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1、a Date: 1 December 2008 Origin: International Latest date for receipt of comments: 6 February 2009 Project no.: 2008/03004 Responsible committee: EPL/47 Semiconductors Interested committees: Title: Draft BS EN 60191-6-21 Ed.1 : Mechanical standardization of semiconductor devices Part 6-21 : General
2、rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) Supersession information: If this document is published as a standard, the UK implementation of it will supersede NONE and partial
3、ly supersede. NONE If you are aware of a current national standard which may be affected, please notify the secretary (contact details below). WARNING: THIS IS A DRAFT AND MUST NOT BE REGARDED OR USED AS A BRITISH STANDARD. THIS DRAFT IS NOT CURRENT BEYOND 6 February 2009. This draft is issued to al
4、low comments from interested parties; all comments will be given consideration prior to publication. No acknowledgement will normally be sent. See overleaf for information on commenting. No copying is allowed, in any form, without prior written permission from BSI except as permitted under the Copyr
5、ight, Designs and Patent Act 1988 or for circulation within a nominating organization for briefing purposes. Electronic circulation is limited to dissemination by e-mail within such an organization by committee members. Further copies of this draft may be purchased from BSI Customer Services, Tel: +
6、44(0) 20 8996 9001 or email . British, International and foreign standards are also available from BSI Customer Services. Information on the co-operating organizations represented on the committees referenced above may be obtained from the responsible committee secretary. Cross-references The Britis
7、h Standards which implement International or European publications referred to in this draft may be found via the British Standards Online Service on the BSI web site http:/. Direct tel: 020 8996 7009 Responsible Committee Secretary: Committee Service Centre (BSI) E-mail: Draft for Public Comment H
8、ead Office 389 Chiswick High Road London W4 4AL Telephone: +44(0)20 8996 9000 Fax: +44(0)20 8996 7001 Form 36 Version 8.0 DPC: 08/30190030 DC Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI b Introduction This draft standard is based o
9、n international discussions in which the UK has taken an active part. Your comments on this draft are welcome and will assist in the preparation of the consequent standard. There is a high probability that this text could be adopted by CENELEC as a reference document for harmonization or as a Europe
10、an Standard. Recipients of this draft are requested to comment on the text bearing in mind this possibility. UK Vote Please indicate whether you consider the UK should submit a negative (with reasons) or positive vote on this draft. Submission The guidance given below is intended to ensure that all
11、comments receive efficient and appropriate attention by the responsible BSI committee. Annotated drafts are not acceptable and will be rejected. All comments must be submitted, preferably electronically, to the Responsible Committee Secretary at the address given on the front cover. Comments should
12、be compatible with Version 6.0 or Version 97 of Microsoft Word for Windows, if possible; otherwise comments in ASCII text format are acceptable. Any comments not submitted electronically should still adhere to these format requirements. All comments submitted should be presented as given in the exam
13、ple below. Further information on submitting comments and how to obtain a blank electronic version of a comment form are available from the BSI web site at: http:/ Template for comments and secretariat observations Date: xx/xx/200x Document: ISO/DIS xxxxx 1 2 (3) 4 5 (6) (7) MB Clause No./ Subclause
14、 No./ Annex (e.g. 3.1) Paragraph/ Figure/Table/ Note (e.g. Table 1) Type of com- ment Comment (justification for change) by the MB Proposed change by the MB Secretariat observations on each comment submitted 3.1 Definition 1 ed Definition is ambiguous and needs clarifying. Amend to read . so that th
15、e mains connector to which no connection . 6.4 Paragraph 2 te The use of the UV photometer as an alternative cannot be supported as serious problems have been encountered in its use in the UK. Delete reference to UV photometer. Microsoft and MS-DOS are registered trademarks, and Windows is a tradema
16、rk of Microsoft Corporation. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI FORM CD (IEC) 2008-08-01 47D/733/CD COMMITTEE DRAFT (CD) IEC/TC or SC: SC 47D Project number IEC 60191-6-21 Ed.1.0 2/07038 Title of TC/SC: Mechanical Standard
17、ization of Semiconductor Devices Date of circulation 2008-11-28 Closing date for comments 2009-03-06 Also of interest to the following committees Supersedes document 47D/722/NP - 47D/728A/RVN Proposed horizontal standard Other TC/SCs are requested to indicate their interest, if any, in this CD to th
18、e TC/SC secretary Functions concerned: Safety EMC Environment Quality assurance Secretary: Hiroyoshi Yoshida THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT SHOULD NOT BE USED FOR REFERENCE PURPOSES. RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR COMMENTS, NOTIFICATION OF
