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1、J IS JAPANESE I N DU STR I AL STANDARD Translated and Published by Ja pan ese Stand a rds Association JIS Z 3198-3:2*03 Test methods for lead-free solders- Part 3 : Methods for spread test ICs 25.160.50 Reference number : JIS Z 3198-3 : 2003 (E) PROTECTED BY COPYRIGHT 5 s Copyright Japanese Standard
2、s Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/11/2007 00:20:48 MSTNo reproduction or networking permitted without license from IHS -,-,- Z 3198-3 : 2003 Foreword This translation has been made based on the original Japanes
3、e Industrial Standard established by the Minister of Economy, Trade and Industry through deliberations at the Japanese Industrial Standards Committee according to the proposal of establishing a Japanese Industrial Standard from The Japan Welding Engineering Society (JWES), with a draft of Industrial
4、 Standard based on the provision of Article 12 Clause 1 of the Industrial Standardization Law. Soldering is called HANDAZUKE (Japanese), a technique to be used for mounting electronic and electrical machinery and apparatus, communication equipment and the like and its use field is wide and expectati
5、on for high reliability of the connection is large. Though there are standards inside and outside Japan as well as International Standards like IEC or ISO, this Standard uses results of “standardization of test methods and the like necessary for solder connection corresponding to the reduction of an
6、 environmental load” based on the research and development by contract of New Energy and Industrial Technology Development Organization. This Standard concerns the methods for spread test of lead-free solders which are environmentally friendly and is positioned as a standard for considering environm
7、ent. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a patent after opening to the public, utility model right or application for registration of utility model after opening to the public which have technical properties. The re
8、levant Minister and the Japanese Industrial Standards Committee are not responsible for identifying the patent right, application for a patent after opening to the public, utility model right or application for registration of utility model after opening to the public which have the said technical p
9、roperties. JIS Z 3198 includes the following 7 parts with the general title Test methods for lead- free solders Part 1 : Methods for measuring of melting temperature ranges Part 2 : Methods for testing of mechanical characteristics-tensile test Part 3 : Methods for spread test Part 4 : Methods for s
10、olderability test by a wetting balance method and a contact angle Part 5 : Methods for tensile tests and shear tests on solder joints Part 6 : Methods for 45”pull test of solder joints on QFP lead Part 7 : Methods for shear strength of solder joints on chip components method Date of Establishment: 2
11、003-06-20 Date of Public Notice in Oficial Gazette: 2003-06-20 Investigated by: Japanese Industrial Standards Committee Standards Board Technical Committee on Welding JIS Z 3198-3 : 2003, First English edition published in 2003-12 Translated and published by: Japanese Standards Association 4-1-24, A
12、kasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any doubts arising as to the contents, the original JIS is to be the final authority. O JSA 2003 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic
13、 or mechanical, including photocopying and microfilm, without permission in writing from the publisher. Printed in Japan PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/11/20
14、07 00:20:48 MSTNo reproduction or networking permitted without license from IHS -,-,- Z 3198-3 : 2003 Contents Page Introduction . 1 2 3 4 5 6 7 7.1 7.2 7.3 7.4 8 Scope Normative references Definitions Outline of test Material and reagents Apparatus and equipment . Procedure of test Pretreatment of
15、copper sheet Shape of sample solder . Flux (Halogen-activated rosin flux) . Test Calculation of spread rate . 1 1 1 1 1 1 2 3 3 3 4 4 4 PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for R
16、esale, 03/11/2007 00:20:48 MSTNo reproduction or networking permitted without license from IHS -,-,- JAPANESE INDUSTRIAL STANDARD JIS Z 3198-3 2003 Test methods for lead-free solders- Part 3 : Methods for spread test Introduction This Japanese Industrial Standard specifies the method for spread test
17、 for evaluation of wettability of lead-free solders based on occu.pationa1 results by contract of New Energy and Industrial Technology Department Organization con- cerning “the standardization of test methods and the like necessary for solder con- nection corresponding to the reduction of an environ
18、mental load” carried out in 2000 and 2001. 1 Scope This Standard specifies the method of spread test of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like. 2 No
19、rmative references The following standards contain provisions which, through reference in this Standard, constitute provisions of this Standard. The most recent editions of the standards (including amendments) indicated below shall be applied. JIS B 7502 JIS H 3100 JIS K 5902 JIS K 8034 JIS K 8839 J
20、IS R 3503 JIS Z 3001 JIS Z 3284 Micrometer callipers Copper and copper alloy sheets, plates and strips Colophonium Acetone 2-Propanol Glass apparatus for chemical analysis Welding terms Solder paste 3 Definitions 3001 and the following definitions apply: a) For the purposes of this Standard, the def
21、initions given in JIS Z lead-free solder It is the generic term of “a tin based solder” not containing lead as an alloy component. It is “a solder not containing lead” for a use corre- sponding to that of “a tin-lead based solder”, which is used for mounting an elec- trical, electronic, communicatio
22、n equipment and the like. 4 Outline of test Place a lead-free solder (hereafter referred to as “solder”) sample and a flux on a copper plate. After melting by heating for a specific time, evaluate wettability of the solder by measuring the spread rate of the solder. 5 Material and reagents a) Copper
