《BS-6221-1-1990 IEC-60326-1-1984.pdf》由会员分享，可在线阅读，更多相关《BS-6221-1-1990 IEC-60326-1-1984.pdf（12页珍藏版）》请在三一文库上搜索。
1、BRITISH STANDARD BS 6221-1: 1990 IEC 326-1: 1984 Printed wiring boards Part 1: Guide for the specification writer Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 This British Standard, having been prepared under the direction
2、of the Electronic Components Standards Policy Committee, was published under the authority of the Board of BSI and comes into effect on 28 February 1990 BSI 07-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment 89/23223 DC ISBN 0 580 1
3、8154 5 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the following bodies were represented: British Telecommunications plc Electrical and
4、 Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association ERA Technology Ltd. GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervis
5、ing Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association (TEMA) Amendments issued since publication Amd. No.Date of issueComments Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990
6、BSI 07-1999i Contents Page Committees responsibleInside front cover National forewordii 1Introduction1 2Scope1 3Object1 4Structure of standards and specifications1 5Levels of standards and specifications3 Publications referred toInside back cover Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 0
7、5 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 ii BSI 07-1999 National foreword This Part of BS 6221, prepared under the direction of the Electronic Components Standards Policy Committee, is identical with publication 326-1:1984, “Printed Boards, Part 1: General information for
8、 the specification writer”, published by the International Electrotechnical Commission (IEC). This publication refers to the IEC Quality Assessment System for Electronic Components (IECQ), but makes no reference to the corresponding European System of Quality Assessment or to the British System. Inf
9、ormation on these systems may be obtained by reference to BS CECC 23 000 and BS 9760 respectively. IEC 249-2:1970, to which reference has been made in the text, has been withdrawn and replaced by IEC 249-2, a new series of specifications published in 1988, which are currently being prepared for publ
10、ication as identical British Standards as Sections of BS 4584-102, to be published in 1990. IEC 194:1975 to which reference has been made in the text has been revised and reissued as IEC 194:1988. It is now subject to harmonization procedures in CENELEC and will depending on the result of these proc
11、edures be published as an identical new Group of British Standard, BS 4727-1:Group 10. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of i
12、tself confer immunity from legal obligations. Cross-references International standardCorresponding British Standard IEC 68BS 2011 Environmental testing (Most Parts are identical) IEC 97:1970BS 5830:1979 Specification for grid system for printed circuits (Identical) IEC 326BS 6221: Printed wiring boa
13、rds (Most Parts are identical) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 6, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in t
14、he amendment table on the inside front cover. Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 BSI 07-19991 1 Introduction IEC Publication 326 is applicable to printed boards, irrespective of their method of manufacture, when t
15、hey are ready for the mounting of the components. It is divided into separate parts covering information for the designer, recommendations for the specification writer, test methods and requirements for the various types of printed boards, for example single and double sided, multilayer and flexible
16、 printed boards. 1.1 Purpose of Part 1 This part contains general information on the structure of standards and specifications for printed boards including those necessary for printed boards under the IEC Quality Assessment System for Electronic Components (IECQ) and gives recommendations to the spe
17、cification writer on selecting and writing standards and specifications. 1.2 Associated IEC publications This standard shall be used in conjunction with the following IEC publications: 2 Scope This standard is applicable to printed boards, irrespective of their method of manufacture, and particularl
18、y to the standards and specifications necessary for printed boards. 3 Object To give recommendations to the specification writer on the selection and the preparation of the appropriate standards and specifications. 4 Structure of standards and specifications Printed boards may bc manufactured and ha
19、ndled: using conventional IEC standards. The manufacturer produces printed boards entirely independent from any influence or surveillance from any international or national organization. All technical and commercial details are agreed upon between manufacturer and user (or purchaser and vendor); und
20、er the IEC Quality Assessment System for Electronic Components (IECQ). The manufacturer must have a capability approval in accordance with the rules of the IECQ system which must be valid for the type of printed board under discussion. The approval will be granted by one of the national organization
21、s approved by the IECQ System; for example the National Supervising Inspectorate. The capability test programme is standardized. Quality conformance inspection of the printed board to be delivered can be chosen to purpose i.e. not below a standardized minimum programme. All technical details not sta
22、ndardized by the system and all commercial details are agreed upon between manufacturer and user (or purchaser and vendor). Both approaches (i.e. with conventional IEC standards and with standards for the IECQ System) require at least partly different standards and specifications. A comparative surv
23、ey of the standards and specifications and their classification into different levels is given in the table below. A detailed explanation of the levels, standards, and specifications is given in Clause 5. 68:Basic Environmental Testing Procedures. 97 (1970):Grid System for Printed Circuits. 194 (197
24、5):Terms and Definitions for Printed Circuits. 249-2 (1970):Base Materials for Printed Circuits, Part 2: Specifications. 326-2 (1976):Printed Boards, Part 2: Test Methods. 326-3 (1980):Part 3: Design and Use of Printed Boards. Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00
25、 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 2 BSI 07-1999 For printed boards not intended to be handled under the IECQ System any specification system might be used, in principle. It is however, recommended that the conventional IEC standards (and the international experience incorporated herei
26、n) be used. For printed boards under the IECQ system the IEC standards and the specification system have to be used in compliance with the rules of the IECQ System and with the special rules laid down in the generic specification for printed boards of assessed quality. Structure of standards and spe
