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1、CC2540F128, CC2540F256 SWRS084 OCTOBER 2010 2.4-GHz Bluetoothlow energy System-on-Chip Check for Samples: CC2540F128, CC2540F256 1FEATURESPeripherals 23456True Single-Chip BLE Solution: CC2540 Can12-Bit ADC with Eight Channels and Run Both Application and BLE Protocol Stack,Configurable Resolution I
2、ncludes Peripherals to Interface With Wide Integrated High-Performance Op-Amp and Range of Sensors, Etc. Ultralow-Power Comparator 6-mm 6-mm Package General-Purpose Timers (One 16-Bit, Two RF8-Bit) Bluetooth low energy technology21 General-Purpose I/O Pins (19 4 mA, 2 Compatible20 mA) Excellent Link
3、 Budget (up to 97 dB),32-kHz Sleep Timer With Capture Enabling Long-Range Applications Without Two Powerful USARTs With Support for External Front End Several Serial Protocols Accurate Digital Received Signal-Strength Full-Speed USB Interface Indicator (RSSI) IR Generation Circuitry Suitable for Sys
4、tems Targeting Compliance Powerful Five-Channel DMA With Worldwide Radio Frequency AES Security Coprocessor Regulations: ETSI EN 300 328 and EN 300 Battery Monitor and Temperature Sensor 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)Each CC2540 Contains a Unique 48-bit IEEE A
5、ddress Layout Development Tools Few External Components CC2540 Mini Development Kit Reference Design Provided Royalty-Free Bluetooth low energy Protocol 6-mm 6-mm QFN40 Package Stack Low Power SmartRF Software Active Mode RX Down to 19.6 mA Supported by IAR Embedded Workbench Active Mode TX (6 dBm):
6、 24 mA Software for 8051 Power Mode 1 (3-ms Wake-Up): 235 mA Power Mode 2 (Sleep Timer On): 0.9 mA APPLICATIONS Power Mode 3 (External Interrupts): 0.4 mA 2.4-GHz Bluetooth low energy Systems Wide Supply Voltage Range (2 V3.6 V)Mobile Phone Accessories Sports and Leisure EquipmentFull RAM and Regist
7、er Retention in All Power ModesConsumer Electronics Human Interface Devices (Keyboard, Mouse,Microcontroller Remote Control) High-Performance and Low-Power 8051 USB Dongles Microcontroller Core Health Care and Medical In-System-Programmable Flash, 128 KB or 256 KB 8-KB SRAM A 1 Please be aware that
8、an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2SmartRF is a trademark of Texas Instruments. 3Bluetooth is a registered trademark of Bluetooth
9、SIG, Inc. 4Supported by IAR Embedded Workbench is a trademark of IAR Systems AB. 5ZigBee is a registered trademark of ZigBee Alliance. 6All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright 2010, Texas Instruments I
10、ncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. RESET WATCHDOG TIMER IRQ CTRLFLASH CTRL DEBUG INTERFACE CLOCK MUX and CALIBRATION DMA 8051 CPU CORE 32-MHz CRYSTAL OS
11、C OP-AMP 32.768-kHz CRYSTAL OSC HIGH- SPEED RC-OSC POWER MANAGEMENT CONTROLLER USART 0 USB USART 1 TIMER 1 (16-Bit) TIMER 3 (8-Bit) TIMER 4 (8-Bit) TIMER 2 (BLE LL TIMER) FLASH SRAM SRAM FIFOCTRL1 KB SRAM ON-CHIP VOLTAGE REGULATOR POWER-ON RESET BROWN OUT VDD (2 V3.6 V) DCOUPL RESET_N XOSC_Q2 XOSC_Q
12、1 P2_4 P1_7 P0_7 P2_3 P1_6 P0_6 P2_2 P1_5 P0_5 P1_2 P0_2 P2_1 P1_4 P0_4 P1_1 P0_1 P2_0 P1_3 P0_3 P1_0 P0_0 MODULATORDEMODULATOR RECEIVETRANSMIT FREQUENCY SYNTHESIZER SYNTH RF_PRF_N B0301-05 RADIO REGISTERS SFR BusSFR Bus DS ADC AUDIO/DC AES ENCRYPTION AND DECRYPTION MEMORY ARBITRATOR FLASH RAM UNIFI
13、ED SFR IRAM XRAM PDATA SLEEP TIMER 32-kHz RC-OSC I/O CONTROLLER DIGITAL ANALOG MIXED ANALOG COMPARATOR USB_N USB_P Radio Arbiter Link Layer Engine CC2540F128, CC2540F256 SWRS084 OCTOBER DESCRIPTION The CC2540 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy applicat
14、ions. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. The CC2540 combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and periph
15、erals. The CC2540 is suitable for systems where very low power consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption. The CC2540 comes in two different versions: CC2540F128/F256, with 128 and 256 KB of f
16、lash memory, respectively. Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540F128/F256 forms the markets most flexible and cost-effective single-mode Bluetooth low energy solution. 2Submit Documentation FeedbackCopyright 2010, Texas Instruments Incorporated Prod
17、uct Folder Link(s): CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084 OCTOBER 2010 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can c
18、ause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS(1) MINMAXU
