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1、BRITISH STANDARD BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies The European Standard EN 61192-3:2003 has the status of a British Standard ICS 31.190 ? Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006
2、, Uncontrolled Copy, (c) BSI BS EN 61192-3:2003 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 7 April 2003 BSI 7 April 2003 ISBN 0 580 41544 9 National foreword This British Standard is the official English language version of EN 61192-3:20
3、03. It is identical with IEC 61192-3:2002. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-r
4、eferences The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of Bri
5、tish Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; prese
6、nt to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an i
7、nside front cover, the EN title page, pages 2 to 47 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 200
8、6, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 61192-3 NORME EUROPENNE EUROPISCHE NORMFebruary 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart
9、 35, B - 1050 Brussels 2003 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61192-3:2003 E ICS 31.190 English version Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies (IEC 61192-3:20
10、02) Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 3: Assemblage au moyen de trous transversants (CEI 61192-3:2002) Anforderungen an die Ausfhrungsqualitt von Ltbaugruppen Teil 3: Baugruppen in Durchsteckmontage (IEC 61192-3:2002) This European Standard was approve
11、d by CENELEC on 2003-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such nationa
12、l standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language a
13、nd notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway,
14、Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 91/334/FDIS, future edition 1 of IEC 61192-3, prepared by IEC TC 91, Electronics assembly techno
15、logy, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61192-3 on 2003-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop)2003-11-01 latest d
16、ate by which the national standards conflicting with the EN have to be withdrawn(dow)2006-02-01 This standard should be used in conjunction with the following parts of EN 61192, under the general title Workmanship requirements for soldered electronic assemblies: Part 1: General Part 2: Surface-mount
17、 assemblies Part 4: Terminal assemblies Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61192-3:2002 was approved by CENELEC as a European
18、 Standard without any modification. _ Page 2 EN 611923:2003 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CONTENTS INTRODUCTION.6 1 Scope.7 2 Normative references7 3 Terms and definitions .8 4 General requirements .8 4.1 Classification.8 4
19、.2 Conflict8 4.3 Inspection techniques 8 4.4 Interpretation of requirements8 5 Component preparation processes9 5.1 Lead forming .9 5.2 Lead protrusion and clinching 10 5.3 Lead cutting/cropping 12 5.4 Pre-tinning.13 6 Masking attributes 13 6.1 Misalignment .13 6.2 Improper adhesion.13 6.3 Thermal c
20、apability .15 7 Insertion of through-hole components .16 7.1 General requirements 16 7.2 Orientation and mounting criteria .17 7.3 Missing component27 7.4 Wrong component .27 7.5 Damaged component.27 8 Soldering process attributes31 8.1 General requirements 31 8.2 Misalignment .34 8.3 Damaged compon
21、ents.34 8.4 Solder joint characteristics.34 9 Cleaning attributes40 9.1 Flux residues.41 9.2 Other residues.42 10 Rework/replacement attributes46 Annex ZA (normative) Normative references to international publications with their corresponding European publications47 Figure 1 Lead forming, lead exten
22、sion 9 Figure 2 Lead forming, bend radius 9 Figure 3 Straight and partially clinched leads 10 Figure 4 Lead protrusion 10 Figure 5 Lead protrusion, clinched11 Figure 6 Lead protrusion, partially clinched.11 Figure 7 Clinched lead Nonconforming 12 Page 3 EN 611923:2003 Licensed Copy: sheffieldun shef
23、fieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Figure 8 Lead cutting, target.12 Figure 9 Lead cutting Acceptable.12 Figure 10 Lead cutting Nonconforming.13 Figure 11 Acceptable solder mask14 Figure 12 Solder mask Cracking or blistered14 Figure 13 Solder mask Loose partic
24、les 14 Figure 14 Permanent solder-mask blisters or wrinkling .15 Figure 15 Permanent solder-mask failure .15 Figure 16 Solder-mask degradation16 Figure 17 Component orientation Target17 Figure 18 Component orientation Acceptable.17 Figure 19 Component orientation Nonconforming.18 Figure 20 Radial le
25、ad component, horizontal installation Target .18 Figure 21 Radial lead component, horizontal installation Acceptable 18 Figure 22 Radial lead component, horizontal installation Nonconforming19 Figure 23 Axial lead component, vertical installation Target .19 Figure 24 Axial lead component, vertical i
26、nstallation Acceptable 19 Figure 25 Axial lead component, vertical installation Nonconforming 20 Figure 26 Radial lead component, vertical mounting Target .20 Figure 27 Radial lead component, vertical mounting Acceptable 20 Figure 28 Radial lead component, vertical mounting Nonconforming 21 Figure 2
27、9 Axial lead component, horizontal mounting Target/Acceptable21 Figure 30 Axial leaded component, horizontal mounting Nonconforming.21 Figure 31 Dual in-line packs (DIPs) Target.22 Figure 32 Dual in-line packs (DIPs) Acceptable22 Figure 33 Dual in-line packs (DIPs) Nonconforming .22 Figure 34 Axial