19、 ANY RELEVANT PATENT RIGHTS OF WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING DOCUMENTATION. Title: IEC 60191-6-21 Ed.1: Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring
20、 methods for package dimensions of small outline packages (SOP) (Titre) : Introductory note Copyright 2008 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this electronic file, to make a copy and to print out the content for the sole purpose of prepar
21、ing National Committee positions. You may not copy or “mirror“ the file or printed version of the document, or any part of it, for any other purpose without permission in writing from IEC. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BS
22、I 60191-6-21, Ed. 1 IEC:200X 2 47D/733/CD INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of smal
23、l outline packages (SOP) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerni
24、ng standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their p
25、reparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates clos
26、ely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the releva
27、nt subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the te
28、chnical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum e
29、xtent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for
30、 any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committ
31、ees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications
32、. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
33、rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-21 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this standard i
34、s based on the following documents: FDIS Report on voting 47D/XX/FDIS 47D/XX/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directive, Part 2. Lic
35、ensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-21, Ed. 1 IEC:200X 3 47D/733/CD A bilingual version of this publication may be issued at a later date. The committee has decided that the contents of this publication will remain unc
36、hanged until 20XX. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-21, Ed. 1 IEC:200X 4 47D/733/CD MECHANICAL STANDARDIZAT
37、ION OF SEMICONDUCTOR DEVICES Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outline packages (SOP) 1 Scope This part of IEC 60191 specifies (or: covers) methods to measure package dim
38、ensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edi
39、tion of the referenced document (including any amendments) applies. IEC 60191-4: Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor devices IEC 60191-6, Ed.2: Mechanical standardization of semiconductor device
40、s.- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC60191-6 Ed.2 apply. 4 Measuring Methods 4.1 Description of measuring method The measuring methods describe
41、d in this standard are for dimension values guaranteed to users on the basis of the following items. a) In general, measuring the dimensions shall be made with the semiconductor packages mounted on printed circuit-board as the guarantee is made to user. b) In general, measurement may be made either
42、by hand or automatically. c) If a specified dimension is difficult to measure, the best alternative measuring method is defined as the formal measuring method. d) The dimensions that cannot be measured unless the package is destroyed may be calculated from other dimensions or replaced by representat
43、ive values. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-21, Ed. 1 IEC:200X 5 47D/733/CD Terminal 1 index area 2 1 n/2 n B n-1 n/2+1 D HD A Figure 1a y Seating plane ZE e bp MxP S E S A-BS Figure 1b e b3 l1 HDmax HDmin-2Lpma
44、x Figure 1c Lead section c c1 b1 bp Figure 2 Pattern of terminal position areas Figure 1d G1D L Lp L1 A3 P A1 A2 A 4.2 Reference characters and drawing TSOP (1) Figure 1 TSOP(1) outline drawings 1e Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Cop
45、y, (c) BSI 60191-6-21, Ed. 1 IEC:200X 6 47D/733/CD DZ e Terminal 1 index area 21 n1 P Seating plane S bp D M y A-BS S n/2 B n2 n4 n n-1n/2-1 n3 E HE A Figure 1a Figure 1b x e b3 l1 c c1 b1 bp L1 G1E P A3 L Lp HEmax HEmin -2Lpmax Figure 2 Pattern of terminal posion areas A Figure 1c Lead section Figu
46、re 1d A2 A1 SSOP, TSOP(2) Figure 2 SSOP, TSOP(2) outline drawings 2a 2b 2c 2d 2e Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-21, Ed. 1 IEC:200X 7 47D/733/CD 4.3 Mounting height A 4.3.1 Description Let the height of a packag
47、e from the seating plane to the top of the package be denoted as the mounting height. Figure 3 Mounting height 4.3.2 Measuring method a) Put the package on the surface plate to establish the seating plane. b) From the side or top, measure the distance to a highest point. Let the distance be denoted
48、as mounting height. A A S S Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-21, Ed. 1 IEC:200X 8 47D/733/CD 4.4 Stand-off A1 4.4.1 Description Let a distance from the seating plane to the lowest point of a package be denoted as
49、 the stand-off. A1 A1 Figure 4 Stand-off 4.4.2 Measuring method a) Put the package on the surface plate to establish the reference surface (seating plane). b) Measure a distance from the reference surface (surface plate) to the lowest point of the package. S S Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c)