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1、BRITISH STANDARD BS CECC 265001:1998 Harmonized system of quality assessment for electronic components Technology Approval Schedule: Film and hybrid integrated circuits ICS 31.180 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrol
2、led Copy, (c) BSI BS CECC 265001:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 July 1999 BSI 03-2000 ISBN 0 580 30852 9 National foreword This Bri
3、tish Standard reproduces verbatim CECC 265001:1998 and implements it as the UK national standard. This schedule is part of the BS EN 165000 series of standards The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductor devices, to Subcommittee EPL/47/1, Film a
4、nd hybrid integrated circuits, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and Europe
5、an developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Stan
6、dards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible
7、for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, pages 2 to 30 and a back cover. This standard has been upda
8、ted (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No.DateComments Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:0
9、0 2006, Uncontrolled Copy, (c) BSI BS CECC 265001:1998 BSI 03-2000i Contents Page National forewordInside front cover Foreword2 Text of CECC 2650015 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 0 blank Licen
10、sed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI TECHNOLOGY APPROVAL SCHEDULE CECC 265001 September 1998 Technology Approval Schedule: Film and hybrid integrated circuits Up-to-date lists and bibliographical referenc
11、es of other Technology Approval Schedules may be obtained on application to the Central Secretariat or to any CENELEC member. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembou
12、rg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels
13、1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members Ref. No. CECC 265001:1998 E Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 265001:1998 BSI 03
14、-2000 2 Foreword This Technology Approval Schedule was prepared under the auspices of CENELEC/TC CECC/SC 47AX, Film and hybrid integrated circuits. The original text was formulated by members of the UK ONS and the current owner of the document is: The Secretary of BSI sub-committee EPL/47/1 who may
15、be contacted at: British Standards Institution Electrical, Fire and Health Department 389 Chiswick High Road London W4 4AL England Tel: 0181 996 9000 It is based, wherever possible, on Publications of the International Electrotechnical Commission and International Standards Organization, and in part
16、icular, on ISO 9000. The text of this TAS was circulated to the CECC for acceptance in accordance with clause 2.10 of CECC 00111-VIII (RP11-8). Contents Page Foreword2 Introduction5 1General5 1.1Scope5 1.2Related documents5 1.3Units, symbols and terminology6 1.4Standard and preferred values6 1.5Defi
17、nitions6 2Definition of the circuit technology7 2.1Scope7 2.2Description of activities and flowcharts8 2.3Technical abstract8 3Circuit design9 3.1Scope9 3.2Description of activities and flowcharts9 3.3Interfaces9 4Film substrate manufacture9 4.1Scope9 4.2Description of activities and flowcharts 10 4
18、.3Materials, inspection and handling10 4.4Equipment10 4.5Rework10 4.6Validation and control of the process(es) 11 4.7Subcontractors11 5Assembly11 5.1Scope11 5.2Description of activities and flowcharts 11 5.3Materials, inspection and handling12 5.4Equipment12 5.5Rework12 5.6Validation and control of
19、the process(es) 13 5.7Subcontractors13 6Testing13 6.1Scope13 6.2Description of activities and flowcharts 13 6.3Equipment13 6.4Test procedures14 6.5Interfaces14 7Verification14 7.1Process boundary verification14 7.2Product verification15 7.3Initial demonstration programme15 Licensed Copy: London Sout
20、h Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 265001:1998 BSI 03-20003 Page 8Process characterization16 8.1Identification of process characteristics 16 8.2Description of activities16 9Packaging and shipping17 9.1Description of
21、 activities and flowcharts 17 9.2Interfaces17 9.3Validity of release17 10Withdrawal of technology approval18 Annex A Example Abstract Description of Technology Approval26 Annex B Guidance on the preparation of a manufacturers Technology Approval Declaration Document (TADD) for Film and Hybrid Integr
22、ated Circuits26 B.1General26 B.1.1Scope26 B.1.2Introduction and use27 B.1.3Related documents27 B.2Contents of the TADD27 B.2.1Introductory pages27 B.2.2Operational infrastructure27 B.2.3Description of the Technology and Processes28 B.2.4Definitions of relevant sites and operations28 B.2.5Process Cap
23、ability Plan29 B.2.6Test vehicles29 B.2.7Internal audit programme29 B.2.8Demonstration plan29 B.2.9Management of non-conforming products or activities29 B.2.10New product introduction programme29 B.2.11Interrelationships with subcontractors30 B.2.12Company definitions and symbols30 B.2.13List of com
24、ponents covered by Technology Approval30 Figure 1 Example flowchart Administration19 Figure 2 Example flowchart Design20 Figure 3 Example flowchart Film substrate manufacture21 Figure 4 Example flowchart Screen manufacture22 Figure 5 Example flowchart Component/package assembly23 Figure 6 Example fl
25、owchart Hybrid test24 Figure 7 Example flowchart Packing and shipping25 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 4 blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec
26、 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 265001:1998 BSI 03-20005 Introduction The requirements for Technology Approval of manufacturers of electronic and electromechanical components are given in RP 14-VI. The procedures for approval defined in that RP require the manufacture
27、r to have available an appropriate Technology Approval Schedule (TAS). This schedule defines how the principles and requirements of RP 14-VI are applied to Film and Hybrid Integrated Circuits It is intended for film and hybrid integrated circuit manufacturers who can demonstrate continuous process c
28、ontrol, usually by statistical means, and continuous quality improvement. It is therefore best suited to the high volume, low complexity manufacturer. For low volume, high complexity custom hybrid manufacturers the Capability Approval procedures as defined in EN 165000-1 are more suited. It is recog
