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1、J IS JAPANESE I NDUSTRIAL STANDARD Translated and Published by Japanese Standards Association Environmental testing-Part 2 : Tests-Test Td : Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) The code number of this Stan
2、dard changed from JIS C 0054 to the following from 20 March 2004. JIS C 60068-2-582002 ICs 19.040; 25.160.50; 31.190 Reference number : JIS C 0054 : 2002 (E) PROTECTED BY COPYRIGHT 14 S Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001,
3、User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction or networking permitted without license from IHS -,-,- C 0054 : 2002 Foreword This translation has been made based on the original Japanese Industrial Standard revised by the Minister of Economy, Trade and Industry through deli
4、berations at the Japanese Industrial Standards Committee, as the result of proposal for revision of Japanese Industrial Standard submitted by the Japan Electronics and Information Technology Industries Association (JEITA) with the draft being attached, based on the provision of Article 12 Clause 1 o
5、f the Industrial Standardization Law applicable to the case of revision by the provision of Article 14. Consequently JIS C 0054 : 1994 is replaced with this Standard. This revision has been prepared based on IEC 60068-2-58 : 1999 Envi- ronmental testing-Part 2-58 : Tests-Test Td : Test methods for s
6、olderabil- ity, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) for the purpose of conforming to the International Standard. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a p
7、atent after opening to the public, utility model right or application for registration of utility model after opening to the public which have technical properties. The relevant Minister and the Japanese Industrial Standards Committee are not responsible for identifying the patent right, application
8、 for a patent after opening to the public, utility model right or application for registration of utility model after opening to the public which have the said technical properties. Date of Establishment: 1994-04-01 Date of Revision: 2002-03-20 Date of Public Notice in Official Gazette: 2002-03-20 I
9、nvestigated by: Japanese Industrial Standards Committee Standards Board Technical Committee on Electronics JIS C 0054 : 2002, First English edition published in 2003-01 Translated and published by: Japanese Standards Association 4-1-24, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any d
10、oubts arising as to the contents, the original JIS is to be the final authority. O JSA2003 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without p
11、ermission in writing from the publisher. Printed in Japan PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction or networking permitted without
12、license from IHS -,-,- C 0054 : 2002 Contents Page Introduction . 1 2 3 4 5 5.1 6 6.1 6.2 6.3 6.4 7 7.1 8 8.1 8.2 8.3 8.4 8.5 9 9.1 9.2 10 Scope Normative references Definitions . Preconditioning Solder bath method . Test apparatus and materials for the solder bath method Procedure for solder bath m
13、ethod Number of specimens Clamping . Fluxing . Solder immersion . Solder reflow methods Test apparatus and materials . Test procedure of reflow method Number of specimens Application of solder paste Placement of specimens Preheating . Solder reflow . Flux removal Recovery Evaluation . Information to
14、 be given in the relevant specification 1 1 1 2 2 2 2 3 3 3 3 3 4 4 5 5 5- 5 5 5 8 8 8 9 PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction o
15、r networking permitted without license from IHS -,-,- C 0054 : 2002 Annex A (normative) Criteria for visual examination . 11 Annex B (informative) Guidance 13 Annex 1 (informative) Method of measuring temperature and treatments of moisture soaking and baking for semiconductor SMDs 15 Annex 2 (inform
16、ative) Comparison table between JIS and corresponding International Standard . 17 (ii) PROTECTED BY COPYFtIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction or
17、 networking permitted without license from IHS -,-,- JAPANESE INDUSTRIAL STANDARD JIS C 60068-2-5812002 Environmental testing-Part 2 : Tests- Test Td : Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Introduction This
18、 Japanese Industrial Standard has been prepared based on the second edition of IEC 60068-2-58 Environmental testing-Part 2-58 : Tests-Test Td : Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) published in 1999 with mo
19、difying the technical contents. Portions with sidelines or underlined with dots are the matters in which the original International Standard is modified. The modified contents and their explanations are shown in annex 2. 1 Scope This Standard outlines test Td, applicable to surface mounting devices