23、 sheet Phosphorus-deoxidized copper sheet C122OP or C1201P speci- b) Material and reagents shall be as follows: fied in JIS H 3100 of which the size is 30 mm x 30 mm x 0.3 mm. Rosin Rosin of class 2 specified in JIS K 5902. PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by
24、IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/11/2007 00:20:48 MSTNo reproduction or networking permitted without license from IHS -,-,- 2 Z 3198-3 : 2003 2-Propanol 2-Propanol specified in JIS K 8839. Cleaning solvent A solvent suitable for removi
25、ng a flux residue after solder- ing. 0.5 mass % ammonium persulfate solution Dissolve 250 g of ammonium persulfate in water and carefully add 5 ml of concentrated sulfuric acid (1.84 in specific gravity). Thereafter, stir, cool and dilute to 11. Prepare this solution each use. 5 mass % sulfuric acid
26、 Carefully add 50 ml of concentrated sulfuric acid (1.84 in specific gravity) to 400 ml of water. Stir, cool and dilute to 1 I with water. Acetone Acetone specified in JIS K 8034. Refined water Distilled water or ionexchanged water of =f 5 k C 2 m in specific resistance at 20 OC. 6 Apparatus and equ
27、ipment The apparatus and equipment shall be as follows: Solder bath The solder bath is provided by filling solder S 200 “C in liquidus line temperature (for example, Sn-58Bi solder) in a solder tank 2 30 mm in depth and r 100 mm x 150 mm in width and is equipped with a temperature regula- tor capabl
28、e of controlling at a test temperature (250 O C t 3 OC) specified in 7.4 c). Dryer The dryer is of an air circulation type, which can be set at 100 O C k 3 O C and held. Elevator The elevator is suitable for bringing a test piece to a horizontal con- tact with a molten solder surface of a solder bat
29、h and horizontally pulling up the test piece (see Fig. 1). PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/11/2007 00:20:48 MSTNo reproduction or networking permitted without
30、 license from IHS -,-,- 3 Z 3198-3 : 2003 Unit: mrn Elevator Sample holder I 7 1 , Heater -/ a) Basic structural figure b j Sample holder Fig. 1 Basic structural figure and sample holder d) Scrubber A scrubber which can easily remove a surface solder oxidized film of a solder bath. Micrometer A micr
31、ometer which is specified in JIS B 7502 or has a measur- ing precision at least equivalent in quality thereto. Microsyringe or micropipette A microsyringe or a micropipette capable of a measurement to 0.02 ml. e) f) g) General experimental implement All glass implements to be used for this test shal
32、l be specified in JIS R 3503. 7 Procedure of test 7 . 1 Pretreatment of copper sheet A copper sheet is pretreated by the method specified in 4 (2) of Annex 4 of JIS Z 3284. 7.2 Shape of sample solder A solder sample is provided by being machined in a disc plate shape 6.5 mm in diameter and 1.24 rnm
33、in height (0.041 cm3 in vol- ume). PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/11/2007 00:20:48 MSTNo reproduction or networking permitted without license from IHS -,-,-
34、4. Z 3198-3 : 2003 7 . 3 the following procedure: a) Flux (Halogen-activated rosin flux) A flux is prepared in accordance with Add 25 gir 0.1 g of a rosin specified in class 2 of JIS K 5902 to 75 gir 0.1 g of 2- propanol, quietly dissolve by heating, make it uniform solution by stirring, add 0.39 g
35、k 0.01 g of diethylamine hydrochloride(1) and dissolve by quietly stirring. After cooling, weigh and add the evaporated amount of 2-propanol. This flux(2) contains 0.5 g of a chlorine amount for every rosin content. Notes (1) For the diethylamine hydrochloride, that dried at 110 “C f 2 “C for 2 h is
36、 used. (2) The flux is put in a hermetically sealed container and stored in a cold dark place. b) 7.4 Test The test shall be as follows: a) Drip 0.02 ml of flux onto the centre of a copper sheet by using a microsyringe or a micropipette and place a solder sample thereon so as to be positioned at the
37、 centre of the copper sheet. Heat this at 100 “C x 2 min in a drier, evaporate a solvent in the flux and make a test piece therefrom. Make 5 test pieces. Set a solder temperature of the solder bath at 250 “C k 3 “C. Bring the test piece to a horizontal contact with the molten solder of the solder ba
38、th by using an elevator. Remove the oxidized film on the surface of the molten solder with a scrubber just before bringing the test piece to a contact with it. After the test piece comes in contact with the molten solder, hold it under that state for 30 s, and let the solder sample spread on the cop
39、per sheet. Pull up horizontally the test piece from the solder bath with the elevator and naturally cool it to a room temperature. Remove the flux residue with a suitable cleaning solvent. b) c) d) e) f) g) 8 Calculation of spread rate Measure the height of the solder spread by mea- suring with a mi
40、crometer or other suitable implement. Calculate the spread rate according to the following formula. Repeat this operation for five sheets, obtain the average value and take it as the spread rate of the sample. x 100 D-H S R = where, SR : spread rate (%) H : height of spread solder (mm) D : diameter
41、when the solder used for a test is con- sidered as a ball (mm) D = 1.24P3 V : masddensity of the solder sample used for the test PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale,
42、03/11/2007 00:20:48 MSTNo reproduction or networking permitted without license from IHS -,-,- Errata for J I S Gnglish edition) are printed in Standardization Journal, published monthly by the Japanese Standards Association, and also provided to subscribers of JIS (English edition) in Monthly Inform
43、arion. Errata will be provided upon request, please contact: Standardization Promotion Department, Japanese Standards Association 4-1-24, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN TEL. 03-3583-8002 FAX. 03-3583-0462 100% Recycled paper PROTECTED BY COPYRIGHT Copyright Japanese Standards Association Provided by IHS under license with JSALicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/11/2007 00:20:48 MSTNo reproduction or networking permitted without license from IHS -,-,-