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1、微电子技术发展趋势（Development trend of microelectronic technology）This article is contributed by wgzhzhbPpt documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view.Development trend and application of microelectronic
2、technologyHunan Vocational College of Technology Trade academic Lecturer: Li ZhongchunDevelopment trend of microelectronic technologyMicroelectronic technology is one of the fastest growing technologies in the world. Microelectronic technology is one of the fastest growing technologies in the world.
3、 It is the basis and heart of the electronic information industry. The foundation and heart of the electronic information industry. The development of microelectronics technology has greatly promoted the aerospace technology, remote sensing technology, greatly promoted the communication of aerospace
4、 technology, remote sensing technology, technology, computer technology, network technology, technology, the rapid development of computer technology, network technology, automotive electronics and household appliances industry. The rapid development of household appliances and other industries. The
5、 development and application of micro electronic technology almost make modern warfare become information warfare and electronic warfare. And application, almost make modern warfare become information warfare and electronic warfare. In China, the electronic information industry has been listed as a
6、pillar industry of the national economy. Today, microelectronics has become a measure of a state pillar industry. Today, scientific and technological progress and an important symbol of overall national strength. An important symbol of scientific and technological progress and overall national stren
7、gth.Integration is the core of microelectronic technology, the integration of electronic industry, IC is the core of microelectronic technology, and the grain of grain, the core of microelectronic technology. The integrated circuit has been developed to large scale and very large scale and deep subm
8、icron (0.25um) precision and scale, and very deep submicron (precision and integration level of millions of transistors, now the integration level of millions of transistors, electronic systems on a chip. The electronic system is thought to be integrated on a single chip. It is believed that the dev
9、elopment and application of micro electronics have led to the third industrial revolution in the world. The three industrial revolution.In 1965, the chairman of Inter, chairman of Gorden Moore years in the research on the chairman of the company on the memory chip transistor growth in the number of
10、rounds per time over 1824 months, chip integration doubled. Every month, the chip integration has doubled. This relationship is called Moores Law (the relationship, known as the Moores Law (Moores Law), has been in use ever since. To this day. The first is the limitation of enterprise funds. The fir
11、st is the limitation of enterprise funds. With the increase of chip integration, production cost increases exponentially with the increase of chip integration. The cost of production is almost exponential. Second, physical limitations, followed by physical constraints, arise when chip designs and pr
12、ocesses enter atomic levels. Problems arise at the atomic level.Gorden, Moore (Moore) Moore) MooreDRAM (dynamic random storage) production equipment, every update dynamic random storage) dynamic random storage generation, the investment cost will be increased by 1.7 times, known as the V3 rule rule.
13、 Generation, the cost of investment will increase by twice, known as the law. At present, the construction of a monthly production of 50 million million 16MDRAM production line, the production line, before the construction of a production line of 10000 yuan, at least $1 billion, according to this, $
14、100 million. Needs at least $100 million. Accordingly, 64MDRAM production line production line will be $1 billion 700 million billions of dollars, the production line will need 2 billion 900 million US $256MDRAM billion U.S. production line production line to the production line needs nearly $5 bill
15、ion yuan, 1G production line needs nearly billion. The production line will cost almost $100 million.As for the physical limitations, it is generally believed that the circuit linewidth of 0.05um, as for physical limitations, it is generally believed that the circuit linewidth to achieve the device
16、will encounter serious problems. From the point of view of the development of integrated circuit, the device will encounter serious problems. From the point of view of the development of integrated circuits, the line width will be multiplied by a constant constant of 0.7 per second. Further forward,
17、 the line width will be multiplied by a constant. That is: if the 0.25um is regarded as the next generation technology, then a few years later a new generation of products will be seen as the next generation technology, as the next generation technology to achieve 0.18um (0.25um * 0.7), a few years
18、will reach (x, 0.13um. One by one, and then again. By analogy, the two or three and two or three generations of integrated circuits reach 0.05um. Each generation needs about. It will take about 3 years or so. About a year or so.For decades, integrated circuit (IC) technology has been developing at a
19、n extremely high rate for decades. The famous Moore rule states that,The degree of integration of the degree of integration (degree development). The famous Moore rule pointed out that the integration of each microelectronic chip on IC integrated device number),), per year for the generation of year
20、s for the generation of microelectronic chip, integrated device number), every 3 years or so for a generation, each generation of quadruple. The characteristic line width in the IC fabrication process is often quadrupled. Corresponding to the characteristic line width in the fabrication process, eac
21、h generation is reduced by 30%. According to the principle of scaling, the narrower the characteristic lines, the smaller the generations. According to the principle of scaling, the narrower the characteristic line, the faster the IC works, and the lower the power consumed by the unit function. The
22、faster the work is done, the lower the power consumed by the unit function. Work faster with each generation, development of each generation and development of IC not only makes not only the integration of integration to improve, improve, but also the speed, power and reliability) can (speed, power
23、and reliability) greatly improved. Greatly improved.With the improvement of IC machining accuracy, the processing silicon wafer size, machining accuracy improved, while processing accuracy improved at the same time is increasing, the production of silicon wafers are also increasing. As they continue
24、 to grow, the number of silicon wafers is increasing. These led to the development of microelectronic products and a wonderful landscape; these led to the development of microelectronic products and a wonderful landscape at the same time integration from generation to generation to improve the perfo
25、rmance of the chip, at the same time integration from generation to generation to improve the performance and function of the chip is increasing, but the price is falling. The phenomenon is deepening and prices are falling. The significance is that, with the rapid development of microelectronics tec
26、hnology, the significance lies in the fact that, with the rapid development of microelectronics technology, all electronic products (computers, all electronic products (computers, communications and consumer electronics etc.) communication and consumer electronic products etc.) also accelerate the u
27、pgrading and accelerate the upgrading; silicon;WaferNot only the performance, a new generation of product function significantly more than the previous generation, not only the performance, a new generation of product function significantly more than the previous generation, but the price is more an
28、d more cheap for the electronic information technology advancing machine rapid popularization and application to various fields to create the conditions to promote the rapid promotion of the machine is applied to each field created the human condition, lead to the arrival of the information society.
