BS-ISO-14881-2001.pdf

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1、BRITISH STANDARD BS ISO 14881:2001 Integrated optics Interfaces Parameters relevant to coupling properties ICS 31.260; 37.020 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c)

2、BSI BS ISO 14881:2001 This British Standard, having been prepared under the direction of the Consumer Products and Services Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 August 2001 BSI 07-2001 ISBN 0 580 37697 4 National foreword This Bri

3、tish Standard reproduces verbatim ISO 14881:2001 and implements it as the UK national standard. The UK participation in its preparation was entrusted to Technical Committee CPW/172, Optics and optical instruments, which has the responsibility to: A list of organizations represented on this committee

4、 can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using

5、the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity fr

6、om legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the

7、 UK. Summary of pages This document comprises a front cover, an inside front cover, the ISO title page, pages ii and iii, pages 1 to 6, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since public

8、ation Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI INTERNATIONAL STANDARD ISO 14881 First edition 2001-06-15 Reference number ISO 14881:2001(E) Integrated optics Interfaces Parameters relevant to coupling properties

9、Optique intgre Interfaces Paramtres caractrisant les proprits de couplage Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ISO 14881

10、:2001(E) ISO 1002 All rithgs rreseved iii Foreword ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO member bodies). The work of preparing International Standards is normally carried out through ISO technical committees. Each member

11、body interested in a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the International Electr

12、otechnical Commission (IEC) on all matters of electrotechnical standardization. International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 3. Draft International Standards adopted by the technical committees are circulated to the member bodies for voting.

13、Publication as an International Standard requires approval by at least 75 % of the member bodies casting a vote. Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. ISO shall not be held responsible for identifying any o

14、r all such patent rights. International Standard ISO 14881 was prepared by Technical Committee ISO/TC 172,Optics and optical instruments, Subcommittee SC 9,Electro-optical systems. Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Licensed Cop

15、y: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI INTERNATIONAL STANDARDISO 14881:2001(E) ISO 1002 All rithgs rreseved 1 Integrated optics Interfaces Parameters relevant to coupling properties 1Scope This International Standard defines the relevant proper

16、ties for coupling light into and out of integrated optical chips (IOC) and chips with optoelectronic integrated circuits (OEIC). This International Standard is limited to butt coupling via the waveguide endfaces. The definitions provide the basis for specifying the elements to be coupled (e. g. fibr

17、es, integrated optical chips) related to coupling properties. 2Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this International Standard. For dated references, subsequent amendments to, or revisions of, any o

18、f these publications do not apply. However, parties to agreements based on this International Standard are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document r

19、eferred to applies. Members of ISO and IEC maintain registers of currently valid International Standards. ISO 4288:1996,Geometrical Product Specifications (GPS) Surface texture: Profile method Rules and procedures for the assessment of surface texture. ISO 11807-1:1),Integrated optics Vocabulary Par

20、t 1: Basic terms and symbols. ISO 11807-2,Integrated optics Vocabulary Part 2: Terms used in classification. IEC 60793-1-2:1995,Opticalfibres Part 1:Genericspecification Section 2:Measuringmethodsfor dimensions. 3Terms and definitions For the purposes of this International Standard, the terms and de

21、finitions given in ISO 11807-1: and ISO 11807-2 and the following apply. 3.1 anti-reflective coating of endfaces thin surface coating designed to reduce the Fresnel loss 3.2 alignment structure precise mechanical structure to enable coupling of optical and electro-optical elements without the need f

22、or adjustment EXAMPLEElements coupled may include optical fibres, fibre arrays, detectors, lasers, LEDs, integrated optical chips. 3.3 array block mechanical alignment structure of micrometre or submicrometre precision for the reception of optical fibres 1)To be published. Licensed Copy: sheffieldun

23、 sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ISO 14881:2001(E) 2 ISO 1002 All rithgs rreseved NOTE 1The alignment structures, which are generally arranged in a regular pattern, determine the position of the fibres with respect to each other. These positions are de

24、fined by the fibres cladding diameter and the geometry of the alignment structures. NOTE 2An array block may have additional guiding structures for the alignment of the array with an integrated optical chip (see e. g. V-groove array). 3.4 V-groove array array block structured with a number of V-groo

25、ves, generally equally spaced, with identical geometric dimensions NOTEA silicon-V-groove array is commonly manufactured by anisotropically etching a silicon substrate. The angles of the silicon-V-grooves are well defined by the crystal orientation and the etching process. 3.5 fibre array array bloc

26、k with inserted and fixed optical fibres, in which the fibre endfaces lie in one plane 3.6 fibre array coupling coupling that connects several optical fibres simultaneously with several corresponding waveguide endfaces NOTEThe fibres are already adjusted and fixed with respect to each other by the a

27、rray block. The pitch of the array corresponds to the pitch of the integrated optical chip. The kind of adjustment between the fibre array and the integrated optical chip and the kind of fixation depends on the type of the fibre array. 3.7 fibre arrays coupling deviation difference between maximum a

28、nd minimum coupling losses of the single fibres of a fibre array 3.8 butt coupling coupling of two waveguides with their endfaces in contact or nearly in contact 3.9 chip edge edge formed by the chip surface and the chip endface 3.10 chip endface chip-limiting plane, which contains the optical inter

29、face(s) 3.11 chip surface plane parallel and closest to the plane of the waveguide(s) 3.12 coupling efficiency ratio of the optical power coupled into the endface of an optical element(e. g. fibre endface or chip endface) to the emitted optical power at the output endface of the element where is the

