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1、BRITISH STANDARD BS EN 61967-4:2002 Incorporating amendment no. 1 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 4: Measurement of conducted emissions 1 ohm/150 ohm direct coupling method ICS 31.200 ? Licensed Copy: London South Bank University, London South Bank
2、 University, Fri Feb 15 06:52:06 GMT+00:00 2008, Uncontrolled Copy, (c) BSI BS EN 61967-4:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committe
3、e on 19 August 2002 BSI 2008 ISBN 978 0 580 60803 2 National foreword This British Standard is the UK implementation of EN 61967-4:2002, incorporating amendment A1:2006 and corrigendum December 2006. It is identical with IEC 61967-4:2002, incorporating amendment 1:2006. The start and finish of text
4、introduced or altered by amendment is indicated in the text by tags. Tags indicating changes to IEC text carry the number of the IEC amendment. For example, text altered by IEC amendment 1 is indicated by !“. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semico
5、nductors. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer im
6、munity from legal obligations. Amendments issued since publication Amd. No. DateComments 1632831 May 2006See national foreword 31 January 2008Implementation of CENELEC corrigendum December 2006 (addition of references to Annex ZA) Licensed Copy: London South Bank University, London South Bank Univer
7、sity, Fri Feb 15 06:52:06 GMT+00:00 2008, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 61967-4 NORME EUROPENNE EUROPISCHE NORM June 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung
8、Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. ICS 31.200 Incorporating corrigendum December 2006 English version Integrated circuits - Measurement of electromagnetic emissions,
9、150 kHz to 1 GHz Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method (IEC 61967-4:2002) Circuits intgrs - Mesure des missions lectromagntiques, 150 kHz 1 GHz Partie 4: Mesure des missions conduites - Mthode par couplage direct 1 ohm/150 ohm (CEI 61967-4:2002 + A1:2006)
10、Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz Teil 4: Messung der leitungsgefhrten Aussendungen - Messung mit direkter 1 Ohm/150 Ohm-Kopplung (IEC 61967-4:2002 + A1:2006) Up-to-date lists and bibliographical references concerning such
11、 national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own la
12、nguage and notified to the Central Secretariat has the same status as the official versions. +A1 February 2006 This European Standard was approved by CENELEC on 2002-06-01. comply with the CEN/CENELEC Internal Standard the status of a national standard without any alteration. CENELEC members are the
13、 national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Sw
14、itzerland and the United Kingdom. Ref. No. EN 61967-4:2002 E CENELEC members are bound to Regulations which stipulate the conditions for giving this European Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:52:06 GMT+00:00 2008, Uncontrolled Copy, (c) BSI Fore
15、word The text of document 47A/636/FDIS, future edition 1 of IEC 61967-4, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61967-4 on 2002-06-01. The following dates were fixed: latest date b
16、y which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop)2003-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow)2005-06-01 Annexes designated “normative“ are part of the body of the
17、standard. Annexes designated “informative“ are given for information only. In this standard, annexes A and ZA are normative and annexes B, C, D and E are informative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61967-4:2002 was approved by CENE
18、LEC as a European Standard without any modification. _ Page 2 EN 619674:2002 Foreword to amendment A1 The text of document 47A/735/FDIS, future amendment 1 to IEC 61967-4:2002, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vot
19、e and was approved by CENELEC as amendment A1 to EN 61967-4:2002 on 2006-02-01. The following dates were fixed: latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2006-11-01 latest date by which the nati