19、NIT Supply voltageAll supply pins must have the same voltage0.33.9V 0.3VDD + 0.3, Voltage on any digital pinV 3.9 Input RF level10dBm Storage temperature range4085C All pads, according to human-body model, JEDEC STD 22, method 2kV A114 ESD(2) According to charged-device model, JEDEC STD 22, method C
20、101500V (1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposu
21、re to absolute-maximum-rated conditions for extended periods may affect device reliability. (2)CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage. RECOMMENDED OPERATING CONDITIONS MINMAXUNIT Operating ambient temperature range, TA40
22、85C Operating supply voltage23.6V ELECTRICAL CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA= 25C and VDD = 3 V PARAMETERTEST CONDITIONSMINTYPMAXUNIT Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD235 and
23、sleep timer active; RAM and register retention Power mode 2. Digital regulator off; 16-MHz RCOSC and A 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and0.9 IcoreCore current consumption sleep timer active; RAM and register retention Power mode 3. Digital regulator off; no clocks; POR active;
24、0.4 RAM and register retention Low MCU activity: 32-MHz XOSC running. No radio or 6.7mA peripherals. No flash access, no RAM access. Timer 1. Timer running, 32-MHz XOSC used90mA Timer 2. Timer running, 32-MHz XOSC used90mA Peripheral current consumption Timer 3. Timer running, 32-MHz XOSC used60mA I
25、peri(Adds to core current Icorefor each Timer 4. Timer running, 32-MHz XOSC used70mA peripheral unit activated) Sleep timer, including 32.753-kHz RCOSC0.6mA ADC, when converting1.2mA Copyright 2010, Texas Instruments IncorporatedSubmit Documentation Feedback3 Product Folder Link(s): CC2540F128 CC254
26、0F256 CC2540F128, CC2540F256 SWRS084 OCTOBER GENERAL CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA= 25C and VDD = 3 V PARAMETERTEST CONDITIONSMINTYPMAXUNIT WAKE-UP AND TIMING Digital regulator on, 16-MHz RCOSC and 32-MHz crystal Power mode 1 Active4ms oscillator of
27、f. Start-up of 16-MHz RCOSC Digital regulator off, 16-MHz RCOSC and 32-MHz crystal Power mode 2 or 3 Active120ms oscillator off. Start-up of regulator and 16-MHz RCOSC Crystal ESR = 16 . Initially running on 16-MHz RCOSC, 410ms with 32-MHz XOSC OFF Active TX or RX With 32-MHz XOSC initially on160ms
28、RX/TX turnaround150ms RADIO PART RF frequency rangeProgrammable in 2-MHz steps24022480MHz Data rate and modulation format1 Mbps, GFSK, 250 kHz deviation RF RECEIVE SECTION Measured on Texas Instruments CC2540 EM reference design with TA= 25C, VDD = 3 V, fc= 2440 MHz 1 Mbps, GFSK, 250-kHz deviation,
29、Bluetooth low energy mode, and 0.1% BER(1) PARAMETERTEST CONDITIONSMINTYPMAXUNIT Receiver sensitivity(2)High-gain mode93dBm Receiver sensitivity(2)Standard mode87dBm Saturation(3)6dBm Co-channel rejection(3)5dB Adjacent-channel rejection(3)1 MHz5dB Alternate-channel rejection(3)2 MHz30dB Blocking(3)
30、30dBm Frequency error tolerance(4)Including both initial tolerance and drift250250kHz Symbol rate error tolerance(5)8080ppm Conducted measurement with a 50- single-ended load. Spurious emission. Only largest spurious Complies with EN 300 328, EN 300 440 class 2, FCC CFR47,75dBm emission stated withi
31、n each band. Part 15 and ARIB STD-T-66 RX mode, standard mode, no peripherals active, low MCU 19.6 activity, MCU at 250 kHz Current consumptionmA RX mode, high-gain mode, no peripherals active, low MCU 22.1 activity, MCU at 250 kHz (1)0.1% BER maps to 30.8% PER (2)The receiver sensitivity setting is
32、 programmable using a TI BLE stack vendor-specific API command. The default value is standard mode. (3)Results based on standard gain mode (4)Difference between center frequency of the received RF signal and local oscillator frequency (5)Difference between incoming symbol rate and the internally gen
33、erated symbol rate 4Submit Documentation FeedbackCopyright 2010, Texas Instruments Incorporated Product Folder Link(s): CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084 OCTOBER 2010 RF TRANSMIT SECTION Measured on Texas Instruments CC2540 EM reference design with TA= 25C, VDD = 3 V and fc= 2440
34、MHz PARAMETERTEST CONDITIONSMINTYPMAXUNIT Delivered to a single-ended 50- load through a balun using 4 maximum recommended output power setting Output powerdBm Delivered to a single-ended 50- load through a balun using minimum 20 recommended output power setting Programmable output powerDelivered to