29、nized that the technologies covered by this TAS are broad and diverse. Each manufacturer may have his own methods of satisfying the contents of this specification. The sections identified shall be considered when forming the Description of Technology in the Technology Approval Declaration Document (
30、TADD refer to Annex B). Other documentation may be referred to and made available to cover the requirements of this TAS. 1 General 1.1 Scope This TAS specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, ma
31、nufacture and supply of Film potting; dip-coating; transfer moulding. 1) available from CENELEC/CS in Brussels a) dimensions:IEC 191-2 b) temperatures: 65, 55, 40, 25, 10, 0, + 5, + 25, + 40, + 55, + 70, + 85, + 100, + 125, + 150 C. Licensed Copy: London South Bank University, London South Bank Univ
32、ersity, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 265001:1998 BSI 03-20007 film integrated circuit an integrated circuit whose circuit and elements, including the interconnections, are film elements formed on the surface of an insulating substrate hybrid film integrated
33、circuit a film integrated circuit in which the main part of the circuit elements are produced in-situ as film circuit elements on a substrate, and which is completed by added components mounted on the substrate or elsewhere in the package measurement uncertainty a statement of the limits of the rang
34、e within which the true value of the measurement is expected to lie in relation to the recorded result, with a defined confidence level multilayer film circuit a circuit of more than one layer of film interconnection, separated by at least one insulating film or gap part-finished a qualifying term f
35、or a film integrated circuit or hybrid film integrated circuit taken uncompleted from a production line. It cannot be completely assessed to the specification applicable in its normal finished state package total or partial envelope of an integrated circuit which provides: mechanical protection; env
36、ironmental protection; outline dimensions. the package may also contain or provide terminals and contribute to the thermal characteristics of the integrated circuit process test vehicle (PTV) a device or test structure used to verify, analyze or monitor processes or electrical/physical attributes pr
37、oduct assessment level schedules (PALS) define the minimum circuit process and test requirements for the different market sectors/operating environments qualification circuit (QC) a circuit which is representative of circuits manufactured to declared and identical processes and used for approval tes
38、ts to one of the Product Assessment Level Schedules (PALS) screening examination or testing applied to all products in a lot for the purpose of detecting and removing potential failures 2 Definition of the circuit technology 2.1 Scope Film and hybrid integrated circuits may be considered to belong t
39、o two principal technology types/build standards: i) devices containing solder-attached and/or chip-and-wire components which are unencapsulated or non-hermetically encapsulated; ii) devices which are hermetically sealed or contain components that are individually hermetically sealed. There are elev
40、en Product Assessment Level Schedules (PALS) applicable to film film screen manufacture; substrate fabrication, circuit types; assembly areas; test areas; packaging and shipment. An example of a flowchart for administration from placing an order to dispatch of the end product is given in Figure 1. 2
41、.3 Technical abstract The manufacturer shall produce an Abstract Description of Technology, on a single A4 sheet, for publication in CECC 00200. The manufacturer shall provide the ONS with a draft Abstract Description of Technology. This may be supplied as a separate controlled document or included
42、in the TADD (see B.2.3). The description shall be based on the following: a) company name; b) type of technology; c) approved processes; d) subcontracted processes; e) packaging/encapsulation methods; f) PALS number; g) maximum physical size; h) Control Site address (including telephone numbers); i)
43、 commercial contact (telephone number). An example is given in Annex A. * Design of circuit layout and packaging; Artwork and Screen fabrication; Substrate scribe/substrate profiling or drilling; * Production of the circuit pattern on the base substrate; Trimming of resistors; * Assembly of added-co
44、mponents; * Packaging/encapsulation of circuit; * Electrical Test; Mechanical/Environmental Test; Packing and shipping. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 265001:1998 BSI 03-20009 3 Circuit
45、 design 3.1 Scope This clause specifies requirements related to the design of both standard and customer specific components as applicable, for which TA is being sought including any sub-contract work. 3.2 Description of activities and flowcharts The manufacturer shall describe, in the TADD, the act
46、ivities associated with the design and layout of each circuit type (e.g. Thick or thin film, surface mount, chip and wire, package etc.), highlighting critical stages, check points and quality indicators (see B.2.3.2). Examples include:- design rules; package selection; design tools (including therm
47、al analysis); simulation/test programmes; design verification; customer liaison during design; A flowchart for each circuit technology shall be included. An example of a flowchart for design is given in Figure 2. 3.3 Interfaces 3.3.1 Design/manufacture The manufacturers policy relating to the contro
48、l of the interface between design and manufacture, e.g. in respect of materials, hardware, software and computer aided design, shall be described in the TADD. 3.3.2 Design/customer The manufacturers policy relating to the control of the interface between design and the customer, indicating those sta
49、ges where customer liaison is critical, shall be described in the TADD. The manufacturers procedures shall cover the following as a minimum:- specifications; characterization of prototypes; design reviews; electrical test. Where the customer has produced the design/layout, the manufacturers procedure for ensuring that it complies with the manufacturers design/layout manufacturing rules shall be described. 3.3.3 Subcontractors, vendors and internal suppliers Subcontracting o