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1、 STDoEIA 7DOAOAE-ENGL 2000 3234b00 Ob40557 T35 Electronic Components, Assemblies, Equipment therefore, it is not recommended that the advanced grounding contacts be intentionally used as a current path in the power supply circuit. Testing was performed to simulate hot plugging of 20% of the total 50
2、0 matindunmating cycles with favorable results of no more than 32 milliohms change in contact resistance of the advanced grounding contacts. Example: Diagram of a 40 position connector on 2 ampere, 5 volt pins. F I XED /FREE Information on the availability of components qualified to this detail spec
3、ification is given in the qualified products list. Copyright Electronic Components, Assemblies see 3.7. 2.6.2 Basic type of terminations Table 6 - Termination types for fixed board (receptacle) connector I I I 1 Solder type termination to printed circuit board Through hole T O 1 TO2 TO3 TO4 TO5 Nomi
4、nal printed board thickness, mm (in) Termination tail length, mm (in) Copyright Electronic Components, Assemblies see 3.7. 2.7.2 Basic type of terminations I 1.14 t 0.13 (0.045 I 0.005) I so1 I I I - TO1 TO2 TO3 TO4 TO5 I 1.78 f 0.25 (0.070 2 0.010) 1 .OO t 0.15 (0.039 I 0.006) I 1.57 t O. 15 (0.062
5、 2 0.006) 2.36 t 0.15 (0.093 I 0.006) 3.18t0.15 (0.12510.006) 3.81 10.15 (0.15010.006) 1 .O0 f O. 13 (0.039 LC 0.005) 1.57 f 0.13 (0.062 I 0.005) Copyright Electronic Components, Assemblies see figure 32 and 33. Figure 8 - Side view fixed board (receptacle) (XB) right angle (RR or RE) Copyright Elec
6、tronic Components, Assemblies see figure 34 and 35. Figure 16 - Side view free board (plug) (EB) right angle (RR) Copyright Electronic Components, Assemblies and all other connectors to procedure 3, dip solder at 260 “C f 5 “C (500 “F f 9 OF). There shall be no physical damage and meet dimensional r
7、equirements. 4.1.6 Resistance to solvents Condition: EIA 364- 1 1, class I, subject unmated connectors to trichloroethylene. There shall be no physical damage and meet dimensional requirements. 4.2 Electrical 4.2.1 Withstanding voltage Condition: EIA 364-20, method B Between adjacent contacts of mat
8、ed and unmounted connec 4.2.2 Current vs temperature rise Conditions: EIA 364-70, method B ITS: 250 V ac at se Contact positions indicated in table 1 for the 80 position connector. Values at 75 degrees C are shown in the derating graph; see figure 47. 1 V 1 * o 20 40 60 ao 100 120 I AMBIENT TEMPERAT
9、URE. *C Figure 47 - Current vs temperature rise derating graph Copyright Electronic Components, Assemblies see figures 49 and 50. There shall be no discontinuities of 1 microsecond duration or longer. ENERGY 0 I RECTED THROUGH FIXTURE Figure 49 - Vibration and physical shock test fixture straight ty
10、pical ENERGY O I RECTED THROUGH FIXTURE I Figure 50 - Vibration and physical shock test fature right angle typical Copyright Electronic Components, Assemblies see figures 49 and 50. There shall be no discontinuities of 1 microsecond duration or longer. 5 Test schedule 5.1 General This test schedule
11、shows the tests and the order in which they shail be carried out as well as the requirements to be met. Unless otherwise specified, mated sets of connectors shall be tested. A mated set of connectors is called a ?specimen?. When the initial tests have been completed, all specimens are divided up acc
12、ording to the test groups. Care shall be taken to keep a particular combination of connectors together during the complete test sequence, i.e., when unmating is necessary for a certain test, the same connectors as before shall be mated for the subsequent tests. Before testing commences, the connecto
13、rs shall have been stored for at least 24 hours in the non- inserted state under normal climatic conditions for testing. In the following test sequence tables, where an EL4 test is specified without a letter suffix, the latest approved version of that test shall be used. Copyright Electronic Compone
14、nts, Assemblies see figure 48 500 cycles at maximum rate of 600 cycles per hour AP3 Durabi 1 i ty o9 Shock 27 30 g . peak accelerat- ion half sine i 1 ms 3 shocks applied along 3 mutually perpend- icular planes total 18 shocks; see figures 49 and 50. Continuity 46 46 No discontinuities of i ps or lo
15、nger duration, see note AP4 AP5 Vi bration 28 i 5-500-1 5 Hz random at a power spectral density of 0.02 G/Hz for I hr in each of 3 mutually perpendicular planes; see figures 49 and 50. Same as AP2 Continuity No discontinuities of 1 ps or longer duration, see note 15 milliohms max increase, see note
