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1、3.1 LED封装流程简介（Introduction to 3.1 LED encapsulation process）This article is contributed by suyd618The PPT document may not have a good browsing experience at the WAP end. It is recommended that you choose TXT, or download the source file to the native view.Chapter 3 the packaging process of LEDs pac
2、kaging processProfessor su coopersUniversity of jinan universityThe 2011-2-14University of jinan universityoneChapter 3 encapsulation of LED packaging process reference materials: reference materials:Packaging technology, LED packaging technology packaging technologyZhao chao, ji aihua of suzhou, Sh
3、anghai jiaotong publishing house, Shanghai jiaotong publishing house, 2010.9The 2011-2-14University of jinan university2Chapter 3 encapsulation process of LED packaging processAre: the main function of packaging the main function of pieces pieces pieces have a physical protection of electrical conne
4、ction standard normalization LED packaging technology are mostly based on the discrete semiconductor devices packaging technology Packaging technology are mostly based on the discrete semiconductor devices packaging technology Development are mostly in discrete semiconductor encapsulation technology
5、 and evolved, but there are a lot of particularity. Development and evolution come, but there is a great particularity. There are other discrete electronic components of electrical properties and luminescence properties of LED light-emitting device And light-emitting devices luminescence properties
6、of p-n junction emit photons to the parties and the photon is likely to launch to the parties to the emission probability is the sameChapter 6 details the detailed analysisHow to improve the ejection probability of the photon? How to improve the ejection probability of the photon?The 2011-2-14Univer
7、sity of jinan university3Chapter 3 encapsulation of LED packaging process package introduction:For example, routine phi 5mmLED encapsulation is used as an example to encapsulate the square tube with the side length of 0.25 mm, and the square pipe core of the side length is bonded or sintered on the
8、lead frame. The core bond or sintered on the lead frame; The positive electrode of the core is connected to a tube foot by the ball contact point and the gold wire bonding. To connect the pins; The negative electrode is connected to the other foot of the lead frame by the reflective cup and the lead
9、 frame. And the other side of the foot is connected; The top is covered with epoxy resin (the top of the top, the top of the top, the tip of the apex, the top of the top, etc.).Increase the lights luminous rate and change the direction of the shotThe 2011-2-14University of jinan university4Chapter 3
10、 encapsulation of LED packaging process encapsulation process encapsulation heat introduction: encapsulation of heat dissipation profile:LED light wavelength with the temperature change of the luminous wavelength with the temperature change is 0.2 0.3 nm / , spectrum width of light wavelength with t
11、he temperature change is increases, lead to partial color. It increases, resulting in bias. Temperature rise per 1 luminous efficiency decrease about 1% Temperature rise every , luminous efficiency is lower. The efficiency is reduced.Measures toReducing the driving current reduces the junction tempe
12、rature, most of the small power drive current reduces the junction temperature, and the driving current of most small power leds is limited to about 20mA (conservative method).Or so (or so Conservative method) being of power type power type LED drive current can reach (drive current can reach 70 ma
13、and 100 ma and 350 ma, 1 a level, and even improve the encapsulation structure method (active). Even) improve the encapsulation structure method (active). Slice (1) with down big outfit the knot product can compose the core (2) collect useful guide silver frame (3) increasing the hot glue sex table
14、gold surface (4) welding silicon product pens in convex load material heat sink straight point connect plate (5) hot counsels line roadNPCB.The 2011-2-14University of jinan university5Chapter 3 encapsulation of LED packaging process packaging standard: packaging standard:Package size, shape, pin num
15、ber, spacing and length of a standard specifications, package size, shape, pin number, spacing and length of a standard specifications, convenient for processing, facilitate again to match the printed circuit board, easy processing, facilitate again to match the printed circuit board, related to the
16、 production line and production equipment has generality. This is to encapsulate user, circuit board manufacturer, preparation has universality. This is convenient for packaging users, circuit boards manufacturers and semiconductor manufacturers, and is easy to standardize. Its convenient and standa
17、rdized. China has yet to develop the LED packaging standard, as the LED applications packaging standard, along with our country has yet to make a standard of encapsulation application at our country will speed up the specification LED electrical parameters, the optical parameters of the structure an
18、d size of the electric parameters, and, our country will speed up the standard specification of electrical parameters. Standard operation.The 2011-2-14University of jinan university6In chapter 3, the packaging process of LED packaging process is present in the form of encapsulation of LED: the prese
19、nt form of encapsulationLamp - LED pin LED (LED) TOP - LEDPackage form is divided into package formSide - LED (Side - LED) Side - LED (surface pasted LED) surface of the Flip Chip - LED) High - Power - LED (High Power LED) High PowerThis chapter mainly introduces the small power Lamp - LED packaging
20、 process. Package process. This chapter mainly introduces the small power packaging processThe 2011-2-14University of jinan university7Chapter 3 LED encapsulation process chapter of encapsulation process 3.1 LED encapsulation process introduction Encapsulation process introduction 3.1.1 LED encapsul
21、ation process as a whole Encapsulate the overall process Stood on solid crystal system before, first introduces the pin type LED) in the interpretation of the solid crystal stand before, first introduced lamp - leds (pin type pin type the whole manufacturing process, LED to the encapsulation process
22、 have a probably understanding. The whole process of packaging have a probably understanding. The entire manufacturing process, in order to have a probably understanding on the whole packaging process 1. LED manual assembly line homework Operation manual packaging line Encapsulation of the overall f
23、low diagram, figure 3.1 is the lamp - LED encapsulation of the overall flow chart,The solid crystal is a block diagram of the whole flow chart flow, welding line flow, filling process, testing process and the separation process. Flow chart, process, process, test flow and flow chart of the process.
24、The process steps in the process are briefly presented in each process, and the process steps in the process are briefly given in each process to produce the LED products with qualified technical parameters. Products. Product with qualified parametersThe 2011-2-14University of jinan university8Chapt
25、er 3 encapsulation process of LED packaging processThe whole flow chart of manual packaging line of lamp - LED manual packaging lineThe 2011-2-14University of jinan university9Chapter 3 encapsulation process of LED packaging processManual lamp - LED assembly line process 3.1.2 manual assembly line p
26、rocess Manual is corporate packaging technical personnel shall prepare basic skills! Basic skills! The packaging personnel can control the quality of the products in automatic and semi-automatic packaging without the precondition of manual packaging. Product quality.Double crystalEnlarge crystalSilv
27、er glue mixingManually dispensingRow of stentsPoint gluing processTouch and bakeThe 2011-2-14University of jinan university10Chapter 3 encapsulation process of LED packaging processTo self-expand the self - point glueManual solid crystalbakeDispensing machineBake to solder wire machine solid crystal
28、Glue solid crystal process jinan university college of science11The 2011-2-14Chapter 3 encapsulation process of LED packaging processWelding lineThe machine the mopFrom the bakingTack line processArticle pretendTo glueWelding lineArticle mould preheatingArticle mould blowing dustSpray from the mould
29、 agentTo glueThe 2011-2-14University of jinan university12Chapter 3 encapsulation process of LED packaging processThe glue process before gluingGlue preheatingWith glueGlue vacuumGlue mixingThe adhesive bar processThe 2011-2-14University of jinan university13Chapter 3 encapsulation process of LED pa
30、ckaging processglueglueInserted stentsFixed bracketStents dispensingTo the testInto bakedPressure supportThe 2011-2-14University of jinan university14Chapter 3 encapsulation process of LED packaging processThe 2011-2-14University of jinan university15Chapter 3 encapsulation process of LED packaging processThe 2011-2-14University of jinan university16one