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1、BRITISH STANDARD BS IEC 60191-1:2007 Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices ICS 31.080.01 ? Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Un
2、controlled Copy, (c) BSI BS IEC 60191-1:2007 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007 ISBN 978 0 580 50842 4 National foreword This British Standard was published by BSI. It is the UK implementation of IEC 60191-1
3、:2007. It supersedes BS 3934-1:1992 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include
4、 all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations. Amendments issued since publication Amd. No. DateComments Licensed Copy: London South Bank University, London South Bank U
5、niversity, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI INTERNATIONAL STANDARD IEC 60191-1 Second edition 2007-04 Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices Reference number IEC 60191-1:2007(
6、E) BS IEC 60191-1:2007 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI CONTENTS 1 Scope and object4 2 Normative references .4 3 Terms and definitions .4 4 General rules for all drawings.6 4.1 Drawing layout 6 4
7、.2 Dimensions and tolerances .6 4.3 Methods for locating the datum .8 4.4 Numbering of terminals .8 5 Additional rules 10 5.1 Rules for device and case outline drawings.10 5.2 Rules to specify the dimensions and positions of terminals10 5.3 Rules for gauge drawings11 6 Inter-conversion of inch and m
8、illimetre dimensions and rules for rounding off11 7 Rules for coding .12 Annex A (informative) Reference letter symbols.13 Annex B (normative) Standardization philosophy .16 Annex C (informative) Rules to specify the dimensions and positions of terminals on a base drawing 21 Annex D (normative) Gene
9、ral philosophy of flat base devices28 Annex E (informative) Examples of semiconductor device drawing 30 Annex F (informative) Former rules for rounding off .34 Annex G (informative) Former rules for coding.36 Bibliography37 Figure 1 Numbering of terminals of lozenge shaped bases9 Figure 2 System to
10、indicate the dimensions of the terminals 11 Figure B.1 Example of rigid lug device .19 Figure B.2 Example of flexible terminal device.20 Figure C.1 Circular base outline with no tab.25 Figure C.2 Tolerances of terminals 25 Figure C.3 Gauge for a circular base outline with no tab 26 Figure C.4 Circul
11、ar base outline with tab27 Figure C.5 Gauge for a circular base outline with tab.27 Figure D.1 Example of flat base outline29 Figure E.1 Long form package .30 Figure E.2 3 types of post/stud mount packages 30 Figure E.3 2 types of cylindric packages 31 Figure E.4 Oval package, terminals in line .32
12、BS IEC 60191-1:2007 2 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI Figure E.5 Cylindric package with different terminations 32 Figure E.6 Flange mount package32 Figure E.7 Disk button package with 3 terminat
13、ions .33 Figure E.8 Special shape for bolt-fixture 33 Table A.1 Dimensions of reference letter symbols13 BS IEC 60191-1:2007 3 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI MECHANICAL STANDARDIZATION OF SEMIC
14、ONDUCTOR DEVICES Part 1: General rules for the preparation of outline drawings of discrete devices 1 Scope and object This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices. NOTE For preparation of outline drawings of surface mounted discrete devices, IEC
15、60191-6 should be referred to as well. The primary object of these drawings is to indicate the space which should be allowed for devices in an equipment, together with other dimensional characteristics required to ensure mechanical interchangeability. It should be noted that complete interchangeabil
16、ity involves other considerations such as the electrical and thermal characteristics of the semiconductor devices concerned. The international standardization represented by these drawings therefore encourages the manufacturers of devices to comply with the tolerances shown on the drawings in order
17、to extend their range of customers internationally. It also gives equipment designers an assurance of mechanical interchangeability between the devices obtained from suppliers in different countries, provided they allow the space in their equipment that is indicated by the drawings and take note of
18、the more precise information on bases, studs, etc. NOTE Additional details on the standardization philosophy used in this standard are given in Annex B. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the ed
19、ition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-2:1966, Mechanical standardization of semiconductor devices Part 2: Dimensions (including all supplements and amendments) IEC 60191-4, Mechanical standardization o
20、f semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages ISO 370, Toleranced dimensions Conversion from inches to millimetres and vice versa (withdrawn 2000-05) 3 Terms and definitions For the purposes of this document, the fol
21、lowing definitions apply. 3.1 device outline drawing drawing which includes all dimensional characteristics required for the mechanical interchangeability of the complete device. It includes the case or body, all terminals and the locating tab if present BS IEC 60191-1:2007 4 Licensed Copy: London S
22、outh Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 3.2 terminal that part of the semiconductor device primarily used in making an electrical, mechanical or thermal connection. Examples of terminals are flexible leads, rigid leads, pins,
23、 studs, etc. 3.3 case outline drawing drawing which includes all dimensional characteristics required for the mechanical interchangeability of the case or body. It does not include the dimensions of the terminals or the locating tab if present, but their positions are shown by dotted lines 3.4 base
24、drawing drawing which includes all dimensional characteristics required for the mechanical interchangeability of the terminals and mechanical index NOTE 1 Examples of these characteristics are: lead length, lead diameters with controlled zones, lead spacing, pitch circle diameter, thickness, width a
25、nd length of a tab, etc NOTE 2 The diameter or major axis of the case outline should not be given on the base drawing. NOTE 3 Many semiconductor devices have identical cases, but differ in the number or the length of terminals. It is also possible to have the same type of base associated with cases
26、which are not identical. Consequently, there are advantages in having: a) a single drawing including only the dimensional characteristics of the case outline and separate drawings for the various bases which can be associated with this case outline, or b) a single drawing including only the dimensio
