BS-EN-123200-1992.pdf

上传人:哈尼dd 文档编号:3738087 上传时间:2019-09-22 格式:PDF 页数:32 大小:498.10KB
返回 下载 相关 举报
BS-EN-123200-1992.pdf_第1页
第1页 / 共32页
BS-EN-123200-1992.pdf_第2页
第2页 / 共32页
BS-EN-123200-1992.pdf_第3页
第3页 / 共32页
BS-EN-123200-1992.pdf_第4页
第4页 / 共32页
BS-EN-123200-1992.pdf_第5页
第5页 / 共32页
亲,该文档总共32页,到这儿已超出免费预览范围,如果喜欢就下载吧!
资源描述

《BS-EN-123200-1992.pdf》由会员分享,可在线阅读,更多相关《BS-EN-123200-1992.pdf(32页珍藏版)》请在三一文库上搜索。

1、BRITISH STANDARD BS EN 123200:1992 Incorporating Amendment No. 1 BS CECC 23200:1989 renumbered Harmonized system of quality assessment for electronic components Sectional specification: Single and double sided printed boards with plated through holes The European Standard EN 123200:1992 has the stat

2、us of a British Standard Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123200:1992 This British Standard, having been prepared under the direction of the Electronic Components Standards Policy Committee, was published under the autho

3、rity of the Board of BSI and comes into effect on 29 September 1989 BSI 01-2000 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment 86/31649 DC ISBN 0 580 17504 9 Committees responsible for this British Standard The preparation of this Briti

4、sh Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the following bodies were represented: British Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Compon

5、ents Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervising Inspactorate Printed Circuit Association Telecommunication Engineering and Manufa

6、cturing Association (TEMA) Amendments issued since publication Amd. No.Date of issueComments 7361November 1992 Adoption as a European standard: renumbering as BS EN 123200:1992 9251September 1996 Indicated by a sideline in the margin Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GM

7、T+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123200:1992 BSI 01-2000i Contents Page Committees responsibleInside front cover National forewordii Foreword2 Text of EN 1232005 Publications referred toInside back cover Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:00 2006, Un

8、controlled Copy, (c) BSI BS EN 123200:1992 ii BSI 01-2000 National foreword This British Standard has been prepared under the direction of the Electronics Components Standards Policy Committee. It is identical with CENELEC Electronics Components Committee (CECC) 23200:1985 “Harmonized system of qual

9、ity assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes”. This standard is a harmonized specification within the CECC system and should be read in conjunction with BS CECC 23000 In 1992 the CENELEC Electronic Components Comm

10、ittee (CECC) accepted CECC 23200:1985 as European Standard EN 123200:1992. There is no British Standard equivalent to CECC 00010 which comprises only a list of the tests in IEC 326-2 and its supplement IEC 326-2A. The Technical Committee has reviewed the provisions of IEC 194, IEC 321 and IEC 326-3,

11、 to which reference is made in the text, and has decided that they are acceptable for use in conjunction with this standard. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance

12、 with a British Standard does not of itself confer immunity from legal obligations. Cross-references International StandardCorresponding British Standard IEC 68BS 2011 Basic environmental testing procedures (Most Parts are identical) IEC 249BS EN 60249 Base materials for printed circuits (Most parts

13、 are identical) IEC 326-2BS 6221: Printed wiring boards Part 2:1982 Methods of test (Technically equivalent) IEC 326-5Part 5:1982 Method for specifying single and double sided printed wiring boards with plated through holes (Identical) CECC 23000BS CECC 23000:1988 Harmonized system of quality assess

14、ment for electronic components: generic specification: printed boards (Identical) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 26, an inside back cover and a back cover. This standard has been updated (see copyright date

15、) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123200 May 1992 + A1 Au

16、gust 1995 ICS 31.180 Descriptors: Printed boards, single and double sided, plated-through holes, test specimens, capability test, quality conformance inspection, test patterns English version Sectional Specification: Single and double sided printed boards with plated-through holes (includes amendmen

17、t A1:1995) Spcification intermdiaire: Cartes imprimes simples et doubles faces avec trous mtalliss (inclut lamendement A1:1995) Rahmenspezifikation: Leiterplattenmit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Lchern (enthlt nderungen A1:1995) This European Standard was approve

18、d by the CENELEC Electronic Components Committee (CECC) on 12 December 1991. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and b

19、ibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsib

20、ility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Neth

21、erlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1995 Cop

22、yright reserved to CENELEC members Ref. No. EN 123200:1992 + A1:1995 E Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123200:1992 BSI 01-2000 2 Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member count

23、ries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment pr

24、ocedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. This specification has been formally approved by the CECC, and has

25、 been prepared for those countries taking part in the System who wish to issue national harmonized SECTIONAL SPECIFICATIONS for SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES. It should be read in conjunction with the current regulations for the CECC System. Preface This Sectional

26、Specification was prepared by CECC Working Group 23: Printed Circuits. It is based on publications of the International Electrotechnical Commission (IEC). The text of this specification was circulated to the CECC for voting in the documents indicated below and was ratified by the President of the CE

