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1、 EIA STANDARD LEAD TAPING OF COMPONENTS IN THE RADIAL CONFIGURATION FOR AUTOMATIC HANDLING (Revision of EIA-468-B) EIA-468-C DECEMBER 2008 ANSI/EIA-468-C-2008 Approved: December 30, 2008 EIA-468-C EIA Standards Electronic Components Association Copyright Electronic Components, Assemblies & Materials
2、 Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo reproduction or networking permitted without license from IHS -,-,- NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through elim
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6、g the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standa
7、rd does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use
8、. (From Standards Proposal No. 5132 formulated under the cognizance of the Automated Component Handling Committee ACH). Published by: ELECTRONIC COMPONENTS ASSOCIATION 2008 EIA Standards and Technology Department 2500 Wilson Boulevard Suite 310 Arlington, VA 22201 PRICE: Please call: Global Engineer
9、ing Documents, USA and Canada (1-800-854-7179) http:/ All rights reserved Printed in U.S.A. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo reproduction or networkin
10、g permitted without license from IHS -,-,- PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the EIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, cont
11、act: Global Engineering Documents 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-800-854-7179), International (303-397-7956) Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for
12、Resale, 02/02/2009 22:06:46 MSTNo reproduction or networking permitted without license from IHS -,-,- Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo reproduction or
13、 networking permitted without license from IHS -,-,- EIA-468-C 1 Lead Taping of Components in the Radial Configuration for Automatic Handling CONTENTS SECTIONS PAGE 1. INTRODUCTION AND SCOPE 5 2. NORMATIVE REFERENCES 5 3. DIMENSIONS 5 4. REQUIREMENTS 9 5. ACKNOWLEDGEMENTS 13 FIGURES AND TABLES FIGUR
14、E 1 Coordinate System 5 FIGURE 2 Lead Taping Dimensions 6 FIGURE 3 Component Pitch 8 FIGURE 4 Reference Plane 9 FIGURE 5 Reel Configuration 11 FIGURE 6 Fan Fold Box Configuration 11 FIGURE 7 Reel Label Location 12 FIGURE 8 Fan Fold Box Label and Marking Locations 12 TABLE 1 Lead Taping Dimensions 7
15、TABLE 2 Component Pitch 8 TABLE 3 Reel Dimensions 11 TABLE 4 Fan Fold Box Dimensions 11 Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo reproduction or networking pe
16、rmitted without license from IHS -,-,- EIA-468-C 2 LEAD TAPING OF COMPONENTS IN THE RADIAL CONFIGURATION FOR AUTOMATIC HANDLING Revision of EIA Standard 468-B, formulated under the cognizance of the EIA Automated Component Handling (ACH) Committee 1. INTRODUCTION AND SCOPE This standard was formulat
17、ed to provide dimensions and tolerances necessary to lead tape components in the radial format (unidirectional leads) such that they may be automatically handled. Automatic handling includes insertion, preforming and other operations. The emphasis of this standard is on the requirements for high-spe
18、ed automatic insertion. This standard covers the lead taping requirements for components having two or more radial configured leads, provided these components may be taped in accordance with the requirements of this document. 2. NORMATIVE REFERENCES The following standards contain provisions which,
19、through reference in this Standard, constitute provisions of this Standard. All normative documents are subject to revision. 2.1 ANSI/ESD S541-2003 “Packaging Materials for ESD Sensitive Items“ 2.2 ANSI/ESD S20.20-2007 “Protection of Electrical and Electronic Parts, Assemblies and Equipment” 2.3 IPC
