《基于熔焊的MEMS真空封装研究.pdf》由会员分享，可在线阅读，更多相关《基于熔焊的MEMS真空封装研究.pdf（5页珍藏版）》请在三一文库上搜索。
1、EPE 电子工业专用设备 Equipment for Electronic Products Manufacturing PCB the process has been investigated in details while evaluating the yield of finished products. The author also studied the factors influencing the pressure in the vacuum packaged MEMS devices, and measured the strength of the MEMS vacuu
2、m packed devices Key words: Vacuum packaging; MEMS; Fusion welding; 1 引 言 MEMS 是指可以批量制作的，集微型机构、微型传感器和微执行器以及信号处理和控制电路， 直至接口、通讯和电源等于一体的微型系统。高性能的射频、惯性、机械谐振器等MEMS器件都需 要进行真空封装，而真空封装是MEMS 封装技术的难点。 目前 MEMS 器件真空封装主要采用真空回流焊工艺。真空回流焊工艺一致性差，导致真空封装 后产品的成品率低。真空熔焊工艺就能克服真空回流焊的以上不足。目前虽然利用熔焊工艺进行气密 封装比较普遍，但还未见到熔焊工艺和装置
3、用于真空封装的报道。 本课题组将真空系统与熔焊系统首次集成起来实现器件级MEMS 真空封装。通过真空系 统先将封装设备腔体的气压抽取到一定的气压值，然后再利用熔焊系统将真空封装专用壳体 封装起来，来实现真空封装。 2 真空熔焊封装： 2.1真空封装形式： EPE 电子工业专用设备 Equipment for Electronic Products Manufacturing PCB 301-306. 4Davy JG. “ Calculation for leak rates of hermetic packages,” IEEE Trans,Parts,Hybrids, and Packag
4、ing 1975;PHP-11(3):177 89. 5Davy JG. “ Model calculations for maximum allowable leak rates of hermetic packages,” J Vac Sci Technol 1975; 12(1): 423 9. 6Chiao Mu, Lin Liwei, “ Vacuum packaging of microresonators by rapid thermal processes,” SPIE 2002; 4700: 274 8. 7Howl D A, Mann CA . The back-press
5、urization technique of leak testing. Vacuum 1965; 15: 347 52. 8S. C. Wang, P. S. Wei, “ Modeling Dynamic Electrical Resistance During Resistance Spot Welding,” Transactions of the ASME. 9Yu-T. Cheng, Wan-Tai Hsu, Clark T.-C. Nguyen , and Liwei Lin, “ Vacuum Packaging Technology Using Localized Alumi
6、num/Silicon-to-Glass Bonding,” Jounal of MicroElectronical Systems, Vol.11, NO5, October 2002. 10Thierry Corman, Peter Enoksson, Goran Stemme, “ Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding,” sensors and Actuators (1997) 249-255. 11任爱华，王亚平，储能焊机的工作原理及应用，2004.1：43-45. 12索林生，电容储能焊参数优化设计，邯郸大学学报，1998，1：36-41