27、CC for printing as a CECC Specification. SECRETARIAT NOTE: DUE TO THE URGENT INDUSTRIAL NEED FOR THIS SPECIFICATION, THE PRESIDENT OF THE CECC HAS RULED THAT IT BE PUBLISHED WITHOUT THE FULL EDITORIAL PROCEDURE BEING APPLIED. USERS OF THE SPECIFICATION ARE ASKED TO REPORT TO THE CECC GENERAL SECRETA

28、RIAT ANY ERRORS THEY FIND SO THAT AMENDING ACTION CAN BE INITIATED. The text is published initially in English and German. The French version will follow as soon as it has been prepared. Foreword to amendment A1 This amendment was prepared by CLC/TC CECC/WG 23. The text of the draft was submitted to

29、 the Unique Acceptance Procedure and was approved by CENELEC as amendment A1 to EN 123200:1992 on 1995-07-04. The following dates were fixed: DocumentDate of Voting Report on the Voting CECC(Secretariat) 1053/1053A CECC(Secretariat) 1548 November 1981 August 1984 CECC(Secretariat) 1251 CECC(Secretar

30、iat) 1619 latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 1996-07-01 latest date by which the national standards conflicting with the amendment have to be withdrawn(dow) 1996-07-01 Licensed Copy: sheff

31、ieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123200:1992 BSI 01-20003 Contents Page Foreword2 1Introduction5 1.1Scope and object5 1.2Related documents5 2General5 3Test specimens6 3.1Capability approval6 3.2Quality conformance inspection6 4Relevant specifi

32、cation6 5Characteristics of printed boards6 6Capability test programme15 7Quality conformance inspection16 8Test patterns20 8.1Application of test patterns and test boards20 8.2Composite test pattern (CTP)20 8.3Multiple arrangements of the CTP21 Figure 1 Length of defect19 Figure 2a Composite test p

33、attern (obverse)22 Figure 2b Composite test pattern (reserve)23 Figure 2c Multiple arrangements24 Figure 3 Examples of soldered holes25 Table I Basic characteristics7 Table II Additional characteristics13 Table III15 Table IV17 Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:0

34、0 2006, Uncontrolled Copy, (c) BSI 4 blank Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123200:1992 BSI 01-20005 1 Introduction IEC 326-5 is the IEC-Standard for single and double sided printed boards with plated-through holes. The fol

35、lowing document comprises this IEC-Standard and in accordance with the generic specification CECC 23000 the information additionally necessary for printed boards intended to be handled within the CENELEC system for Electronic Components of Assessed Quality. 1.1 Scope and object This document is a Se

36、ctional Specification (SS) relating to single and double sided printed boards with plated-through holes irrespective of their method of manufacture, when they are ready for mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approv

37、al testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents IEC 68, Basic environmental testing procedures. IEC 194, Terms and definitions for printed circuits. IEC 249, Metal-clad base materials for printed circuits. IEC 321, Guidance for the design

38、 and use of components intended for mounting on printed boards. IEC 326-2, Printed boards test methods. IEC 326-3, Design and use of printed boards. IEC 326-5, Specification for single and double sided printed boards with plated-through holes. CECC 00010, Printed boards test methods. CECC 23000, Gen

39、eric Specification Printed boards of assessed quality. 2 General This Sectional Specification (SS) applies to single and double sided printed boards with plated-through holes and is intended as a basis for the preparation of Capability Detail Specification (Cap DS) applying to specific materials, e.

40、g. according to IEC 249-2, and to be used for capability approval procedures. It may be necessary to have a Cap DS for each type of material. A Cap DS may be prepared by an international or a national body or by a manufacturer (see also CECC 00111). Customer Detail Specification (CDS) for the custom

41、 built printed boards, according to 5 of CECC 23000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in CECC 23000 and in CECC 00107-III. Table I contains the basic characteristics that will normally be important for singl

42、e and double sided printed boards with plated-through holes and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be important for certain single and double sided printed boards with plated-through holes and/or certain

43、 applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from this Table II. Where additional details for a test have to be specified in the relevant specification, this is indicated by

44、 an asterisk in the relevant column. These details shall then be specified in accordance with CECC 00010 (IEC 326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as capability qualifying component. Table IV contains the information for the quali

45、ty conformance inspection. The tables are not intended to prescribe a test sequence, the tests may be carried out in any sequence, unless otherwise specified. Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:06 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123200:1992 6 BSI 01-2000 3 Tes

46、t specimens 3.1 Capability Approval 3.1.1 Basic Capability The test shall be carried out on the composite test pattern given in 8. 3.1.2 Additional Capability 3.5.3 of CECC 23000 shall apply. For multiple arrangements see also 8. 3.1.3 Maintenance of Capability Approval 3.8 of CECC 23000 shall apply

47、. 3.2 Quality conformance inspection Unless otherwise specified production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Where specially designed test patterns shall be used they may be included in the panel. They ma

48、y be based on the appropriate pattern of the composite test pattern clause 8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “Relevant Specification” means a product specification for an actual printed board, i.e. a CDS as well as a Cap DS

49、 applied to a specific material and technique, as applicable. The relevant specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC 326-3 shall preferably be followed. Care should be taken to avoid unnecessary prescriptions. Permissible deviations shall be stated where necessary, nominal values without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts of the printed board only,

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 其他


经营许可证编号:宁ICP备18001539号-1