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1、E I A CB5 69 3234600 O000222 5 / JULY 1969 COMPONENT. BULLETIN NO. 5 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERINQ DEPARTMENT 2001 EYE STREET, N.W. WASHINOTON, D.C. 2 0 0 0 6 f Copyright Electronic Components, Assemblies : Exte
2、rnal sources of movine;air passing over the test setup shall be mini- mized by placing an enclosure over the mounted specimen. The enclosure shall contain a sufficient volume of air to prevent a significant tem- perature rise of the air due to heat from the transistor. The enclosure shall be made fr
3、om clear plastic and closed at the bottom. It may have a small opening at top. A volume of one (i) cubic foot is adequate unless a very-large .wattage 5s being dissipated, The test temperature should not be accepted until stabilization occurs. This can be determined by noting the range of fluctuatio
4、n of the test temperature. When the vari- ation is less than l0C in 10 minutes, it can be assmed to be stabilized. 8.2 Forced Air Conditions: . The heat discipator shall be tested in an air duct with fan mounted on one (i) end. The ratio of the air duct cross-sectional area to the cross- sectional a
5、rea of the dissipator shall be not less than two (2). air duct shall be equippedewith suitable bends, baffles, or air straighten- ers to assure that the velocity gradient ackoss the duct in the test area shall not deviate more than 1 0 percent from the average velocity. This gradient shall be measur
6、ed with no dissipator in the duct. The dissipator shall be placed near the exhaust end of ehe duct, but wholly within the duct. It shall be located centrally within the cross-section of the duct. Suitable air velocity and temperature measuring probes shall be installed in the duct at least six (6) i
7、nches upstream from the dissipator. Figure 1 0 illustrates a setup for forced air measurement. The unit of measure of air velocity shall be in feet per minute. This test shall be performed with either the semiconductor, semiconductor and dissipator, or test load and dissipator mounted to an epoxy ch
8、assis (5.2) with standard mounting hardware. Test data will be presented in either tabular or graph form and will indicate the case temperature, air temperat.ure, air velocity, and junction temperature, if required. The head loss in inches of water of the dissipator will be shown at the various air
9、flows. A l l duct dimen- sions and instrumentation points are to be- called out. 9. . SEMICONDUCTOR WITH DISSIPATOR TESTS The These tests shall be specified under four different conditions. - 3 - _I_ f - PROBLEM HARD COPY Copyright Electronic Components, Assemblies (2), insulating washers, mica, ano
10、dize, etc., if used; (3), transistar types=number or test load case configuration; (4), semi- conductor or test load mounting torque; (5), position of dissipator during test; ( 6 ) , amount of air used for forced convectdon tests (ie., feet per minute); (7), duct size, and (8), location and mounting
11、 method of instru- mentation. 9 lo.? in Three Different Forms: Temperature Data and Heat Dissipating Information maybe Presented 10.1.1 as: Junction, Case, Dissipator mounting surface, Ambient Temperatures, and the power levels at which the temperature was measured. temperature is to be expressed in
12、 degrees Centigrade.and the power in watts I Tabular .Form: . A table showing all temperahres taken, such -The The information contained in the converted to Graphical form, such as: Heat sink mounting surface temperature rise above ambient versus power dissipated; case temperature rise above ambient
13、 versus power dissipated; thermal resistance (OC/W) rise above ambient versus air flow velocity in feet per minutes. 10.1.3. Thermal, Resistance Form: Thermal resistance is defined as the temperature difference ( - 4 .- Copyright Electronic Components, Assemblies I% ducters ManuPactumrts 8pecificati
14、onB or Teat Data per paragraph 2, The thermal resiicitance fyom cem to Elimipator i obtahed through tewk data and variee with type of semlconduetor CaIE;e, mounting torqub, finish or mating surf II I I I I TAP WATEROR OTHER I ! 1 I d) COPPER PLATE - APPROX. 6“x 6“x &“THICK - COPPER TUEtNG APPR0X.O“
15、DIA. ALL CONTACTING SURFACES HEAVILY SOLDERED TO PLATE FIGURE 9 CONSTANT TEMPERATURE HEAT SINK - 13 - - PROBLEM HARD COPY Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03
16、/30/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A CB5 69 m 3234600 0000236 7 m e- f- e- FIGURE 10 FORCED AIR MEASUREMENT, LINEAR - 14 - Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=
17、IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A CB5 69 m 3234600 0000237 9 m - . . . . I 1 I- . . r L - 1-5 - - f Z O Z Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,-