29、 Lead to the arrival of human information society. Because of the larger integrated circuit gate length decreases and the degree of integration, the length of the reducing and the integration increases, so it is important to develop the technology of making, namely lithography, oxidation and diffusi
30、on of technology, manufacturing technology, namely lithography, oxidation and diffusion of technology, multilayer wiring technology and capacitor material technology. Technique.LithographyLithography uses wavelength to utilize 436nm wavelengths of light to form sub micron size patterns, light to for
31、m submicron patterns, and light to produce DRAM of integrated 1M bits and bits. I ray (wave) creates the integration bit and the 4M bit. Ray (ray and a long exposure equipment after the advent of 365nm), can form a half micron scale) after the advent of exposure equipment, inch and deep submicron si
32、ze graphics, making 16M bits and bits and 64M inch and deep submicron size graphics, and manufacturing out of the DRAM. Bit. At present, the currently used? Lithography lithography equipment KrF excimer laser has cast excimer laser has been put into practical, can form a 1/4 micron size graphics int
33、o practical, can form 1/4 micron size graphics, making 64M DRAM. Use a shorter wavelength to create bits. With shorter wavelength ArF laser, laser lithography equipment has also been put into practical use. Of course, lithography equipment has also been put into practical use. Of course, in order to
34、 achieve this goal, it is necessary to develop a suitable mask forming technique and photoresist material. Glue material.Research and development work of X ray lithography equipment, research and development work has been carried out phase ray lithography, X-ray lithography equipment research and de
35、velopment work of the time, the electron beam lithography and 3nm vacuum ultraviolet exposure time, electron beam lithography and vacuum ultraviolet ray exposure technology, which is also active in the development. A technology will light technology, but also a positive development, first put into p
36、ractical and become the mainstream technology of the next stage, first put into practical and become the mainstream technology of the next stage, it is Theres no telling. Theres no telling。Etching techniqueIn the high density integrated circuit manufacturing process, the oxide film, in high density
37、integrated circuit manufacturing process, etching of polysilicon and metal oxide film, wiring, wiring and polysilicon etching technology with the characteristics of metal,The shrinking of size will become more and more difficult. The shrinking of size will become more and more difficult. ? obviously
38、, if can develop a uniform obviously, planar high density plasma source technology, the planar high density plasma source technology will obtain more ideal etching effect. A more ideal etching effect. ? using CER (electron cyclotron resonance) or plasma source (electron cyclotron resonance) plasma s
39、ource or ICP inductively coupled plasma) high density plasma source (inductively coupled plasma) high density plasma source, and with the special gas (with special gases (such as HBr) and electrostatic chuck (Yong and electrostatic chuck (in the precision temperature control) technology combined in
40、precision temperature control) technology, can meet the requirements of circuit etching processIn order to ensure the good quality of crystal at low cost, diffusion oxidation technology must be adopted to ensure the good quality of crystal at low cost and to extend the growth technology. The reason
41、is that the growth technique is delayed. The reason is that, compared with the cost of quality assurance in crystal making, the cost of epitaxial growth technology is much lower than that required for quality assurance. The cost is much lower. ? the technical level of ion implantation has been great
42、ly improved, it will be the technical level of ion implantation has been greatly improved, MeV (MeV) high energy ion implantation crystals (MeV) of several micrometers depth. The gas diffusion method up to now is up to a few microns in depth. The gas diffusion method used so far requires diffusion o
43、f impurities at high temperature for a long time to form a diffusion layer. High temperature diffusion of impurities in a long time to form a diffusion layer. But now the use of ion implantation technology, using the technology of ion implantation, respectively the impurities are implanted into any
44、position, again by a low temperature heat treatment to any location, again by a low temperature heat treatment, they can achieve the same results. Same result.At the same time, technology has made great progress, low energy ion implantation at the same time, technology has made great progress in low
45、 energy ion implantation, diffusion layer to form a shallow depth of less than 0.1um, and the precision of phase to form a shallow depth is less than the diffusion layer, the light diffusion layer when the high. In addition, the oblique ion implantation technology has also made great progress. In ad
46、dition, the oblique ion implantation technology also has great progress, can be injected into the impurities in any position, can be injected into the impurities in any position, and under the condition of low temperature in accordance with the design requirements, according to the design requiremen
47、ts, complete the impurities determines performance of transistor diffusion process operation. Batch operation. The solid phase diffusion method is used to make the source shallow drain and the junction is very effective. The shallow junction of 35nM has been obtained. A shallow knot that has been ef
48、fectively obtained. Shallow knotMicroelectronic technology in the future application of light weapons? In todays world, a wave of high-tech to promote this century chariot, legitimate world, a wave of high-tech driven century chariot, into a new era of rapid. Flying into a whole new era. All kinds o
49、f traditional weapons have undergone revolutionary changes under the baptism of high technology. The apparatus has undergone revolutionary changes under the baptism of high technology. In many high technology, microelectronic technology is at the top of the list. In many high technology, microelectronic technology is at the top of the list. Microelectronic technology is the technology of miniaturization of electronic components and electronic devices composed of them, and the core is the