20、onal standards conflicting with the amendment have to be withdrawn (dow) 2009-02-01 This European Standard makes reference to International Standards. Where the International Standard referred to has been endorsed as a European Standard or a home-grown European Standard exists, this European Standar
21、d shall be applied instead. Pertinent information can be found on the CENELEC web site. _ Endorsement notice The text of amendment 1:2006 to the International Standard IEC 61967-4:2002 was approved by CENELEC as an amendment to the European Standard without any modification. _ Licensed Copy: London
22、South Bank University, London South Bank University, Fri Feb 15 06:52:06 GMT+00:00 2008, Uncontrolled Copy, (c) BSI CONTENTS Page 3 EN 619674:2002 1 Scope 6 2 Normative references .6 3 Definitions6 4 General7 4.1 Measurement basics7 4.2 RF current measurement .9 4.3 RF voltage measurement at IC pins
23、 .9 4.4 Assessment of the measurement technique .9 5 Test conditions.10 6 Test equipment 10 6.1 Test receiver specification .10 6.2 RF current probe specification .10 6.3 Test of the RF current probe capability 11 6.4 Matching network specification 11 7 Test set-up.11 7.1 General test configuration1
24、1 7.2 Printed circuit test board layout .12 8 Test procedure.13 9 Test report .13 Annex A (normative) Probe calibration procedure.14 Annex B (informative) Classification of conducted emission levels17 B.1 Introductory remark .17 B.2 General.17 B.3 Definition of emission levels 17 B.4 Presentation of
25、 results.18 Annex C (informative) Example of reference levels for automotive applications.21 C.1 Introductory remark .21 C.2 General.21 C.3 Reference levels .21 Annex D (informative) EMC requirements and how to use EMC IC measurement techniques.23 D.1 Introduction.23 D.2 Using EMC measurement proced
26、ures 23 D.3 Assessment of the IC influence to the EMC behaviour of the modules 24 Annex E (informative) Example of a test set-up consisting of an EMC main test board and an EME IC test board.25 E.1 The EMC main test board 25 E.2 EME IC test board .27 Annex F (informative) 150 direct coupling network
27、s for common mode emission measurements of differential mode data transfer ICs and similar circuits 29 Annex ZA (normative) Normative references to international publications with their corresponding European publications33 Licensed Copy: London South Bank University, London South Bank University, F
28、ri Feb 15 06:52:06 GMT+00:00 2008, Uncontrolled Copy, (c) BSI Page 4 EN 619674:2002 Figure 1 Example of two emitting loops returning to the IC via common ground 8 Figure 2 Example of IC with two ground pins, a small I/O loop and two emitting loops.8 Figure 3 Construction of the RF current probe10 Fi
29、gure 4 Impedance matching network corresponding with IEC 61000-4-6 .19 Figure 5 General test configuration 12 Figure A.1 Test circuit14 Figure A.2 Insertion loss of the 1 probe .14 Figure A.3 Layout of the calibration test circuit.15 Figure A.4 Connection of the calibration test circuit16 Figure A-5
30、 Minimum decoupling limit versus frequency.16 Figure B.1 Emission level scheme18 Figure B.2 Example of the maximum emission level G8f.19 Figure C.1 1 method Reference levels for conducted disturbances from semiconductors (peak detector) 22 Figure C.2 150 method Reference levels for conducted disturb
31、ances from semiconductors (peak detector) 22 Figure E.1 EMC main test board 26 Figure E.2 Jumper field51 Figure E.3 EME IC test board (contact areas for the spring connector pins of the main test board)27 Figure E.4 Example of an EME IC test system29 Figure E.5 Component side of the EME IC test boar
32、d .29 Figure E.6 Bottom side of the EME IC test board30 Figure F.1 Basic direct coupling for common mode EMC measurements.29 Figure F.2 Measurement set-up for the S21 measurement of the common-mode coupling .30 Figure F.3 Using split load termination as coupling for measuring equipment30 Figure F.4
33、Using split load termination as coupling for measuring equipment31 Figure F.5 Example of an acceptable adaptation for special network requirements .31 Table 1 Specification of the RF current probe.10 Table 2 Characteristics of the impedance matching network.11 Table B.1 Emission levels20 Table D.1 E
34、xamples in which the measurement procedure can be reduced.23 Table D.2 System- and module-related ambient parameters .24 Table D.3 Changes at the IC which influence the EMC .24 Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:52:06 GMT+00:00 2008, Uncontrolled