35、 a single-ended 50 load through a balun24dB range Conducted measurement with a 50- single-ended load. Complies Spurious emissionswith EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB41dBm STD-T-66(1) TX mode, 23-dBm output power, no peripherals active, low MCU 21.1 activity, MCU at 250 kH
36、z TX mode, 6-dBm output power, no peripherals active, low MCU 23.8 activity, MCU at 250 kHz Current consumptionmA TX mode, 0-dBm output power, no peripherals active, low MCU 27 activity, MCU at 250 kHz TX mode, 4-dBm output power, no peripherals active, low MCU 31.6 activity, MCU at 250 kHz Differen
37、tial impedance as seen from the RF port (RF_P and RF_N) Optimum load impedance70 + j30 toward the antenna (1)Designs with antenna connectors that require conducted ETSI compliance at 64 MHz should insert an LC resonator in front of the antenna connector. Use a 1.6-nH inductor in parallel with a 1.8-
38、pF capacitor. Connect both from the signal trace to a good RF ground. Copyright 2010, Texas Instruments IncorporatedSubmit Documentation Feedback5 Product Folder Link(s): CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084 OCTOBER 32-MHz CRYSTAL OSCILLATOR Measured on Texas Instruments CC2540 EM re
39、ference design with TA= 25C and VDD = 3 V PARAMETERTEST CONDITIONSMINTYPMAXUNIT Crystal frequency32MHz Crystal frequency accuracy 4040ppm requirement(1) ESREquivalent series resistance660 C0Crystal shunt capacitance17pF CLCrystal load capacitance1016pF Start-up time0.25ms The crystal oscillator must
40、 be in power down for a guard time before it is used again. This Power-down guard timerequirement is valid for all modes of operation. The3ms need for power-down guard time can vary with crystal type and load. (1)Including aging and temperature dependency, as specified by 1 32.768-kHz CRYSTAL OSCILL
41、ATOR Measured on Texas Instruments CC2540 EM reference design with TA= 25C and VDD = 3 V PARAMETERTEST CONDITIONSMINTYPMAXUNIT Crystal frequency32.768kHz Crystal frequency accuracy 4040ppm requirement(1) ESREquivalent series resistance40130k C0Crystal shunt capacitance0.92pF CLCrystal load capacitan
42、ce1216pF Start-up time0.4s (1)Including aging and temperature dependency, as specified by 1 32-kHz RC OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with Tw= 25C and VDD = 3 V. PARAMETERTEST CONDITIONSMINTYPMAXUNIT Calibrated frequency(1)32.753kHz Frequency accuracy after calibr
43、ation0.2% Temperature coefficient(2)0.4%/C Supply-voltage coefficient(3)3%/V Calibration time(4)2ms (1)The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. (2)Frequency drift when temperature changes after calibration (3)Frequency drift when supply voltage chang
44、es after calibration (4)When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is set to 0. 6Submit Documentation FeedbackCopyright 2010, Texas Instruments Incorporated Product
45、Folder Link(s): CC2540F128 CC2540F256 CC2540F128, CC2540F256 SWRS084 OCTOBER 2010 16-MHz RC OSCILLATOR Measured on Texas Instruments CC2540 EM reference design with TA= 25C and VDD = 3 V PARAMETERTEST CONDITIONSMINTYPMAXUNIT Frequency(1)16MHz Uncalibrated frequency accuracy18% Calibrated frequency a
46、ccuracy0.6% Start-up time10ms Initial calibration time(2)50ms (1)The calibrated 16-MHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 2. (2)When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is perf
47、ormed while SLEEPCMD.OSC_PD is set to 0. RSSI CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA= 25C and VDD = 3 V PARAMETERTEST CONDITIONSMINTYPMAXUNIT High-gain mode99 to 44 Useful RSSI range(1)dBm Standard mode90 to 35 Absolute uncalibrated RSSI accuracy(1)High-gain
48、 mode4dB Step size (LSB value)1dB (1)Assuming CC2540 EM reference design. Other RF designs give an offset from the reported value. FREQUENCY SYNTHESIZER CHARACTERISTICS Measured on Texas Instruments CC2540 EM reference design with TA= 25C, VDD = 3 V and fc= 2440 MHz PARAMETERTEST CONDITIONSMINTYPMAX
49、UNIT At 1-MHz offset from carrier109 Phase noise, unmodulated At 3-MHz offset from carrier112dBc/Hz carrier At 5-MHz offset from carrier119 ANALOG TEMPERATURE SENSOR Measured on Texas Instruments CC2540 EM reference design with TA= 25C and VDD = 3 V PARAMETERTEST CONDITIONSMINTYPMAXUNIT Output148012-bit Temperature coefficient4.5mv/C Voltage coefficient1/ 0.1 V Measured using integrated ADC, internal band-gap voltage reference, and maximum resolution Initial accuracy without calibration10C Accuracy using 1-point calibration5C Current consumption when enabled0.5mA Copyrigh