27、nal characteristics of the base and separate drawings for the various case outlines which can be associated with this base. 3.5 mechanical index locating feature, or that portion of the device specifically designed to provide orientation. NOTE Examples of a mechanical index are: key, keyway, locatin
28、g tab, etc. 3.6 visual index any single terminal (or omission of) readily distinguished by the eye from others or any distinctive boss, stippled pattern or colour mark adjacent to a terminal 3.7 datum a theoretically exact geometric reference (such as axes, planes, straight lines etc.) to which tole
29、ranced features are related. Datums may be based on one or more datum features of a part ISO 5459:1981, definition 3.1 3.8 seating plane or seating base reference plane from which, in general, outline and base dimensions are given 3.9 seated height or mounted height distance from the seating plane t
30、o the top of any exposed tip or rigid terminal present, otherwise to the top of the outline. Flexible terminals should not be included as part of the seated height, but the mounted height should include a minimum allowance necessary for an axially mounted flexible lead to be bent at right angles BS
31、IEC 60191-1:2007 5 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 3.10 controlled cylindrical zone zone which defines a portion of the body of minimum length over which the diameter is controlled to closer tol
32、erances than is allowed over the full length of the body 4 General rules for all drawings NOTE General rules for the preparation of outline drawings of surface mounted semiconductor device packages are given in IEC 60191-6. 4.1 Drawing layout General rules for the drawing layout are as follows. a) A
33、 drawing should show all dimensions required to ensure mechanical interchangeability. b) The drawing using third angle projection, should include: a suitable side-view; suitable end-views, where appropriate; such additional views and details as are required to show any special configuration or featu
34、res. c) The following information should be put in the cartouche, at the bottom of the page: the projection method where there is more than one view, indicated as follows: date of publication of the drawing; IEC code number; country of origin and code of that country indicated by sign ; NOTE This is
35、 no longer in practice. other interested countries and codes of those countries. d) When a drawing is re-issued because of modifications, the changes made should be indicated by arrows in the margin. The date of publication of the revised issue and of the superseded issue should be stated. e) While
36、drawings need not to be drawn to scale, they should be roughly in proportion and, where necessary for clarity, enlarged detail drawing(s) should be used. 4.2 Dimensions and tolerances Application of dimensions and tolerances are as follows. a) Dimensions of bases, outlines, etc. quoted shall apply t
37、o the finished product. They should, therefore, not quote manufacturing tolerances, but give customers acceptance limits. BS IEC 60191-1:2007 6 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI b) The following t
38、ypes of dimension may be used on the drawings as appropriate: i) Toleranced dimensions A toleranced dimension can be expressed: preferably by both minimum and maximum limits (example: Lmin = 5,77 mm, Lmax = 5,82 mm); or by a nominal value and maximum and minimum limits. Such a nominal value need not
39、 necessarily be the average of two limits (example: 0,4 0,2 6mmL + =). ii) Untoleranced dimensions Untoleranced limiting dimensions i.e.: minimum only or maximum only (example: Lmax = 5,85 mm) . Untoleranced nominal dimensions These dimensions may be used: either for general information as an actual
40、 nominal figure; or to specify true geometrical position (by means of linear or angular dimensions). Such dimensions shall be indicated by an asterisk (*) after the numerical value, the asterisk in this sense meaning “true geometrical position“ (example: Lnom = 5,85 mm). c) Single minimum, single ma
41、ximum or single nominal (where not given for general information) dimensions should be stated in decimals to such a number of places as is considered adequate to express the degree of accuracy appropriate for that dimension; e.g. if measurement to the nearest 0,001 mm is considered appropriate, the
42、dimension should be expressed to the third decimal place (for example 0,500 mm), but if the measurement to the nearest 0,01 mm is sufficient, the dimension should be expressed to the second decimal place (for example 0,50 mm) and so on. Similar consideration should be given to the number of decimal
43、places necessary when an original dimension is expressed in millimetres. d) Limiting values or nominal value and limits of a toleranced dimension should be stated with the same number of decimal places (e.g. 0,016 mm min. 0,017 mm nom. 0,019 mm max.). e) The use of fractional mm dimensions is permit
44、ted to describe nominal hexagon sizes. f) Numerical dimensions should not be shown directly on the figure(s). They should be shown in tabular form under the figure(s) and correspond to the reference letter symbols on the figure(s). The letter symbols on the figure(s) should be upright. Upper case le
45、tters should be used for device outline and case outline dimensions and lower case letters for base dimensions. If confusion could arise, upper case letters should preferably be used throughout. g) In the case of a diameter, the symbol “” should appear in front of the reference letter concerned both
46、 on the figure(s) and in the table. In cases where the cross-section is uncontrolled (not necessarily round), the “” symbol should not be used. h) The table shall give dimensions in millimetres. The basic dimensions and system (millimetres or inches) will be indicated immediately above the table. NO
47、TE Outline drawings published in IEC 60191-2 before this document came into effect may give dimensions in inches. i) The dimensions and limits which should normally be given and their corresponding reference letter symbols are contained in Annex A. Some examples of drawings prepared in accordance wi
48、th these rules are given in Annex E. Where a particular reference letter is to be used for more than one dimension on the same drawing, use should be made of a suffix to identify the dimensions. BS IEC 60191-1:2007 7 Licensed Copy: London South Bank University, London South Bank University, Mon Jul
49、16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI Annex A cannot be expected to include all dimensions likely to be necessary for mechanical standardization, more particularly in the future. A distinction has been made between primary and secondary reference letter symbols, primary reference letter symbols being those which are used most frequently, secondary reference letter symbols be