35、 Copy, (c) BSI 61967-4 ? IEC:2002 5 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 kHz TO 1 GHz Part 4: Measurement of conducted emissions 1 ? ?/150 ? ? direct coupling method Page 5 EN 619674:2002 1 Scope This part of IEC 61967 specifies a method to measure the conducted electrom
36、agnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 resistive probe and RF voltage measurement using a 150 coupling network. These methods guarantee a high degree of repeatability and correlation of EME measurements. IEC 61967-1 specifies general
37、 conditions and definitions of the test methods. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including an
38、y amendments) applies. IEC 61000-4-6, Electromagnetic compatibility (EMC) Part 4-6: Testing and measurement techniques Immunity to conducted disturbances, induced by radio-frequency fields IEC 61967-1, Integrated circuits ? Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1: General c
39、onditions and definitions !CISPR 16-1-1, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-1: Radio disturbance and immunity measuring apparatus Measuring apparatus CISPR 16-1-2, Specification for radio disturbance and immunity measuring apparatus and methods Pa
40、rt 1-2: Radio disturbance and immunity measuring apparatus Ancillary equipment Conducted disturbances CISPR 16-1-3, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-3: Radio disturbance and immunity measuring apparatus Ancillary equipment Disturbance power CISP
41、R 16-1-4, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-4: Radio disturbance and immunity measuring apparatus Ancillary equipment Radiated disturbances CISPR 16-1-5, Specification for radio disturbance and immunity measuring apparatus and methods Part 1-5: R
42、adio disturbance and immunity measuring apparatus Antenna calibration test sites for 30 MHz to 1 000 MHz “ Licensed Copy: London South Bank University, London South Bank University, Fri Feb 15 06:52:06 GMT+00:00 2008, Uncontrolled Copy, (c) BSI 61967-4 ? IEC:2002 6 IC Gnd Loop 2Loop 1 Supply Ground
43、External i2 Vsupply RF current probe I/O i1 i1 + i2 IEC 894/02 Figure 1 Example of two emitting loops returning to the IC via common ground The emission of an IC is generated by sufficiently fast changes of voltages and currents inside the IC. These changes drive RF currents inside and outside the I
44、C. The RF currents cause conducted EME, which is mainly distributed via the IC pins conductor loops in the printed circuit board (PCB) and the cabling. These loops are regarded as the emitting loop antennas. In comparison to the dimension of these loops, the loops in the internal IC structure are co
45、nsidered to be small. The RF currents that accompany ICs action are different in amplitude, phase and spectral content. Any RF current has its own loop that returns to the IC. All loops return mostly via the ground or supply connection back to the IC. In figure 1, this is shown for two loops returni
46、ng via ground. Loop 1 represents the supply wiring harness for the IC while loop 2 represents the routing of an output signal. The common return path via ground is a suitable location to measure the conducted EME as the measurement of the common RF sum current of the ground pin. This test is named t
47、he “RF current measurement”. If the IC under test has only one ground pin and all other pins are suspected to contribute essentially to the EME, then the RF sum current is measured between the ground pin of the IC under test and the ground (see i1 + i2 in figure 1). IC Gnd Loop 3 Loop 2Loop 1 IC gro
48、und Supply RF-shield and peripheral ground RF current probe External Vsupply I/O I/O i2i1 i1 + i2 IEC 895/02 Figure 2 Example of IC with two ground pins, a small I/O loop and two emitting loops If the IC under test has more than one ground pin or some of the pins are not suspected to contribute much
49、 to the whole EME, then the IC under test gets its own ground plane as shown in figure 2. This ground plane is named “IC ground”. It is kept separately from the other ground, that is named “RF-shield and peripheral ground”. The RF current is measured between the IC ground and the peripheral ground. Page 6 EN