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1、 TECHNICAL REPORT IEC TR 62258-3 First edition 2005-06 Semiconductor die products Part 3: Recommendations for good practice in handling, packing and storage Reference number IEC/TR 62258-3:2005(E) Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS
2、Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted without license from IHS -,-,- Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. For example, IEC 34-1 is now refe
3、rred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating amendment 1 and the base publication incorporating amendme
4、nts 1 and 2. Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to this publication, including its validity, is available in the IEC Catalogue of
5、publications (see below) in addition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the list of publications issued, is also available from the foll
6、owing: IEC Web Site (www.iec.ch) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to search by a variety of criteria including text searches, technical committees and date of publication. On-line information is also available on recently issu
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8、Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS
9、 Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted without license from IHS -,-,- TECHNICAL REPORT IEC TR 62258-3 First edition 2005-06 Semiconductor die products Part 3: Recommendations for good practice in handling, packing and s
10、torage PRICE CODE IEC 2005 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commissio
11、n, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch X For price, see current catalogue Commission Electrotechnique Internationale International Electrotechnical Commission Copyright International E
12、lectrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted without license from IHS -,-,- 2 TR 62258-3 IEC:2005(E) CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope and
13、object7 2 Normative references .7 3 Terms and definitions .8 4 Handling Good practice .8 4.1 General.8 4.2 Working environmental controls.8 4.3 General handling precautions8 4.4 Cleanroom good practice.8 5 Process handling issues.12 5.1 Wafer sawing 12 5.2 Die sorting.13 6 Die and wafer transport an
14、d storage media 16 6.1 Wafer carriers and cassettes.16 6.2 In-process carriers and transport systems .17 6.3 Packing for shipment of unsawn wafers.17 6.4 Packing for shipment of sawn wafers.18 6.5 Packing for shipment of single wafers .21 6.6 Packing for shipment of die using trays .21 6.7 Packing f
15、or shipment of die using tape-and-reel 25 6.8 Secondary packing for shipment27 7 Storage good practice 28 7.1 Die and wafer storage .28 7.2 Short-term storage environment and conditions.28 7.3 Storage time limitations.28 7.4 Sawn wafer on wafer frame or ring 29 7.5 Die products in the production are
16、a.29 7.6 Die in tape-and-reel.29 7.7 Dry-packed die products29 8 Traceability good practice.29 8.1 General.29 8.2 Wafer traceability 29 8.3 Die products traceability29 8.4 Wafer and die back side marking.30 9 Guidelines for long-term storage (die banking) of bare die and wafers30 9.1 General.30 9.2
17、Preparing for storage.30 9.3 Damage to die products during long-term storage .31 9.4 Long-term storage environment.31 9.5 Recommended inert atmosphere purity .32 9.6 Chemical contamination 32 9.7 Electrical effects33 Copyright International Electrotechnical Commission Provided by IHS under license w
18、ith IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted without license from IHS -,-,- TR 62258-3 IEC:2005(E) 3 9.8 Protection from radiation33 9.9 Periodic qualification of stored die products .33 10 Good practice fo
19、r automated handling during assembly .34 10.1 Removal of die from shipping media.34 10.2 Equipment out of service .34 Annex A (informative) Planning checklist35 Annex B (informative) Material specifications41 Bibliography .44 Figure 1 Bevel cut for bare die and flip-chip products12 Figure 2 Die ejec
20、t needle .15 Figure 3 Wafer jar structure18 Figure 4 Film frame19 Figure 5 Grip ring.20 Figure 6 Single waffle pack 22 Figure 7 Stacked waffle packs23 Figure 8 Vacuum-release trays.24 Figure 9 Corner relief in the cavity of a chip tray.25 Figure 10 Tape-and-reel packing structure .27 Figure 11 Packa
21、ging material for shipment .27 Table 1 Example die eject marks15 Table A.1 Planning checklist 35 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or ne
22、tworking permitted without license from IHS -,-,- 4 TR 62258-3 IEC:2005(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 3: Recommendations for good practice in handling, packing and storage FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide
23、organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activit
24、ies, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject de
25、alt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determin
26、ed by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committee
27、s. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which the
28、y are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication a
29、nd the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that the
30、y have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature w
31、hatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced pub
32、lications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task o
33、f IEC technical committees is to prepare International Standards. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62
34、258-3, which is a technical report, has been prepared by IEC technical committee 47: Semiconductor devices. The text of this technical report is based on the following documents: Enquiry draft Report on voting 47/1794/DTR 47/1806/RVC Full information on the voting for the approval of this technical
35、report can be found in the report on voting indicated in the above table. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted with
36、out license from IHS -,-,- TR 62258-3 IEC:2005(E) 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 62258, as currently conceived, consists of the following parts, under the general title Semiconductor die products 1 Part 1: Requirements for procurement and u
37、se Part 2: Exchange data formats Part 3: Recommendations for good practice in handling, packing and storage Part 4: Questionnaire for die users and suppliers Part 5: Requirements for information concerning electrical simulations Part 6: Requirements for information concerning thermal simulations Fur
38、ther parts may be added as required. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will
39、 be reconfirmed; withdrawn; replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. 1 At the time of writing, IEC 62258-3 is the only part in existence. Other parts are under consideration. Copyright International Electrotechnical Commission
40、Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted without license from IHS -,-,- 6 TR 62258-3 IEC:2005(E) INTRODUCTION Organizations that helped prepare this technical report inclu
41、ded the ESPRIT GOOD-DIE project, DPC, and JEITA. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted without license from IHS -,-,
42、- TR 62258-3 IEC:2005(E) 7 SEMICONDUCTOR DIE PRODUCTS Part 3: Recommendations for good practice in handling, packing and storage 1 Scope and object This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare
43、die, die and wafers with attached connection structures, and minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by
44、attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle o
45、r use bare die products, from wafer fabrication to final assembly. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references the lasted edition of the referenced docum
46、ent (including any amendments) applies. IEC 60050 (all parts), International Electrotechnical Vocabulary IEC 60286-3, Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes IEC 61340-5-1:1998, Electrostatics Part 5-1: Protection of electronic
47、 devices from electrostatic phenomena General requirements IEC 61340-5-2:1999, Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide IEC 62258-1, Semiconductor die products Part 1: Requirements for procurement and use 2 ISO 14644-1, Cleanrooms and associat
48、ed controlled environments Part 1: Classification of air cleanliness 2 Under consideration. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/09/2007 23:34:37 MSTNo reproduction or networking permitted without license from IHS -,