28、lead component, vertical mounting Target23 Figure 35 Axial lead component, vertical mounting Acceptable.23 Figure 36 Axial lead component, vertical mounting Nonconforming 24 Figure 37 Coating meniscus in hole Target 24 Figure 38 Coating meniscus in hole Acceptable .25 Figure 39 Coating meniscus in h
29、ole Nonconforming.25 Figure 40 Leads crossing conductors Acceptable.25 Figure 41 Leads crossing conductors Nonconforming 26 Figure 42 Stress-relief axial leaded components.26 Figure 43 Stress-relief radial leaded components27 Figure 44 Axial component lead damage Acceptable27 Figure 45 Axial compone
30、nt lead damage Nonconforming .28 Figure 46 Damage to axial component body .28 Figure 47 Axial lead component damage Nonconforming .28 Figure 48 Damage to axial component with glass body .29 Figure 49 Damage to radial component body Target 29 Figure 50 Damage to radial component body Acceptable .29 F
31、igure 51 Active area structural integrity Nonconforming30 Figure 52 Dual in-line component Target .30 Figure 53 Dual in-line component Acceptable 31 Page 4 EN 611923:2003 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Figure 54 Dual in-line
32、 component Nonconforming 31 Figure 55 Through-hole solder joints Acceptable32 Figure 56 Poor solder wetting Nonconforming32 Figure 57 Excess solder, bridging Nonconforming32 Figure 58 Excess solder Mounting hole Nonconforming.33 Figure 59 Solder balls and splashes Nonconforming 33 Figure 60 Solder w
33、ebs Nonconforming.33 Figure 61 Solder wetting Target.34 Figure 62 Solder wetting Acceptable34 Figure 63 Hole fill and lead configuration Acceptable .35 Figure 64 Hole solder fill Thermal plane.35 Figure 65 Solder fillet Target .36 Figure 66 Solder fillet Acceptable 36 Figure 67 Solder fillet Nonconf
34、orming 36 Figure 68 Solder pin holes and voids Acceptable .37 Figure 69 Solder joints Nonconforming 37 Figure 70 Clinched leads Non-plated through holes Acceptable.38 Figure 71 Clinched leads Plated through holes Acceptable38 Figure 72 Exposed basis metal Acceptable39 Figure 73 Exposed basis metal N
35、onconforming39 Figure 74 Trimmed leads Acceptable.40 Figure 75 Fractured leads Nonconforming .40 Figure 76 Cleaning Acceptable 41 Figure 77 Flux residue Nonconforming.41 Figure 78 Particulate matter .42 Figure 79 Particulate residues 42 Figure 80 Residue-free surface 43 Figure 81 White residue .43 F
36、igure 82 Residue-free surface Corrosion44 Figure 83 Corrosion residues Acceptable.44 Figure 84 Nonconforming residues .45 Figure 85 Corrosion residues45 Figure 86 Embedded residues46 Table 1 Lead bend requirements 9 Table 2 Lead protrusion requirements 10 Table 3 Component to board space 21 Table 4
37、Component-to-board spacing .23 Table 5 Minimum component lead acceptance conditions .35 Page 5 EN 611923:2003 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI INTRODUCTION This part of IEC 61192, combined with IEC 61192-1, is used to meet the
38、 end-product requirements defined in IEC 61191-1 and IEC 61191-3. This standard may be used to enable the suppliers and users of through-hole electronic assemblies to specify good manufacturing practices as part of a contract. The respective requirements and guidelines for surface-mount and terminal
39、 assemblies are included in separate but related standard. Page 6 EN 611923:2003 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES Part 3: Through-hole mount assemblies 1 Scope This p
40、art of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies
41、that include surface- mounting or other related assembly technologies, for example, terminals, wires. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the la
42、test edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface
43、 mount and related assembly technologies IEC 61191-2, Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC 61191-3, Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount soldered assemblies IEC 61191-4,
44、 Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61192-1, Workmanship requirements for soldered electronic assemblies Part 1: General IEC 61192-2, Workmanship requirements for soldered electronic assemblies Part 2: Surface- mount assemblies
45、IEC 61192-4, Workmanship requirements for soldered electronic assemblies Part 4: Terminal assemblies Page 7 EN 611923:2003 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 3 Terms and definitions For the purposes of this part of IEC 61192, th
46、e definitions of IEC 60194 apply. 4 General requirements The requirements of IEC 61192-1 are mandatory for this standard. 4.1 Classification The classification of assemblies is divided into three levels, that is, levels A, B, and C. Definitions of the classification categories and the status of prod
47、uct for each level are given in IEC 61192-1. In general, status is divided into three workmanship conditions, as follows: a) target; b) acceptable; c) nonconforming. 4.2 Conflict Accept and/or reject decisions shall be based on applicable documentation such as contracts, drawings, specifications and
48、 reference documents. In the event of conflict, the following order of precedence shall apply: a) procurement documents as agreed between user and supplier; b) master assembly drawing; c) IEC 61191-1 and IEC 61192-1; d) this standard; e) other documents to the extent that they are specified in this standard. 4.3 Inspection techniques For visual inspection, individual specifications may call for magnification aids for examining pr