20、(SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electro- technical products are in JIS C 0050 and JIS C 0053, for which guidance is given in IEC 60068-2-44. This Standard provides standard procedures for determining the solderability, re- sistance to dissolution of metallizat
21、ion and resistance to soldering heat of surface mounting devices (SMD) (hereafter referred to as “specimens”), The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to
22、reflow systems. Remarks : The International Standard corresponding to this Standard is as fol- lows. In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) ac- co
23、rding to ISODEC Guide 21. IEC 60068-2-58 : 1999 Environmental testing-Part 2-58 : Tests-Test Td : Test methods for solderability, resistance to dissolution of metallization and to solder- ing heat of surface mounting devices (SMD) (MOD) 2 Normative references The following standards contain provisio
24、ns which, through reference in this Standard, constitute provisions of this Standard. If the indication of the year of coming into effect is given to these referred standards, only the edi- tion of indicated year constitutes the provision of this Standard but the revision and amendment made thereaft
25、er are not applied. The normative references without the indication of the year of coming into effect apply limiting only to the most recent edition (including amendments). PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/11
26、11111001, User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction or networking permitted without license from IHS -,-,- 2 C 0054 : 2002 JIS C O010 Remarks : IEC 60068-1 : 1988 Environmental testing-Part 1 : General and guid- ance is identical with the said standard. JIS C 0050 Basi
27、c environmental testing procedures Part 2 : Tests. Test T : Sol- Remarks : IEC 60068-2-20 : 1979 Environmental testing-Part 2- JIS C 0053 Environmental testing Part 2 : Tests. Test Ta : Soldering. Solder- Remarks : IEC 60068-2-54 : 1985 Environmental testing-Part 2-Test Ta : Sol- derability testing
28、by the wetting balance method is identical with the said standard. Copper-clad laminates for printed wiring boards-Glass fabric base, epoxy resin IEC 60249-2-4 : 1987 Base materials for printed circuits-Part 2 : Speci- fications-No. 4 : Epoxy woven glass fibre copper-clad laminated sheet, general pu
29、rpose grade is equivalent to the said standard. Environmental testing Part 1 : General and guidance dering Test T .- Soldering is identical with the said standard. ability testing by the wetting balance method JIS C 6484 Remarks : JIS Z 3282 IEC 60068-2-44 : 1995 Environmental testing-Part 2-Guidanc
30、e to Test T : Sol- dering IEC 60068-2-69 : 1995 Environmental testing-Part 2-Guidance to Test Te : Soldering : Solderability testing of electronic components for surface mount technology by the wetting balance method IEC 60749 : 1996 Semiconductor device-Mechanical and climatic test methods Soft sol
31、ders-Chemical compositions and forms 3 Definitions For the purposes of this Standard, the definitions as defined in JIS C O010 and JIS C 0050 apply. 4 Preconditioning 4.1 The specimen shall be tested in the “as-received” condition unless otherwise specified by the relevant specification. Care should
32、 be taken that no contamination, by contact with the fingers or by other means, occurs. 4.2 methods of 4.5 of JIS C 0050 shall be used. When accelerated ageing is prescribed by the relevant specification, one of the 4.3 Prior to the resistance to soldering heat test, specimens of semiconductor SMDs
33、in plastic encapsulation shall be soaked and/or baked in accordance with the rel- evant specification of IEC 60749. The relevant specification of IEC 60749 is described in annex 1. Information : 5 Solder bath method 5 . 1 Test apparatus and materials for the solder bath method PROTECTED BY COPYRIGHT
34、 Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction or networking permitted without license from IHS -,-,- 3 C 0054 : 2002 5.1.1 Solder bath The solder bath dimensi
35、ons shall comply with the requirements of 4.6.1 of JIS C 0050. 5.1.2 Flux The flux shall comply with the requirements of 4.6.2, 6.6.1 or 6.6.2 of JIS C 0050 as prescribed by the relevant specification. 5.1.3 Solder The solder composition shall be 60 % tin and 40 % lead according to annex B of JIS C
36、0050. NOTE : Solder may be used S-n 60 Pb 40 A (H 60 A) or S-Sn 63 Pb 37 A (H 63 A) of JIS Z 3282 according to the agreement between the parties con- . cerned. 6 Procedure for solder bath method 6.1 Number of specimens A specimen shall not be used for more than one test. 6.2 Clamping The specimen sh
37、all be placed in a stainless steel clip as shown in figure 1. No part of the clip jaws shall make contact with the areas to be examined. The specimen shall remain in the clip while being fluxed and dipped in the solder. 6 . 3 slowly. Any excess flux shall be removed by contact with absorbent paper.
