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1、Amkor Confidential1 ATC FCCSP Introduction Amkor Technology China | Sep. 2017 Amkor Confidential2 FCCSP : Flip Chip Chip Scale Package FCCSP is an Interconnect Technology Flip ChipChip Scale Package WHAT IS FCCSP ? Smaller and thinner Amkor Confidential3 Application(s) High Speed Memory Power Regula
2、tor Analog Device (RF) Graphic Chipset Microprocessor Communication Consumer products Making The Future WHAT CAN WE DO ? Making The Future Amkor Confidential4 2001 2003200520072009201120132015 CABGA (2003) SCSP 16+0 (2014 ) SCSP 3+1 (2006) SCSP 2+0 (2005) SCSP 2+1 (2006) SCSP 8+0 (2012 ) SCSP 4+1 (2
3、011) PoP Top (2013 ) PoP btm (2007) Phased out on 2008 Thinner PKG Height Higher Stack PBGA(2005) Phase out on Y2013 WB LAMINATE PKG MicroSD (2006) WLCSP & DPS -8 (2011) Wafer bumping 8” (2007) Others Punch-QFN (2006) SD-QFN 2+1 (2010) SD TSOP 2+1 (2006) SD-TSOP 4+0 (2009) LQFP(2001) Phased out on Y
4、2005 More I/O LEADFRAME PKG sQFN (2004) Phased out onY2005 DR PQFN (2014) fcPBA(2005) Phase out on Y2008 fcSCSP (2012) fcCSP CUF (2008) fcBGA (2008) Phased out on 2009 Higher Stack FLIPCHIP PKG Bare die POP (2013) CuP fcCSP (2013) WLCSP Interposer (2014) SOIC (2002) Phased out on Y2005 TSOP (2004) F
5、inger print sensor (2015) TMV (2015) TCNCP (2014) EMI shield (2015 ) 2017 SCSP MEMS (2016) Exposed Die fcCSP (2016) SCSP SIP (2016) LSC fcCSP (2016) fcCSP MUF (2011) Saw QFN (2016) Wafer bumping 12” (2016) TSV FPS (2017) SCSP 24+0 (2017 ) DPS 12” (2017) Glass wafer (2017) fcMSP (2017) DR sQFN (2017)
6、 ATC PACKAGE PORTFOLIO Amkor Confidential5 HVMAvailable2017201820192020 Die size (mm) 9 1.8 15 1.5 15 1.5 Bump pitch (m) Pb free solder Fine Pitch Cu Pillar - with TCNCP - with MR 140 40/80 45/90 140 40/80 45/90 130 30/60 30/60 Body size/Ball count 0.8 mm pitch 0.65 mm pitch 0.5 mm pitch 0.4 mm pitc
7、h 0.3 mm pitch 15 mm/329 15 mm/495 15 mm/849 15 mm/992 21 mm/645 21 mm/984 21 mm/1693 21 mm/2632 21 mm/4680 21 mm/645 21 mm/984 21 mm/1693 21 mm/2632 21 mm/4680 Substrate Standard core Low CTE core Coreless MSP Standard core Low CTE core Coreless MSP Standard core Low CTE core Coreless MSP FCCSP TEC
8、HNOLOGY Amkor Confidential6 HVMAvailable2017201820192020 L&S (m) pitch Tenting(+) MSAP(+) SAP Embedded trace (L1) 40/40 15/25 16/16 10/10 12/12 20/25 15/20, 14/18 10/10, 8/10 7/7, 5/5 15/25 12/18 8/8 5/5 12/16 Laser via pad/via (m) Blind via (prepreg) Core layer via 90/60 150/75 85/60 125/75,115/75
9、105/75 80/60 F/C pitch (m) CuP + SOP CuP + BOL 130 40/80 110 30/60 100 25/50 SR Ink SRR 12.510 Core material CTE (ppm) 15 2.5 1.5 1.000, -2 Solder mask Tg (C) CTE (ppm) 135 40 155 2017.5 170 9 Surface finish OSP+(SOP)+ (Ni/Au) ENEPIG Module (Thin Ni) ENEPIG + OSP Module FCCSP SUBSTRATE TECHNOLOGY Am
10、kor Confidential7 Wafer Incoming Pre bake*Note Plasma clean*Note Underfill*Note UF Cure*Note Flip Chip Attach / Reflow Flux clean Pre-clean Ball Inspection System Mold Post Mold Cure Plasma Clean Final Visual Inspection Laser Marking Solder Ball Attach / Reflow / Cleaning Package Saw IVI inspection
11、Wafer Sawing Laser Grooving Back Grinding 1 Back Grinding 2 Wafer Sawing 3 Flip Chip Attach Under Fill 4 5 Mold 6 Laser Marking 7 Solder Ball Attach 8 Package Sawing *Note) Yellow mark are option for CUF FCCSP PROCESS FLOW Amkor Confidential8 WAFER BACK GRIND Wafer Tape Flip Wafer Back Grinding Fini
12、shed WBG ( Reduce Thickness ) Amkor Confidential9 LASER GROOVING Finished Laser Grooving ( Pre-Saw ) Amkor Confidential10 WAFER SAW Blade Finished Wafer Saw ( Die Saw ) Amkor Confidential11 Pickup Die From Flipper FLIP CHIP ATTACH Flipper Pickup Die From wafer Flipper Die Flip Chip Flipper Die Bonde
13、r Amkor Confidential12 FLIP CHIP ATTACH Dipping Flux Die Bonder Die Bonder Attach Die Amkor Confidential13 REFLOW Go through Reflow Solder Melting Die Finished Chip Attach ( Attach Die ) Amkor Confidential14 PRESSURIZED WATER PRESSURIZED WATER PRESSURIZED WATER PRESSURIZED WATER HOT AIR HOT AIR HOT
14、PLATE HOT PLATE FLUX CLEAN Die Finished Flux clean ( Clean flux residue ) Amkor Confidential15 UNDER FILL Under Fill Finished Under Fill ( Protect bumps ) Amkor Confidential16 MOLDING Finished Molding ( Protect Die ) Molding Compound Amkor Confidential17 LASER MARKING Finished Laser marking ( Unit I
15、nformation ) Molding Compound SPRD SPRD SPRD SPRD Amkor Confidential18 SOLDER BALL ATTACH Finished Solder Ball Attach Amkor Confidential19 PACKAGE SAW Finished Package Saw ( unit base ) Amkor SPRD SPRD SPRD SPRD Amkor Confidential20 BALL INSPECTION SYSTEM SPRD SPRD SPRD Camera Camera Finished Ball Scan ( check quality ) Amkor Confidential21 FINAL VISION INSPECTION SPRD SPRD Amkor Confidential22 Thank You Amkor is making the future with you