27、cifications for printed boards Levels of standards or specifications Title content IEC publications for printed boards under the terms of conventional IEC standards under IECQ System General information General information for the specification writer 326-1 Design and use of printed boards 326-3 Art
28、work326- under consideration Rework, repair, modification326- under consideration Basic standard Test methods326-2 Generic standard Generic specification for printed boards within IECQ System not applicable326- under consideration Sectional standard Single/double sided printed boards with plain hole
29、s 326-4326- under consideration Single/double sided printed boards with plated-through holes 326-5326- under consideration Multilayer printed boards326-6326- under consideration Single/double sided flexible printed boards without through connections 326-7326- under consideration Single/double sided
30、flexible printed boards with through connections 326-8326- under consideration Rigid to flexible printed boards326- under consideration 326- under consideration Detail specification Capability Detail Specification (CapDS), i.e. sectional specification applied to a material, etc., with all details ne
31、cessary for testing capability not applicablesee Sub-clause 5.5.1 Customer Detail Specification (CDS) describing in full detail the particular printed board CDS number allocated in the customers own numbering system NOTEThe number of the IEC publication is intended to include all published amendment
32、s and supplements, if any. Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 BSI 07-19993 5 Levels of standards and specifications 5.1 General information There are several IEC publications containing general information. These
33、publications apply to printed boards irrespective of any standards, specifications or handling system. IEC Publication 326-3 is a standard and contains fundamental information on the design and the application of printed boards, their technical limitations and the main characteristics which can norm
34、ally be obtained and expected. It is intended to give guidance to the designer and the user of printed boards and to the specification writer who should specify the requirements within the limitations and descriptions given in IEC Publication 326-3. IEC Publication 326-. is a report and contains inf
35、ormation on the artwork necessary to order and to manufacture printed boards. It applies to the artwork in the final stage irrespective of the method of its preparation. It should be noted, however, that computer-aided design (CAD) methods and relevant matters, for example computer languages, are no
36、t covered by this report. IEC Publication 326-. is a report and contains information on rework, repair, and modification. It lists defects experienced in practice and gives illustrations of possible methods of rectification. Although this publication is primarily intended to apply to printed boards,
37、 it may well be applied to repair and modification of printed board assemblies also. The specification writer may be concerned since agreement between manufacturer and user may be necessary for certain features. 5.2 Basic standard IEC Publication 326-2 is a catalogue of test methods. It describes te
38、st methods and procedures including environmental conditioning for printed boards. The specification writer has to select the tests to be applied (if applicable in accordance with the relevant sectional standards), to define the test conditions where necessary and to specify the requirements to be f
39、ulfilled. This standard applies irrespective of the printed board being handled under the terms of conventional IEC standards or under the IECQ System. 5.3 Generic standard IEC Publication 326-. applies to printed boards under the IECQ System only. This is a necessary standard in the IECQ System whe
40、re it has to be followed. There is no equivalent for printed boards handled under the terms of conventional IEC standards. The publication contains the conditions for the application of the IECQ System on printed boards, details of the capability approval procedure including maintenance of capabilit
41、y approval, general details of the quality conformance inspection as basis for the sectional and detail specifications and it gives rules for the preparation of detail specifications. 5.4 Sectional standards 5.4.1 Conventional IEC standards At present, the following IEC publications are available: F
42、urther publications, for example for rigid-to-flexible printed boards, are under consideration. These publications contain fundamental information on characteristics listed and subdivided into two categories (basic and additional characteristics), make reference to the test methods to be used to ver
43、ify these characteristics and specify conditions of test and requirements to be met as far as they are generally applicable and not depending on the particular design of a printed board. Customer detail specifications for particular printed boards should be based on the appropriate standard of this
44、series. Publication 326-4 (1980):Printed Boards, Part 4: Specification for Single and Double Sided Printed Boards with Plain Holes. Publication 326-5 (1980):Part 5: Specification for Single and Double Sided Printed Boards with Plated-through Holes. Publication 326-6 (1980):Part 6: Specification for
45、Multilayer Printed Boards. Publication 326-7 (1981):Part 7: Specification for Single and Double Sided Flexible Printed Boards without Through Connections. Publication 326-8 (1981):Part 8: Specification for Single and Double Sided Flexible Printed Boards with Through Connections. Licensed Copy: sheff
46、ieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 4 BSI 07-1999 5.4.2 Standards for printed boards under IECQ System At present, the following IEC publications are under consideration: Further publications, for example for rigid-to-flexible printed
47、 boards, will be prepared when the relevant publications in Sub-clause 5.4.1 are available. These publications contain the same fundamental information on characteristics, tests, etc., as the publications listed in Sub-clause 5.4.1, either directly or by reference to the relevant publication of Sub-
48、clause 5.4.1. Additionally, they contain the necessary information on the capability test programme and on quality conformance inspection of the printed boards to be delivered. The standardized test patterns, already shown as non-compulsory examples in the publications of Sub-clause 5.4.1, become he
49、re a mandatory part of the capability test programme. The capability detail specification (CapDS) has to be based on the relevant standard of this series while the customer detail specification (CDS) for a particular printed board should make use of the relevant standard of this series as much as possible. 5.5 Detail specifications 5.5.1 Capability Detail Specification (CapDS) The CapDS is an essential part of the IECQ System. There is no equivalent for printed boards not intended to be handled under the IECQ System. The CapDS may be prepared by IEC, by a national organi