38、Fluxing The specimen shall be completely immersed in flux and withdrawn 6.4 Solder immersion When preheating is prescribed by the relevant specifica- tion, the specified duration and temperature shall be applied immediately prior to the immersion of the specimen in the solder bath. n = View of surfa
39、ce to be examined Figure 1 Examples of immersion 6.4.1 Severities The duration and temperature of immersion shall be selected from table 1, unless otherwise prescribed by the relevant specification. Guidance on the choice of severities, including those for lower grades of resistance to soldering hea
40、t and dissolution of metallization, is given in annex B.3. PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction or networking permitted without
41、 license from IHS -,-,- 4 C 0054 : 2002 Property tested Wetting Table 1 Severities (duration and temperature) Severity (235 -+ 5) “C (310.3)s ( 1 O i l ) s (40irl)s (220.2)s (510.5)s (10kl)s (5k0.5) (10Il)s (30kl)s (215 +r 3) “C (260-r 5) “C X X X X Resistance to heat soldering Dewetting dissolution
42、 of metallization X X X X X X NOTE : Durations marked with X are to be applied. The oxide film on the solder bath shall be skimmed off immediately before im- The immersion and withdrawal speed shall be between 20 mm/s and 25 mm/s. mersion. 6.4.2 Attitude Two attitudes of immersion are standardized:
43、Attitude A: For most specimens, the areas to be examined shall be immersed not less than 2 mm below the solder meniscus (but not to a greater depth than necessary; see figure i) with the seating plane vertical. Attitude B: For certain specimens (see B . 3 . 4 1 , the specimen may be floated on the s
44、older, but only when testing resistance to soldering heat. If the relevant specification does not mention the attitude, attitude A shall be adopted. 7 Solder reflow methods 7.1 Test apparatus and materials The following two methods may be used to determine the suitability of SMDs for reflow solderin
45、g or when they are only de- signed for reflow soldering processes and when the solder bath (dipping) method is not appropriate. Where the characteristics of an SMD are such that both reflow methods are appli- cable, then infrared, forced gas or vapour phase shall take precedence over hot plate reflo
46、w. The applicable test method shall be stated in the relevant specification. 7.1.1 Solder paste The particle mesh size of the solder paste shall be 160 or finer. The metal composition shall be in accordance with the solder specification B.l of The composition of the flux shall comply with the flux s
47、pecification in annex C of JIS C 0050. JIS C 0050, PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/15/2007 19:31:07 MDTNo reproduction or networking permitted without license
48、 from IHS -,-,- 5 c 0054 : 2002 The viscosity range and method of measurement shall be specified in the relevant specification. 7.1.2 Test substrates 7.1.2.1 Test substrates for infrared, forced gas or vapour phase solder reflow The test substrate shall consist of an unmetallized (no tracks or lands) piece of ce- ramic (alumina 90 % to 98 %) or glass epoxy (see JIS C 6484). Dimensional details shall be given in the relevant specification. 7.1.2.2 Test substrate for hot plate solder reflow The test substrate shall consist of a