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1、BRITISH STANDARD BS QC 760200: 1997 IEC 60748-22: 1997 Harmonized system of quality assessment for electronic components Semiconductor devices Integrated circuits Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedur
2、es ICS 31.200 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS QC 760200:1997 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the auth
3、ority of the Standards Board and comes into effect on 15 August 1997 BSI 10-1999 ISBN 0 580 28005 5 National foreword This British Standard reproduces verbatim IEC 60748-22:1997 and implements it as the UK national standard. It supersedes BS QC 760200:1992 which is withdrawn. This standard is a harm
4、onized specification within the IEC system of quality assessment for electronic components (IECQ). The UK participation in its preparation was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: aid
5、enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizatio
6、ns represented on this subcommittee can be obtained on request to its secretary. The standard is to be used in conjunction with BS QC 760000. The British Standard which implements the IECQ Rules of Procedure is BS 9000 General Requirements for a system for electronic components of assessed quality P
7、art 3:1996 Specification for the national implementation of the IECQ system. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to th
8、e other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence I
9、ndex”, or using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself co
10、nfer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the IEC title page, page ii, pages 1 to 46 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be
11、 indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No.DateComments Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS QC 760200:1997 BSI 10-1999i Contents Page
12、 National forewordInside front cover Text of IEC 60748-221 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12
13、 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS QC 760200:1997 ii BSI 10-1999 Contents Page 1Scope and object1 2General, preferred characteristics, ratings and sev
14、erities for environmental tests1 2.1Normative references1 2.2Preferred ratings and characteristics1 2.3Information to be given in a detail specification2 3Capability approval procedures3 3.1Selection of capability qualifying circuits (CQCs)3 3.2Structural similarity3 3.3Capability approval4 3.4Resub
15、mission of rejected lots (lot-by-lot inspection)10 3.5Manufacturing stages in a factory of an approved manufacturer in a non-IEC member country10 4Test and measurement procedures10 5Tables for method B11 Annex A (normative) Structural similarity rules for capability approval17 Annex B (normative) Mi
16、nimum contents of a manufacturers capability manual for thick film circuits32 Annex C (normative) Minimum contents of a manufacturers capability manual for thin film circuits39 Table 1 Test schedule for capability approval for method A5 Table 2 Assessment levels and acceptance criteria for capabilit
17、y approval for method A7 Table 3 Assessment levels and acceptance criteria for quality conformance inspection for method A8 Table 4 Screening10 Table 5 Test schedule for capability approval for method B11 Table 6 Assessment levels and acceptance criteria for capability approval for method B13 Table
18、7 Assessment levels and acceptance criteria for quality conformance inspection for method B14 Table A.1 Classification of technology, materials and processes20 Table A.2 Substrates22 Table A.3 Film materials22 Table A.4 Added non-encapsulated active chip components23 Table A.5 Added encapsulated act
19、ive component other than chips24 Table A.6 Added passive components24 Table A.7 Packaging25 Table A.8 Mass and dimensions of package25 Table A.9 Limits of association in relation with mass and dimensions26 Table A.10 Combination of criteria for environmental, including mechanical, testing26 Licensed
20、 Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS QC 760200:1997 BSI 10-19991 1 Scope and object This sectional specification applies to film integrated circuits and hybrid film integrated circuits manufactured as cat
21、alogue circuits or as custom-built circuits whose quality is assessed on the basis of capability approval. The object of this specification is to present preferred values for ratings and characteristics, to select from the generic specification the appropriate tests and measuring methods, and to giv
22、e general performance requirements to be used in detail specifications for film integrated circuits and hybrid film integrated circuits derived from this specification. The concept of preferred values is directly applicable to catalogue circuits but does not necessarily apply to custom built circuit
23、s. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance level, since lower performance levels are not permitted. Associated with this specification are one or more blank detail specifications, each reference
24、d by an IEC number. A blank detail specification which has been completed as specified in 2.3 of this specification, forms a detail specification. Such detail specifications are used for the acceptance of a complete circuit, and the granting of capability approval for the boundaries of capability id
25、entified by the manufacturer in his capability manual and maintenance of capability approval in accordance with the IECQ system. NOTEFor test procedures two alternatives are available: Method A or method B; however, it is not permitted to change the methods between tests of method A, respectively B.
