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1、E I A 18b-1OE 78 m 3234600 0028559 b m ANS I/E IA RS-186-E-78 Approved October 27, 1978 EIA STANDARD STANDARD TEST METHODS FOR PASSIVE ELECTRONIC * COMPONENT PARTS METHOD IO: EFFECT OF SOLDERING (Revision of RS-l86-D, Method 1 O) OCTOBER 1978 Engineering Department ELECTRONIC INDUSTRIES ASSOCIATION
2、Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 20:20:47 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A Lb-LOE 78 m 3234b00 0025
3、b0 2 m 1 ., NOTICE EIA engineering standards are designed to serve the public interest through eliminating mis- understandings between manufacturers and putchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with mini- mum dela
4、y the proper product for his particular need. Existence of such standards shall not in any respect preclude any member or nonmember of EIA froin manufacturing or selling products not conforming to such standards, nor shall the existence of such standards preclude their voluntary use by those other t
5、han EIA members whether the standard is to be used either domestically or internationally. Recommended standards are adopted by EIA without regard to whether or not their adop- tion may involve patents on articles, materials, or processes. By such action, EIA does not assume any liability to any pat
6、ent owner, nor does it assume any obligation whatever to parties adopting the recommended standards. This Standard contains the major technical contents of International Electrotechnical Com- mission Publication 68-2-20A, Test Tb: Resistance to Soldering Heat, Method 1B. It differs from the IEC Publ
7、ication 68-2-ZOA only in test control and procedure wording. These differences are well known to the U.S. Committee of Experts for the International Electrotechnical Commission Technical Committee 50 and resolution of these differences . will be sought in future meetings of TC-50. Published by ELECT
8、RONIC INDUSTRIES ASSOCIATION Engimerhq Department 2001 Eye Street, N. W.? Waahiagton, D, C, 20006 Q Eleotronlc Industries A8BoclettOa 1979 PRICE: $&OQ Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wi
9、ng, Bernie Not for Resale, 03/30/2007 20:20:47 MDTNo reproduction or networking permitted without license from IHS -,-,- EIA Lb-LOE 78 i 3234b00 00285bL 4 RS-186-IOE Page 1 STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 10 EFFECT OF SOLDERING (From EIA Standard RS-186-D and Stan
10、dards Proposal No. 1271 formulated under the cognizance of the ElA P-9 Committee on Test Methods and Procedures.) INTRODUCTION This Test Method forms a part of the EIA Standard RS-186 which contains test guidance, definitions and standard test conditions. 1. 2. 3. 4. PURPOSE This test is performed t
11、o determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied to integral component termina- stions by a soldering iron
12、 or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly. NOTE 1: (For a test for determining the ability of component
13、 part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.) NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% t i n and 40% lead.) PRECAUTIONS Care should be taken to prevent splashing of molten solder, wh
14、ich could result in serious injury to personnel or unnecessary damage to the test specimens. Care should be taken to avoid the presence of moisture or an abrupt immersion of the specimens. APPARATUS The following equipment is required: (a) Melting pot capable of maintaining a solder bath at the desi
15、red temperature. (b) Timer, (c) Suitable fixtures for supporting specimens during test. PROCEDURE 4.1 Mounting - Specimens shall be mounted in any suitable fixture of low heat-conducting material, It is preferable although not required, that the fixture be so arranged that the specimens are automati
16、cally released from the solder bath upon expiration of the specified time of test. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 20:20:47 MDTNo reproduction or
17、 networking permitted without license from IHS -,-,- E I A 186-1OE 78 3234600 08285b2 6 3 .= RS-186-1OE. Page 2, . If re-equipped with a suitable cam, the mechanical dipping device of EIA Standard RS-178-A may be convenient for performing the immersion and withdrawal operation over the solder bath.
18、4.2 Initial measurements shall be made as specified in the individual component-part standard. 4 . 3 Any dross on top of the solder bath shall be skimmed off immediately prior to dipping terminals into the bath. 4.4 AU component part terminals shall be immersed, one at a time, or if all terminals ar
19、e grouped on one face and the clearance between adjacent terminals is less than one inch (25.4 mm), the terminals shall be dipped simultaneously as a group, Solder bath temperature and immersion time shall conform to the specified severity selected from Table I. TABLE I SOLDER BATH TEMPERATURE IMMER
20、SION TIME, SECONDS SEVERITY RANGE - Co MIN. - MAX. . 350 (662OF) 340 to 360 (644 to 68OoF) 3 4 260 (5OOOF) 255 to 265 (491 to 509OF) 9 17 Terminals shall be immersed in the solder to a point one-eighth (3.17 mm) to three-sixteenths (4.76 mm) of an inch from the component part body. Terminal insulati
21、on shall be considered as part of the component body. 4.5 % i 4 hours after the specimens have been removed from the solder bath, the final measurements shall be made and specimens visually examined for any physical damage. 5. SUMMARY The following details shall be specified in the individual compon
22、ent part standard: 5.1 Severity according to Table I in 4.4. 5.2 Special mounting, if required. 5 . 3 Measurements to be made and measurement methods. 5.4 Percent change in electrical characteristics allowed, Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 20:20:47 MDTNo reproduction or networking permitted without license from IHS -,-,-