16、AP6 Low-level contact resistance 23 API Unmatinp force Copyright Electronic Components, Assemblies see figure 48 Low-level contact resistance BP2 Durability conditioning) (Pre- 09 1 O cycles at maximum rate of 600 cycles per hour BP3 Mixed flowing gas 65 Class II for 14 days mated BP4 Same as BPI Lo
17、w-level contact resistance BP5 Temperature life 17 105 “C for 1000 hours BP6 Low-level contact resistance Same as BPI BP7 Vibrati on 28 15-500- 15 Hz random at a power spectral density of 0.02 GZ/Hz for I hr in each of 3 mutually perpendicular planes; see figures 49 and 50. Continuity BP8 Same as BP
18、I Low-level contact resistance Copyright Electronic Components, Assemblies see figure 47 Same as BPI Low-level 23 , contact resistance Unmated connectors Visual and i8 dimensional inspection Examination 18 of dimensions and mass, and plating thickness 5.2.1.3 Test group BP - Temperature life, mixed
19、flowing gas, vibration and temperature rise versus current (continued) EIA 364 1 Test No. Test Ph= BP9 BP10 - BPI I Title Current vs temperature rise General examination Ta Tesi 70 EIA 364 I Test No. Severity or condition of test 1 Title Commen tslrequirements 2 A max. for two voltage applied contac
20、t positions, and 3 A max. for three voltage applied contact positions 15 milliohms max increase There shall be no defects that would impair normal operations Dimensions shall comply with this document Copyright Electronic Components, Assemblies all other specimens are dip soldered at 260 O C f 5 “C
21、(500 O F 2 9 “R Unmated connectors ;roup EP Measurement to be performed Title Visual and dimensional inspection EIA 364 Test No. 18 I NOTE - This test group is for solder tail contacts only and is not required for compliant Dins. Commentdrequirements There shall be no defects that would impair norma
22、l operations 5.2.1.7 Test group FP - Resistance to solvents Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 00:11:15 MDTNo reproduction or networking permitted w
23、ithout license from IHS -,-,- STDmEIA 700AOAE-ENGL 2000 - 3234b00 Ob40b28 015 _ -c -: _-_I ELA-700AOAE . Page62 AP 5 BP 5 CP 5 DP 5 EP 5 6 Quality assessment procedures 0. O O O O 6.1 Qualification approval testing EIA 364 Test No. Test phase Test or measurement to be Inspection as in 5.1 performed
24、per requirements and group seventies in 5. i AI PI Visual examination i8 C I DP Solderability 52 The following number of specimens shall be subjected to the tests under the conditions as specified in clause 5. The specimens shall meet the requirements with not more than the number of defectives perm
25、itted in accordance with the following table 18. Comments There shall be no defects that would impair normal operations. Number of terminals: d=2O Number of defectives: e = 1 teminal Table 18 - Qualification approval tests I I Performance levei PL 1 I Minimum numbei 01 SCXIIIIGIIS I per group I P 30
26、 I O I FP 5 I O I 6.2 Reinspection For inspection group C1 the number of specimensherminals shall be shown at “d“ and the number of defective terminals allowed shown at “e“. Connectors stored for a period of more than 36 months after the release of the lot shall be tested prior to delivery according
27、 to the table 19. Once a lot has been satisfactorily re-inspected, the quality is assessed for a further 36 months. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/20
28、07 00:11:15 MDTNo reproduction or networking permitted without license from IHS -,-,- STD*EIA 700AOAE-ENGL 2000 323Lib00 Ob40b29 T 5 1 M Document No. EIA Document Improvement Proposal Document Title: If in the review or use of this document, a potential change is made evident for safety, health or t
29、echnical reasons, please fill in the appropriate information below and mail or FAX to: Submitters Name: Electronic Industries Alliance Engineering Department - Publications Office 2500 Wilson Blvd. Arlington, VA 22201 FAX: (703) 907-7501 Telephone No.: FAX No.: e-mail: Signature: I Date: Address: Ur
30、gency of Change: Immediate: At next revision: 0 Problem Area: a. Clause Number and/or Drawing: b. Recommended Changes: c. Reasoflationale for Recommendation: I Additional Remarks: Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS
31、Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 00:11:15 MDTNo reproduction or networking permitted without license from IHS -,-,- STD-EIA 700AOAE-ENGL 2000 D 323Lib00 ObqOb30 773 D , Electronk Industries Alllance Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 00:11:15 MDTNo reproduction or networking permitted without license from IHS -,-,-