26、 In general, method A is more suitable for passive component based film integrated circuits, whereas method B is more applicable to semiconductor integrated circuit technology based film integrated circuits. 2 General, preferred characteristics, ratings and severities for environmental tests 2.1 Nor
27、mative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60748. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements bas
28、ed on this part of IEC 60748 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60063:1963, Preferred number series for resistors and
29、capacitors. IEC 60068-1:1988, Environmental testing Part 1: General and guidance. IEC 60440:1973, Method of measurement of non-linearity in resistors. IEC 60748-20:1988, Semiconductor devices Integrated circuits Part 20: Generic specification for film integrated circuits and hybrid film integrated c
30、ircuits. IEC 60748-20-1:1994, Semiconductor devices Integrated circuits Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits Section 1: Requirements for internal visual examination. IEC 60748-21:1997, Semiconductor devices Integrated circuits Sectional spec
31、ification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure. IEC 60748-22-1:1997, Semiconductor devices Integrated circuits Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the ba
32、sis of the capability approval procedures. 2.2 Preferred rating and characteristics Preferred values of voltages and currents are given in IEC 60747-1; for resistors and capacitors preferred values are given in IEC 60063; for custom-built circuits, any values and tolerances may be chosen. The circui
33、ts covered by this standard are classified into climatic categories according to the general rules given in IEC 60068-1. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS QC 760200:1997 2 BSI 10-1999 The sever
34、ities for the cold and dry heat tests are the lower and upper category temperatures respectively. Because of the construction of some circuits, these temperatures will occur between two of the preferred temperatures given in IEC 60068-2. In this event, the nearest preferred temperature within the ac
35、tual range of the circuit shall be chosen for this severity. 2.3 Information to be given in a detail specification Detail specifications shall be derived from the relevant blank detail specifications. Detail specifications shall not specify severities inferior to those of the generic or sectional sp
36、ecification. When more severe requirements are included, they shall be listed in the detail specification and indicated in the test schedules, for example by an asterisk. NOTEThe information given on dimensions, characteristics and ratings may, for convenience, be presented in tabular form. The foll
37、owing information shall be given in each detail specification and the values quoted shall preferably be selected from those given in the appropriate clause or subclause of this sectional specification. Each detail specification shall state all the tests and measurements required for lot-by-lot inspe
38、ction and periodic testing. This shall, as a minimum, include the relevant tests given in this specification with methods and severities. Environmental tests, measurements, severities, and end-point limits for periodic tests shall be included in the detail specifications for the capability qualifyin
39、g circuits (CQCs). They shall be in accordance with the applicable parts of the generic specification and this specification. 2.3.1 Outline drawing and dimensions There shall be an illustration of the circuit as an aid to easy recognition and for comparison of the circuit with others. Dimensions and
40、 their associated tolerances, which affect interchangeability and mounting, shall be given in the detail specifications. All dimensions shall be stated in millimetres. Normally, numerical values shall be given for the length, width and height of the body, and the termination spacing or for cylindric
41、al types, the body diameter, and the length and diameter of the terminations. When necessary, for example when a detail specification covers more than one package, the dimensions and their associated tolerances shall be placed in a table below the drawing. When the configuration is other than descri
42、bed above, the detail specification shall state such dimensional information so as to adequately describe the circuit. 2.3.2 Mounting The detail specification shall prescribe the method of mounting to be applied for normal use, and for the application of the vibration, and the bump or shock tests. T
43、he design of the circuit may be such that special mounting fixtures are required in its use. In this case, the detail specification shall prescribe the mounting fixtures and they shall be used in the application of the vibration and bump or shock tests. 2.3.3 Severities for environmental tests The d
44、etail specification shall prescribe the appropriate method of testing and the appropriate severities selected from section 4 of the generic specification. 2.3.4 Marking The detail specification shall prescribe the content of the marking on the circuit and on the primary package. Deviations from 2.6
45、of the generic specification shall be specifically stated. 2.3.5 Ordering information The detail specification shall prescribe that the following information is required when ordering circuits: a) circuit type (e.g. hybrid thick film integrated circuit); b) number and issue of the detail specificati
46、on with style reference and assessment level (if appropriate); c) function of the circuit (if appropriate); d) basic functional characteristics with tolerance (if appropriate). 2.3.6 Additional information (not for inspection purposes) The detail specification may include information which is not no
47、rmally required to be verified by the inspection procedure, such as circuit diagrams, curves, drawings and notes needed for clarification. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:44:12 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS QC 760200:1997 BSI 1
48、0-19993 3 Capability approval procedures See 3.6 of the generic specification with the following details: 3.1 Selection of capability qualifying circuits (CQCs) 3.1.1 The CQCs for approval testing shall be taken from the following sources: a) special circuits designed to qualify the design rules, pr
49、ocesses and products; and/or b) circuits intended for shipment to customers. Any or all of these CQCs in combination with process test vehicles shall be adequate to assess the complete design rules, material and manufacturing processes, including any subcontracted process. Terminations of film elements and added components used for assessment shall be individually accessible for electrical measurement without influence from other circuit elements. 3.1.2 The CQCs shall be used to carry out the tests prescribed for c