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1、切片缺點模式說明 Cross-section Defect Mode,內容介紹 (CONTENT),1. 通孔(Through via) 1.1. 熱應力前(Before thermal stress test) 1.1.1. 孔銅厚度/穿孔力(Copper thickness / Throwing power ) 1.1.2. 鍍銅斷裂(Plating crack) 1.1.3. 孔破(Plating void) 1.1.4. 壓合空泡(Air bubble) 1.1.5. 燈蕊效應(Wicking) 1.1.6. 回蝕(Etch back) 1.1.7. 反回蝕(Negative etch
2、 back) 1.1.8. 釘頭(Nail Head) 1.1.9. ICD-膠渣(Smear) 1.1.10. ICD-內層銅分離(Inner layer connection separation) 1.1.11. 孔壁粗糙度(Hole wall roughness),內容介紹 (CONTENT),1.2. 熱應力後(After thermal stress test) 1.2.1. 孔壁浮離(Pull away) 1.2.2. 樹脂內縮(Resin recession) 1.2.3. 內層連接不良(Innerlayer Connection Defect) 1.2.4. 鍍銅斷裂(Cra
3、ck) 2. 盲孔(Blind via) 2.1. 一般盲孔 2.1.1. 銅厚(Copper thickness) 2.1.2. 碗型孔(Barrel Shaped) 2.1.3. 蟹腳(Crab feet) 2.1.4. 雷射膠渣(Laser smear) 2.1.5. 跳鍍(Step plating) 2.1.6. 孔破(bubble void) 2.2. 電鍍填孔(Fill via by plating) 2.2.1. 填孔凹陷(Dimple) 2.2.2. 空泡(Air bubble),內容介紹 (CONTENT),3.外觀檢查(Visual inspection): 3.1.背光(
4、Back Light) 3.2.板面燒焦(Burning) 3.3.電鍍顆粒(Copper Nodule) 3.4.鍍銅均勻性(Uniformity) 3.5.凹陷(Pin & Dent) 3.6.刮傷(Scrab) 3.7.板面粗糙(Panel roughness) 3.7.板面氧化(Surface Oxide),1.1.1.a 孔銅銅厚：Hole copper thickness,Criteria : Min. 0.8 Mil (),1 2 3,4 5 6,1,量測孔徑，以確保切 片準確性,1.1.1.b 面銅銅厚：Surface copper thickness,7,9,10,8,1.1
5、.1.c 穿孔力：Throwing Power,通孔銅厚之最小值 面銅平均值(不含基材銅),穿孔力=,Throwing Power =,Minimum of hole copper thickness Average of surface copper thickness,Specification: P.P thickness75Mil T/P=75% (),1.1.1.c 穿孔力：Through Power,1.1.2. 鍍銅斷裂：Plating crack,Criteria : Not Allowed,Crack,1.1.3. 孔破：Plating void,Criteria : Not
6、 Allowed,NG,1.1.4. 壓合空泡：Air bubble,Criteria : Not Allowed,1.1.5. 燈蕊效應 (Wicking),Accept,Reject,Spec.: 3 mil,1.1.6. 回蝕 (Etch back),Reject,Spec.: 3 mil,Accept,1.1.7. 反回蝕 (Negative etch back),Accept,Reject,Spec.: 1 mil,1.1.8. 釘頭 (Nail Head),Accept,Reject,Spec.: B/A 1.7 for 1 oz B/A 2.0 for 0.5 oz,1.1.9.
7、 ICD-膠渣 (Smear),膠渣造成ICD (Smear causes ICD),Not Allowed,1.1.10. ICD-內層銅分離 (Inner plane separation),Reject,Reject,1.1.11. 孔壁粗糙度 (Hole wall roughness),Spec.: 1.4 mil,1.2.1. 孔壁浮離 (Pull Away),Reject,Spec.:浮離部份之長度板厚20,1.2.2. 樹脂內縮 (Resin recession) (after T/S test),Spec.:Width: Max. 3 mil No longer 20% of
8、cumulative base material thickness.,Spec.:最大：3.0MIL，且內縮部份之長度板厚20,1.2.2. 樹脂內縮計算方式 (Resin recession measuring),1.2.3. 內層連接不良 (ICD) (after T/S test),Reject,Reject,1.2.4. 鍍銅斷裂 (Crack) (after T/S test),Reject,Reject,2.1.1. 銅厚(Copper thickness),2.1.2. 碗型孔 (Barrel shaped),B,A,B/A 1.16,2.1.3. 蟹腳 (Under cut)
9、,Under Cut Max. 10 um,Spec.: 10um,2.1.4. 雷射膠渣 (Smear ),Reject,2.1.5. 跳鍍(Step plating),2.1.6. 盲孔孔破(Void),2.2.1. 填孔：Dimple,Dimple 10 m,Criteria : Max. 10 m,量測數據(measuring): 1.Dimple 2.P.P厚度(P.P. thickness) 3.上開口(Top width) 4.下開口(Bottom width),2,3.,4,2.2.1. 填孔：Dimple,2.2.2. 盲孔空泡(Air bubble),3.1. 背光(Back Light),SPEC.8級,