30、 power in optical elementat the input endface; is the power in optical elementat the output endface. j i = Pm,j Pl,i ,Pm,j Pl,i Pm,jj Pl,ii Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ISO 14881:2001(E) ISO 1002 All rithgs rreseved 3 3.13

31、 coupling loss loss of optical power obtained when the light is coupled from output endface of one optical element(e. g. fibre endface or chip endface) into the endface of another elementon a logarithmic scale where is the power in optical elementat the input endface; is the power in optical element

32、at the output endface. ISO 11807-1:, 5.5.4.7 NOTE 1Coupling losses can be induced by e. g. radial, axial or angular misalignment or unmatched modefields. The coupling loss is the logarithmic value of the coupling efficiency. NOTE 2Coupling loss is expressed in decibels. 3.14 Fresnel loss loss caused

33、 by reflections at the interface of two media with different refractive indices 3.15 index matching interfacial layer in order to reduce Fresnel losses by matching the refractive indices, andof two media (e. g. quarter-wave layer) 3.16 transformer optical coating with a thickness offor reducing the

34、Fresnel loss by index matching, where is the refractive index of the coating NOTE(see 3.15). 3.17 optical axis line connecting the centroids defined by the first spatial moment of the cross-sectional profile of the power density distribution of the guided wave at successive positions in the directio

35、n of propagation of the wave 3.18 pitch distance between the centres of adjacent fibres or waveguides, which may vary across and with direction NOTE,are defined as pitch in the-,-direction, respectively. 3.19 reference mark mark used as reference in alignment of optical components 3.20 reflective co

36、ating of endface coating of the waveguide endface applied and designed to obtain a desired reflectance c i j c= 10 log(Pm,j/Pl,i) Pm,jj Pl,ii n1n2 /4 /(4nS)nS=n1 n2 P PxPyx y Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ISO 14881:2001(E)

37、4 ISO 1002 All rithgs rreseved 3.21 single-fibre coupling coupling technique in which each optical fibre is adjusted and attached individually to the corresponding waveguide of the integrated optical chip 3.22 waveguide endface area of the chip endface which is determined by the end of the waveguide

38、 4Properties relevant for coupling 4.1General In the following, the characteristics, reference systems, classes for tolerances, and losses are provided that are necessary for the unambiguous description of the properties of integrated optical chips, array blocks and optical fibres relevant for coupl

39、ing. 4.2Chip geometry(see Figure 1) The dimensions listed in Table 1 as well as their tolerances shall be specified. If the endfaces have been inclined, e. g. to minimize reflection, the edges angles shall also be specified. In addition, any deviation of the chip surface from flatness (e. g. bow) sh

40、all be specified. All deviations from flatness and facet roughness are examined in 4.4. For the chip thickness, the preferred dimensions,and are recommended, but not mandatory. NOTEA definition of preferred dimensions for length and width seems not to be convenient at present, because of the differe

41、nt basic materials and chip sizes used. 4.3Waveguide geometry(see Figure 2) The dimensions listed in Table 2 as well as their tolerances shall be specified. The tolerances, expressed in micrometres, of the values of the pitch, shall be referred to the reference mark for each single position. a Direc

42、tion of propagation. Figure 1 Coordinate system and dimensions for integrated optical chips Table 1 Dimensions CharacteristicLengthWidthThickness symbol unit LWT mmmmmm T0,15 mm 0,35 mm 0,525 mm 0,625 mm 1,0 mm2,0 mm P Licensed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, U

43、ncontrolled Copy, (c) BSI ISO 14881:2001(E) ISO 1002 All rithgs rreseved 5 The preferred dimensions,and, are recommended for the pitch, but not mandatory. 4.4Fibre tolerances To reach the necessary low coupling losses with fibre arrays, it is normally necessary to use optical fibres with tolerances

44、substantially lower than those specified by the producer. Thus, tolerances for the dimensions of optical fibres shall be specified (see Table 3). Measurement shall be carried out in accordance with IEC 60793-1-2. For polarization maintenance, the deviation of the core concentricity in this case desc

45、ribes the deviation of the near field centre from the geometrical centre of the fibre. Additionally, the spot size of the fibre according to 4.6 and the coupling loss shall be indicated. 4.5Endface properties(see Figure 3) Measurement ofshall be carried out in accordance with ISO 4288. The dimension

46、s, angles and radii listed in Tables 4 to 6 and their tolerances shall be specified. Figure 2 Position of the waveguides in the chip Table 2 Dimensions to describe the position of the waveguide in the chip (related to the optical axis of the waveguide) CharacteristicDistance to the reference markPit

47、chDepth below the surface symbol unit Table 3 Dimensions of optical fibres to describe deviations Deviation Cladding diameter tolerance Non-circularity of cladding Core diameter tolerance Non-circularity of core Concentricity error of core/cladding unit 0,125 mm 0,25 mm0,4 mmP RPD mmmmmm mmmmm Ra Li

48、censed Copy: sheffieldun sheffieldun, na, Sun Nov 26 12:00:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ISO 14881:2001(E) 6 ISO 1002 All rithgs rreseved Surface coatings (reflective, anti-reflective, quarter-wave layer) shall be indicated. 4.6Spot size The horizontal and vertical near field spot si

49、zes,shall be specified according to ISO 11807-1:, 5.3.12. 4.7Plane of polarization The TE- or TM-mode (see ISO 11807-1:, 5.2.1.4 and 5.2.1.5) shall be given. Figure 3 Coordinate system and dimensions of the chip endface Table 4 Angles to describe the chip endface Characteristic Angle between chip sideface A and endface Angle between chip surface and endface Angle between optical axis of the waveguide and endface perpendicular symbol unit Table 5 Parameters to describe the flatnes

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