20、/JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices” 2.4 IPC J-STD-033B “Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices” 2.5 BS EN ISO 14001:2004 Environmental Management 3. DIMENSIONS 3.1 The coordin
21、ate system common to tapes and taped components with radial configured leads shall be used. The abscissa is a straight line through the centers of the sprocket holes. The ordinate is a line perpendicular to the abscissa through the center of the sprocket hole that follows the component to be checked
22、. All dimensions referencing the component leads are to the centerline of the lead. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo reproduction or networking permit
23、ted without license from IHS -,-,- EIA-468-C 3 Figure 2: Lead Taping Dimensions Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo reproduction or networking permitted
24、without license from IHS -,-,- EIA-468-C 4 Table 1: Lead Taping Dimensions (See Figures 2 and 3) SYMBOL DESCRIPTION DIMENSIONS (mm) REFERENCE A Component Body Height 23 maximum Requirement 4.3 D0Sprocket Hole Diameter 4.00.2 d0Lead diameter 0.36 minimum 0.86 maximum Requirements 4.4 and 4.5 d1Lead w
25、idth (non-circular leads) 0.35 minimum 0.75 maximum Requirement 4.5 d2Lead thickness (non-circular leads) 0.35 minimum 0.75 maximum Requirement 4.5 d3Lead diagonal (non-circular leads) 0.85 maximum Requirement 4.5 F 2 Leaded Component Lead Spacing See Table 2, +0.6, -0.2 F1, F23 Leaded Component Lea
26、d Spacing 2.50 +0.4, -0.1 or 2.54 +0.4, -0.1 Requirement 4.6 F= 2.5 1.65 minimum F= 5.0 4.19 minimum F3Minimum inner spacing between leads F= 7.5 6.73 minimum F= 2.5 3.68 maximum F= 5.0 6.22 maximum F4Maximum outer spacing of leads F= 7.5 8.76 maximum H Height to Seating Plane (Straight Leads) 18-20
27、 Requirement 4.8 H0Height to Seating Plane (Formed Leads) 16.00.5 Requirement 4.7 H1Overall Height Above Abscissa 38.5 maximum Requirement 4.3 ?h Front-to-Back Deviation 1.0 maximum Requirement 4.9 L Cut Out Length 11 maximum L1Lead Protrusion 1.0 maximum P Component Pitch (Nominal Dimension) See Ta
28、ble 2 P0Sprocket Hole Pitch 12.70.3 or 15.00.3 Requirement 4.10 P1Ordinate to Adjacent Component Lead See Table 2, 0.7 Requirement 4.6 and Figure 3 P0 = 12.7 6.350.7 P2Ordinate to Component Center Lead (3 Leaded Components) P0 = 15.0 7.50.7 Fig. 3, Table 2 and Requirement 4.6 P3Lead Deviation in Car
29、rier Tape 1.0 maximum Requirement 4.21 ?p Side-to-Side Deviation 1.3 maximum Requirement 4.9 t Composite Tape Thickness 0.9 maximum Requirement 4.11 t1Overall Tape and Lead Thickness 2.0 maximum Requirement 4.11 W Carrier Tape Width 18 +1, -0.5 Requirements 4.12 and 4.13 W0Hold Down Tape Width 5 min
30、imum Requirements 4.12 and 4.13 W1Sprocket Hole Position 9 +0.75, -0.5 W2Adhesive Tape Position 3 maximum Requirement 4.12 Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46
31、MSTNo reproduction or networking permitted without license from IHS -,-,- EIA-468-C 5 3.2 Component Pitch: The component pitch P depends on the pitch of the sprocket holes P0 and the size of the component body, B. The positioning of the components shall be symmetrical in relation to the sprocket hol
32、es on the tape. Table 2: Component Pitch Nominal Dimensions (See Table 1) HOLE PITCH P0 COMPONENT PITCH P FIG. LEAD SPACING F (Multiples of 2.5mm) P1 LEAD SPACING F (Multiples of 2.54mm) P1 12.7 12.7 3A 1.50* 5.60 12.7 12.7 3A 2.00* 5.35 12.7 12.7 3A 2.50 5.10 2.54 5.08 12.7 12.7 3A 5.00 3.85 5.08 3
33、.81 12.7 12.7 3A 7.50 2.60 7.62 2.54 12.7 12.7 3B 7.50 8.95 7.62 8.89 12.7 12.7 3B 10.00* 7.70 10.16* 7.62 12.7 25.4 3B 12.50* 6.45 12.70* 6.35 12.7 25.4 3B 15.00* 5.20 15.24* 5.08 12.7 25.4 3B 17.50* 3.95 17.78* 3.81 12.7 25.4 3C 20.00* 9.05 20.32* 8.89 12.7 25.4 3C 22.50* 7.80 22.86* 7.62 15.0 15.
