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1、BRITISH STANDARD BS EN 123100:1992 Incorporating Amendment No. 1 BS CECC 23100:1989 renumbered Harmonized system of quality assessment for electronic components Sectional specification: Single and double sided printed boards with plain holes The European Standard EN 123100:1992 has the status of a B
2、ritish Standard ICS 31.180 Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123100:1992 This British Standard, having been prepared under the direction of the Electronic Components Standards Policy Committee, was published under the aut
3、hority of the Board of BSI and comes into effect on 29 September 1989 BSI 05-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment 86/31648 DC ISBN 0 580 17481 6 Committees responsible for this British Standard The preparation of this Bri
4、tish Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19, upon which the following bodies were represented: British Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Com
5、ponents Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Man
6、ufacturing Association (TEMA) Amendments issued since publication Amd. No.Date of issueComments 7358November 1992 9250September 1996 Indicated by a sideline in the margin Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123100:1992 BSI
7、05-1999i Contents Page Committees responsibleInside front cover National forewordii Foreword2 Text of EN 1231005 Publications referred toInside back cover Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123100:1992 ii BSI 05-1999 Natio
8、nal foreword This British Standard has been prepared under the direction of the Electronics Components Standards Policy Committee. It is identical with CENELEC Electronic Components Committee (CECC) 23100:1985 “Harmonized system of quality assessment for electronic components: Sectional specificatio
9、n: Single and double sided printed boards with plated through holes”. This standard is a harmonized specification within the CECC system and should be read in conjunction with BS CECC 23000. In 1992 the CENELEC Electronic Components Committee (CECC) accepted CECC 23100:1985 as European Standard EN 1
10、23100:1992. Cross-references. The British Standard which implements CECC 00100 is BS 9000 “General requirements for a system for electronic components of assessed quality” Part 2: “Specification for national implementation of CECC basic rules and rules of procedure”. There is no British Standard equ
11、ivalent to CECC 00010:1980 which comprises only a list of the tests in IEC 326-2 and its supplement IEC 326-2A. The Technical Committee has reviewed the provisions of IEC 194:1975, IEC 321:1970 and IEC 326-3:1980 to which reference is made in the text, and has decided that they are acceptable for us
12、e in conjunction with this standard. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Inte
13、rnational standardCorresponding British Standard CECC 23000:1985BS CECC 23000:1989 Harmonized system of quality assessment for electronic components: Generic specification: Printed boards (Identical) IEC 68BS 2011 Basic environmental testing procedures (Most Parts are identical) IEC 249BS EN 60249 B
14、ase materials for printed circuits (Most Parts are identical) BS 6221: Printed wiring boards IEC 326-2:1976Part 2:1982 Methods of test (Technically equivalent) IEC 326-4:1980Part 4:1982 Method for specifying single and double sided printed wiring boards with plain holes (Identical) Summary of pages
15、This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 20, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the in
16、side front cover. Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123100 May 1992 + A1 August 1995 ICS 31.180 Descriptors: Printed boards, single and double sided, plain holes, test specim
17、ens, capability test, quality conformance inspection, test patterns English version Sectional Specification: Single and double sided printed boards with plain holes (includes amendment A1:1995) Spcification intermdiaire: Cartes imprimes simples et doubles faces trous mtalliss (inclut lamendement A1:
18、1995) Rahmenspezifikation: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten ohne metallisierte Lcher (enthlt nderung A1:1995) This European Standard EN 123100:1992 was approved by the CENELEC Electronic Components Committee (CECC) on 1995-07-04. CENELEC members are bound to comply wi
19、th the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretar
20、iat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the
21、official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotec
22、hnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1995 Copyright reserved to CENELEC members Ref. No. EN 123100:1992 + A1:1995 E Licensed Copy: sheffieldun sheffieldun, na,
23、Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123100:1992 BSI 05-1999 2 Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized
24、 System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conf
25、ormity. The components produced under the System are thereby accepted by all member countries without further testing. This specification has been formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized SECTIONAL SPECIF
26、ICATIONS FOR SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES. It should be read with the current regulations for the CECC System. At the date of printing of this document the member countries of the CECC are Austria, Belgium, Denmark, Finland, France, Germany, Ireland, Italy, the Netherlands
27、, Norway, Portugal, Spain, Sweden, Switzerland, and the United Kingdom, and copies of it can be obtained from the addresses shown on the blue fly sheet. Preface This Sectional Specification was prepared by CECC Working Group 23: Printed Circuits. It is based on publications of the International Elec
