.3.1 Test fixtures for multi-drop interconnect assemblies .69 10.1.3.2 Measurement equipment and setup for multi-drop interconnect assemblies 69 10.1.3.3 Calibration and verification procedure for multi-drop interconnect assemblies
49、.70 10.1.3.4 Test procedure and data output format for multi-drop interconnect assemblies .70 10.1.4 Connectorized backplanes .70 10.1.5 Acceptable values for all constructions of interconnect assemblies 70 10.2 Differential propagation time and propagation time skew .70 10.2.1 Overview 70 10.2.2 Point-to-point interconnect assembli