34、0 3A 5.00 5.00 5.08 4.96 15.0 15.0 3A 7.50 3.75 7.62 3.69 15.0 15.0 3B 7.50 11.25 7.62 11.19 15.0 15.0 3B 10.00* 10.00 10.16* 9.92 15.0 15.0 3B 12.50* 8.75 12.70* 8.65 15.0 15.0 3B 15.00* 7.50 15.24* 7.38 15.0 30.0 3B 17.50* 6.25 17.78* 6.11 15.0 30.0 3B 20.00* 5.00 20.32* 4.84 15.0 30.0 3B 22.50* 3
35、.75 22.86* 3.57 3.2.1 Lead spacings marked with an asterisk (*) are commonly available but may not be compatible with high-speed automatic insertion machines. 3.2.2 Care shall be taken that the leads do not interfere with the sprocket holes. 3.2.3 The maximum body size dimension B shall be less than
36、 the nominal component pitch P. The component pitch may be increased by P0 when necessary to provide clearance between components. 3.2.4 Dimension F multiples of 2.54mm represent multiples of 0.100”. For new designs, multiples of 2.5 are recommended. Copyright Electronic Components, Assemblies & Mat
37、erials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo reproduction or networking permitted without license from IHS -,-,- EIA-468-C 6 4. REQUIREMENTS 4.1 Procurement documents and quotation requests should include the fo
38、llowing information: (a) Reference to this Standard by title and number. (b) Container type. (c) Component orientation (Requirement 3.x) (d) Dimension H, for straight-leaded components (Requirement 3.x) (e) Lead spacing and component pitch per Table x. (f) Shipping conditions, storage conditions, an
39、d storage time. (g) Container and/or reel marking requirements (including bar coding, if required). 4.2 The leads of the taped component shall be free of kinks or bends from the seating plane or reference plane downward to the carrier tape. 4.3 Taped components with dimensions exceeding A maximum an
40、d H1 maximum are commonly available but may not be compatible with high-speed automatic insertion machines. 4.4 Lead diameters outside the range of d0 in Table 1 are commonly available but may not be compatible with high-speed automatic insertion machines. 4.5 Leads with cross-sections other than ci
41、rcular may be used. A circle with diameter d3 going through the corners of the non-circular cross-section is considered to be the equivalent circular cross-section. 4.6 Dimensions F, F1, F2, F3, F4, P1 and P2, are measured at the egress from the carrier tape, on the component side. 4.7 The method fo
42、r determining the seating plane is as follows: 4.7.1 For components with straight leads, the seating plane is determined by the bottom of the component body, which includes the meniscus or any projections which support the component on the printed circuit board. The seating plane is a line parallel
43、to the abscissa through the bottom of the component body nearest the tape (see Figure 2, Dimension H). 4.7.2 For components with crimped (or otherwise preformed) leads, the seating plane depends on the profile of the crimp, the diameter of the leads and the hole size in the printed circuit board. Fo
44、r this reason, a reference plane is defined, for components with crimped leads only, as follows: The line parallel to the abscissa through the lowest center of the radius of curvature of the bending of the crimp. 4.8 Dimension H will increase as the component height, thickness, or diameter increases
45、. H dimensions outside the range shown in Table 1 may not function properly with all taping, placement or preforming machines. 4.9 ?h and ?p are the deviation between the actual center of the component, measured at the top of the component, and the theoretical centerline determined at its emergence
46、from the tape. ?h represents front- to-back deviation. ?p represents side-to-side deviation (see Figure 2). 4.10 Cumulative sprocket hole pitch tolerance shall not exceed 1.0mm over 20 consecutive pitches. 4.11 Splices shall be equal in strength to the original tape (15 newtons, minimum, break force
47、) and shall not hamper the transport or the cutting of the tape. When splicing is applied, the misalignment of the Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=HP Monitoring/1111111164 Not for Resale, 02/02/2009 22:06:46 MSTNo re
48、production or networking permitted without license from IHS -,-,- EIA-468-C 7 holes at each side of the splice shall not be more than 0.3mm in any direction. Splices shall not interfere with sprocket feed holes, nor shall the overall thickness (including lead wires) exceed dimension t1 (see Table 1). Staples shall not be used. 4.12 The hold-down tape shall not protrude beyond the carrier tape. No adhe