28、trotechnical Commission (IEC). The text of this specification was circulated to the CECC for voting in the documents indicated below and was ratified by the President of the CECC for printing as a CECC Specification. SECRETARIAT NOTE: DUE TO THE URGENT INDUSTRIAL NEED FOR THIS SPECIFICATION, THE PRE
29、SIDENT OF THE CECC HAS RULED THAT IT BE PUBLISHED WITHOUT THE FULL EDITORIAL PROCEDURE BEING APPLIED. USERS OF THE SPECIFICATION ARE ASKED TO REPORT TO THE CECC GENERAL SECRETARIAT ANY ERRORS THEY FIND SO THAT AMENDING ACTION CAN BE INITIATED. The text is published initially in English and German. T
30、he French version will follow as soon as it has been prepared. Foreword to amendment A1 This amendment was prepared by CLC/TC CECC/WG 23. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as amendment A1 to EN 123100:1992 on 1995-07-04. The following
31、dates were fixed: SchriftstckeDate of Voting Report on the Voting CECC(Secretariat) 1052/1052A November 1981CECC(Secretariat)1250 CECC(Secretariat) 1547 August 1984CECC(Secretariat)1621 latest date by which the amendment has to be implemented at national level by publication of an identical national
32、 standard or by endorsement(dop) 1996-07-01 latest date by which the national standards conflicting with the amendment have to be withdrawn(dow) 1996-07-01 Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123100:1992 BSI 05-19993 Contents
33、Page Foreword2 Preface2 1Introduction5 1.1Scope and object5 1.2Related documents5 2General5 3Test specimens5 3.1Capability approval5 3.2Quality conformance inspection6 4Relevant specification6 5Characteristics of printed boards6 6Capability test programme13 7Quality conformance inspection14 8Test pa
34、tterns18 8.1Application of test patterns and test boards18 8.2Composite test pattern (CTP)18 8.3Multiple arrangements of the CTP18 Figure 1 Length of defect17 Figure 2 Composite test pattern20 Table I Basic characteristics7 Table II Additional Characteristics (to be assessed only when specifically r
35、equired)12 Table III14 Table IV15 Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 4 blank Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123100:1992 BSI 05-19995 1 Introduction I
36、EC 326-4 is the IEC-Standard for single and double sided printed boards with plain holes. The following document comprises this IEC-Standard and in accordance with the generic specification CECC 23 000 the information additionally necessary for printed boards intended to be handled within the CENELE
37、C system for Electronic Components of Assessed Quality. 1.1 Scope and object This document is a Sectional Specification (SS) relating to single and double sided printed boards with plain holes irrespective of their method of manufacture, when they are ready for mounting of the components. It defines
38、 the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents IEC 68, Basic environmental testing procedures. IEC 194, Terms and definitions for printed circuits.
39、IEC 249, Metal-clad base materials for printed circuits. IEC 321, Guidance for the design and use of components intended for mounting on printed boards. IEC 326-2, Printed boards test methods. IEC 326-3, Design and use of printed boards. IEC 326-4, Specification for single and double sided printed b
40、oards with plain holes. CECC 00 010, Printed boards test methods. CECC 23 000, Generic Specification Printed boards of assessed quality. 2 General This Sectional Specification (SS) applies to single and double sided printed boards with plain holes and is intended as a basis for the preparation of Ca
41、pability Detail Specification (Cap DS) applying to specific materials, e.g. according to IEC 249-2, and to be used for capability approval procedures. It may be necessary to have a Cap DS for each type of material. A Cap DS may be prepared by an international or a national body or by a manufacturer
42、(see also CECC 00 111). Customer Detail Specification (CDS) for the custom built printed boards, according to 5 of CECC 23 000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in CECC 23 000 and in CECC 00 107 Part III. Ta
43、ble I contains the basic characteristics that will normally be important for single and double sided printed boards with plain holes and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be important for certain single
44、 and double sided printed boards with plain holes and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from this Table II. Where additional details for a test have to
45、be specified in the relevant specification, this is indicated by an asterisk in the relevant column. These details shall then be specified in accordance with CECC 00 010 (IEC 326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as capability qual
46、ifying component. Table IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence, the tests may be carried out in any sequence, unless otherwise specified. 3 Test specimens 3.1 Capability Approval 3.1.1 Basic Capability The test sha
47、ll be carried out on the composite test pattern given in 8. 3.1.2 Additional Capability 3.5.3 of CECC 23 000 shall apply. For multiple arrangements see also 8. 3.1.3 Maintenance of Capability Approval 3.8 of CECC 23 000 shall apply. Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 07:17:08 GMT
48、+00:00 2006, Uncontrolled Copy, (c) BSI EN 123100:1992 6 BSI 05-1999 3.2 Quality conformance inspection Unless otherwise specified production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Where specially designed tes
49、t patterns shall be used they may be included in the panel. They may be based on the appropriate pattern of the composite test pattern clause 8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “Relevant Specification” means a product specification for an actual printed board, i.e. a CDS as well as a Cap DS applied to a specific material and technique, as applicable. The relevant specification shall contain all information necessary to define the printed board clearly and completely.